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System-in-Package (SiP) Technology - Global Market Trajectory & Analytics

  • ID: 2255359
  • Report
  • July 2020
  • Region: Global
  • 390 Pages
  • Global Industry Analysts, Inc
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Global System-in-Package (SiP) Technology Market to Reach $34 Billion by 2027

Amid the COVID-19 crisis, the global market for System-in-Package (SiP) Technology estimated at US$21.4 Billion in the year 2020, is projected to reach a revised size of US$34 Billion by 2027, growing at a CAGR of 6.8% over the analysis period 2020-2027. 2-D IC Packaging, one of the segments analyzed in the report, is projected to record a 6.6% CAGR and reach US$18.4 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 2.5-D IC Packaging segment is readjusted to a revised 6.8% CAGR for the next 7-year period.

The U.S. Market is Estimated at $5.8 Billion, While China is Forecast to Grow at 10.5% CAGR

The System-in-Package (SiP) Technology market in the U.S. is estimated at US$5.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$7.4 Billion by the year 2027 trailing a CAGR of 10.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.7% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.4% CAGR.

3-D IC Packaging Segment to Record 7.6% CAGR

In the global 3-D IC Packaging segment, USA, Canada, Japan, China and Europe will drive the 7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$3.2 Billion in the year 2020 will reach a projected size of US$5.2 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4.6 Billion by the year 2027, while Latin America will expand at a 9% CAGR through the analysis period. We bring years of research experience to this 15th edition of our report. The 390-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.

Competitors identified in this market include, among others:
  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technologies Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Si2 Microsystems Private Limited
  • STATS ChipPAC Ltd.

The global analysis and forecast periods covered within the report are 2020-2027 (Current & Future Analysis) and 2012-2019 (Historic Review). Research estimates are provided for 2020, while research projections cover the period 2021-2027.
Note: Product cover images may vary from those shown
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I. INTRODUCTION, METHODOLOGY & REPORT SCOPE

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology

Recent Market Activity

Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market

Developing Countries Offer Growth Prospects

Flip Chip Type of Interconnection Technology Leads SiP Technology Market

Consumer Electronics Sector Fuels Revenue Growth in SiP Market

Portable Electronic Devices Stir Demand for Flat Packaging

2.5D IC Packaging Technology Dominates SiP Market

Challenges Confronting the SiP Market

Global Competitor Market Shares

System-in-Package (SiP) Technology Competitor Market Share Scenario Worldwide (in %): 2020 & 2029

Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

Amkor Technology, Inc. (USA)

ASE Group (Taiwan)

ChipMOS Technologies Inc. (Taiwan)

Fujitsu Limited (Japan)

GS Nanotech (Russia)

Insight SiP (France)

Intel Corporation (USA)

Jiangsu Changjiang Electronics Technology Co. Ltd. (China)

Kulicke & Soffa Pte Ltd. (Singapore)

Nanium S.A. (Portugal)

O.C.E. Technology Ltd. (Ireland)

Powertech Technologies, Inc. (Taiwan)

Renesas Electronics Corporation (Japan)

Samsung Electronics Co., Ltd. (South Korea)

ShunSin Technology (Zhongshan) Limited (China)

Si2 Microsystems Private Limited (India)

Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)

STATS ChipPAC Ltd. (Singapore)

Unimicron Corporation (Taiwan)

3. MARKET TRENDS & DRIVERS

Importance of SiP Technology in Electronics

Rising Demand for High Performance and Compact Consumer Electronics Drive Growth

List of Select SiP Solutions for Connected Devices

Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP

Growing Sales of Smartphones Bode Well for SiP Market

Growing Demand for Tablet PCs - A Key Growth Driver

Applications in Set Top Boxes Boosts Demand for SiP Technology

Computing Devices - A Key Growth Driver

IoT Opens New Growth Avenues for SiP

TSVs for Die-to-Die/Die-to-Package Substrate Communication

Advanced Nodes Demand Innovative Package Technologies

PCB Considerations Vital for Using SiP in IoT Systems

WLCSP for Compact Form Factors

Trend Towards Smart Homes Offers Growth Opportunities

Miniaturization of Electronics - A Major Growth Driver for SiP

Need for Compact and High Speed Performance Products Spurs Market Growth

Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market

SMBs Spur the Adoption of SiP

Expanding Applications in Non- Battery Operated Systems Spur Market Growth

SoC Design Complexities Bring Focus onto SiP

Combined SoC and SiP Technology Gains Increased Demand

Need to Reduce Cost Per Function of ICs Boosts Market Demand

Advanced SiP Packaging Transforming System-Level Integration Landscape

Wafer-Based Advanced SiP

Laminate-based Advanced SiP

SiP Technology to Impact Fan-In Packaging Platform

Foundries Focus on Offering Turnkey Services with System-in-Package

Vendors Offer Advanced Capabilities for SiP Design

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES

Market Facts & Figures

US System-in-Package (SiP) Technology Market Share (in %) by Company: 2020 & 2025

Market Analytics

CANADA

JAPAN

CHINA

EUROPE

Market Facts & Figures

European System-in-Package (SiP) Technology Market: Competitor Market Share Scenario (in %) for 2020 & 2025

Market Analytics

FRANCE

GERMANY

ITALY

UNITED KINGDOM

SPAIN

RUSSIA

REST OF EUROPE

ASIA-PACIFIC

AUSTRALIA

INDIA

SOUTH KOREA

REST OF ASIA-PACIFIC

LATIN AMERICA

ARGENTINA

BRAZIL

MEXICO

REST OF LATIN AMERICA

MIDDLE EAST

IRAN

ISRAEL

SAUDI ARABIA

UNITED ARAB EMIRATES

REST OF MIDDLE EAST

AFRICA

IV. COMPETITION

Total Companies Profiled: 51

Note: Product cover images may vary from those shown
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