WLCSP Electroless Plating Global Market Report 2024

The wlcsp electroless plating market size has grown rapidly in recent years. It will grow from $2.22 billion in 2023 to $2.45 billion in 2024 at a compound annual growth rate (CAGR) of 10.3%. The growth in the historic period can be attributed to the expansion of the semiconductor industry, trends toward miniaturization in electronic devices, increasing demand for consumer electronics, advancements in automotive electronics, and the rise of high-performance computing.

The wlcsp electroless plating market size is expected to see rapid growth in the next few years. It will grow to $3.61 billion in 2028 at a compound annual growth rate (CAGR) of 10.2%. The projected growth in the forecast period is driven by advancements in automotive electronics, the integration of 5G technology, the growth of IoT devices, increasing demand for wearables, the expansion of AI devices, and the emphasis on energy-efficient electronics. Major trends expected in this period include a focus on high-speed and high-frequency applications, a growing demand for enhanced thermal management solutions, the rise in 5G technology implementation across industries, customization of electronics for specific industry requirements, and an increased focus on environmental sustainability in electronic devices.

The primary impetus behind the burgeoning growth of the WLCSP electroless plating market stems from the increasing demand for circuit miniaturization and the proliferation of microelectronic devices. Electronics miniaturization encompasses a range of design methodologies aimed at reducing the size of electronic components within devices, enhancing density, and sometimes reconfiguring their layout to decrease the overall number of elements. WLCSP electroless plating plays a pivotal role in facilitating circuit miniaturization and the development of microelectronic devices by providing superior shielding compared to traditional plating processes while also being cost-effective. For instance, in 2021, the U.S. Department of Energy, a federal executive department, allocated approximately $54 million for the initiation of 10 new projects led by the department's national laboratories. These projects are geared towards enhancing energy efficiency in the design and production of microelectronics. Hence, the escalating demand for circuit miniaturization and the expansion of microelectronic devices stands as the driving force propelling the growth of the WLCSP electroless plating market.

The anticipated surge in the WLCSP (wafer-level chip-scale package) electroless plating market is propelled by the global escalation in electronics manufacturing. Electronics manufacturing involves the large-scale production of electronic components, devices, and systems. The heightened global activity in electronics manufacturing, driven by consumer electronics, communication devices, and industrial applications, finds support in electroless plating. This process facilitates precise bump formation, underfill encapsulation, and passivation, enabling the creation of dependable, high-performance WLCSP packages for a diverse array of electronic applications. For example, as reported by Earthweb Inc. in February 2023, Lenovo, the world's largest PC seller, recorded sales of approximately 17 million computers in the third quarter of 2022. This figure surpasses HP's 12.71 million, Apple's 5.80 million, and Dell's 12.02 million shipments. Hence, the global upswing in electronics manufacturing remains the driving force behind the growth of the WLCSP electroless plating market.

Product innovation is a significant trend in the WLCSP (Wafer-Level Chip Scale Package) electroless plating market, with major players focusing on developing new products to enhance their position. For example, in January 2023, TWI Ltd., a UK-based technology engineering company, introduced an electroless nickel-phosphorus plating (ENP) composite coating. ENP coating finds applications in various sectors such as aviation, oil and gas, geothermal energy, construction, and electronics due to its exceptional mechanical and tribological properties, including high hardness, wear resistance, and corrosion resistance. The resilience to damage and deterioration, as well as antifouling and anti-scaling properties of ENP coatings, can be controlled by modifying the microstructure through methods such as altering the alloy chemistry (e.g., phosphorus concentration, including nanoparticles) and post-plating heat treatment. Additionally, nanoparticles can enhance coating properties such as hydrophobicity, hardness, wear resistance, and low coefficient of friction (CTE).

Leading companies in the WLCSP (wafer-level chip scale package) electroless plating market are concentrating on expanding their facilities to better cater to the needs of their existing consumers. A manufacturing facility is a building or complex where raw materials are transformed into finished goods. For example, in October 2023, Amkor Technology, Inc., a US-based company specializing in WLCSP electroless plating, revealed plans for the construction of a new facility in Vietnam. This Vietnam campus is set to become Amkor's largest factory, covering an extensive 57-acre area within the Yen Phong 2C Industrial Park. Amkor has allocated an investment of US$1.6 billion for the first two phases of the project, which includes facilities, machinery, and equipment. This significant investment in manufacturing in Vietnam will enable Amkor to offer an unparalleled geographic footprint to its clients, serving both global and regional supply chains. It will provide the secure and reliable supply chain that clients in communications, automotive, high-performance computing, and other critical sectors seek.

In January 2023, LB Semicon, a South Korea-based semiconductor chip manufacturing company, acquired the VertaCure XP G2 system from Yield Engineering Systems, Inc. for an undisclosed sum. This acquisition was aimed at enhancing LB Semicon's capabilities in the bump/RDL application for wafer-level chip-scale packaging (WLCSP). The VertaCure XP G2 system is known for its improved throughput, excellent particle performance, and comprehensive PI/PBO curing capabilities, all of which are attributed to its established vacuum-based method. Yield Engineering Systems, Inc., based in the US, specializes in manufacturing equipment that supports wafer-level chip-scale packaging.

Major companies operating in the wlcsp electroless plating market report are Heraeus Holding GmbH, DuPont de Nemours Inc., Olin Corporation, Rockwell Automation Inc., Shanghai Aiko Chemical Co. Ltd., Nova Chemicals Corporation, MKS Instruments Inc., MacDermid Inc., Shikoku Chemicals Corporation, Atotech Deutschland GmbH, Nihon Parkerizing Co. Ltd., C. Uyemura & Co. Ltd., Enthone Inc., Nippon Seisen Kogyo Co. Ltd., Coventya International GmbH, Park Chemical Corporation, Allied Finishing Inc., Nanophase Technologies Corporation, Precision Plating Co., ERIE PLATING COMPANY, Harwick Standard Distributors Inc., KC Jones Plating Company, ARC Technologies Inc., Klein Plating Works Inc., Bales Metal Surface Solutions, Peninsula Metal Finishing Inc., Okuno Chemical Industries Co. Ltd., Bajaj Electroplaters Private Limited, Electroless Nickel Inc., Plating Specialties Inc., Surface Technology Inc., Umicore N.V., Uyemura Kogyo Co. Ltd., VATEC Co. Ltd.

Europe was the largest region in the WLCSP electroless plating market in 2023. Asia-Pacific is expected to be the fastest-growing region in the WLCSP electroless plating market report during the forecast period. The regions covered in the wlcsp electroless plating market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. The countries covered in the wlcsp electroless plating market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

In the WLCSP (wafer-level chip-scale packaging) electroless plating market, the main types of plating are nickel, copper, composites, and others. Nickel is a lustrous silvery-white metal used to protect parts from natural wear, abrasion, and corrosion. It finds applications in corrosion resistance, wear resistance, appearance enhancement, solderability improvement, and other areas requiring enhanced conductivity. Industries that utilize nickel electroless plating include automotive, electronics, aerospace, machinery, and others.

The WLCSP electroless plating market research report is one of a series of new reports that provides WLCSP electroless plating market statistics, including WLCSP electroless plating industry global market size, regional shares, competitors with a WLCSP electroless plating market share, detailed WLCSP electroless plating market segments, market trends and opportunities, and any further data you may need to thrive in the WLCSP electroless plating industry. This WLCSP electroless plating market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The WLCSP electroless plating market consists of revenues earned by entities by providing WLCSP electroless plating services such as layout & mask tooling, wafer RDL patterning and bumping (ball sphere loaded or plated), automated optical inspection (AOI) for quality assurance and wafer map generation. The market value includes the value of related goods sold by the service provider or included within the service offering. Only goods and services traded between entities or sold to end consumers are included.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.