Amid the COVID-19 crisis, the global market for System-in-Package (SiP) Technology estimated at US$21.4 Billion in the year 2020, is projected to reach a revised size of US$34 Billion by 2027, growing at a CAGR of 6.8% over the analysis period 2020-2027. 2-D IC Packaging, one of the segments analyzed in the report, is projected to record a 6.6% CAGR and reach US$18.4 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 2.5-D IC Packaging segment is readjusted to a revised 6.8% CAGR for the next 7-year period.
The U.S. Market is Estimated at $5.8 Billion, While China is Forecast to Grow at 10.5% CAGR
The System-in-Package (SiP) Technology market in the U.S. is estimated at US$5.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$7.4 Billion by the year 2027 trailing a CAGR of 10.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.7% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.4% CAGR.
3-D IC Packaging Segment to Record 7.6% CAGR
In the global 3-D IC Packaging segment, USA, Canada, Japan, China and Europe will drive the 7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$3.2 Billion in the year 2020 will reach a projected size of US$5.2 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4.6 Billion by the year 2027, while Latin America will expand at a 9% CAGR through the analysis period. We bring years of research experience to this 15th edition of our report. The 390-page report presents concise insights into how the pandemic has impacted production and the buy side for 2020 and 2021. A short-term phased recovery by key geography is also addressed.
Competitors identified in this market include, among others:
- Amkor Technology Inc.
- ChipMOS Technologies Inc.
- Fujitsu Limited
- GS Nanotech
- Insight SiP
- Intel Corporation
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Powertech Technologies Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd.
- Si2 Microsystems Private Limited
- STATS ChipPAC Ltd.
The global analysis and forecast periods covered within the report are 2020-2027 (Current & Future Analysis) and 2012-2019 (Historic Review). Research estimates are provided for 2020, while research projections cover the period 2021-2027.
I. INTRODUCTION, METHODOLOGY & REPORT SCOPE
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
Recent Market Activity
Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
Developing Countries Offer Growth Prospects
Flip Chip Type of Interconnection Technology Leads SiP Technology Market
Consumer Electronics Sector Fuels Revenue Growth in SiP Market
Portable Electronic Devices Stir Demand for Flat Packaging
2.5D IC Packaging Technology Dominates SiP Market
Challenges Confronting the SiP Market
Global Competitor Market Shares
System-in-Package (SiP) Technology Competitor Market Share Scenario Worldwide (in %): 2020 & 2029
Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
Amkor Technology, Inc. (USA)
ASE Group (Taiwan)
ChipMOS Technologies Inc. (Taiwan)
Fujitsu Limited (Japan)
GS Nanotech (Russia)
Insight SiP (France)
Intel Corporation (USA)
Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
Kulicke & Soffa Pte Ltd. (Singapore)
Nanium S.A. (Portugal)
O.C.E. Technology Ltd. (Ireland)
Powertech Technologies, Inc. (Taiwan)
Renesas Electronics Corporation (Japan)
Samsung Electronics Co., Ltd. (South Korea)
ShunSin Technology (Zhongshan) Limited (China)
Si2 Microsystems Private Limited (India)
Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
STATS ChipPAC Ltd. (Singapore)
Unimicron Corporation (Taiwan)
3. MARKET TRENDS & DRIVERS
Importance of SiP Technology in Electronics
Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
List of Select SiP Solutions for Connected Devices
Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
Growing Sales of Smartphones Bode Well for SiP Market
Growing Demand for Tablet PCs - A Key Growth Driver
Applications in Set Top Boxes Boosts Demand for SiP Technology
Computing Devices - A Key Growth Driver
IoT Opens New Growth Avenues for SiP
TSVs for Die-to-Die/Die-to-Package Substrate Communication
Advanced Nodes Demand Innovative Package Technologies
PCB Considerations Vital for Using SiP in IoT Systems
WLCSP for Compact Form Factors
Trend Towards Smart Homes Offers Growth Opportunities
Miniaturization of Electronics - A Major Growth Driver for SiP
Need for Compact and High Speed Performance Products Spurs Market Growth
Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market
SMBs Spur the Adoption of SiP
Expanding Applications in Non- Battery Operated Systems Spur Market Growth
SoC Design Complexities Bring Focus onto SiP
Combined SoC and SiP Technology Gains Increased Demand
Need to Reduce Cost Per Function of ICs Boosts Market Demand
Advanced SiP Packaging Transforming System-Level Integration Landscape
Wafer-Based Advanced SiP
Laminate-based Advanced SiP
SiP Technology to Impact Fan-In Packaging Platform
Foundries Focus on Offering Turnkey Services with System-in-Package
Vendors Offer Advanced Capabilities for SiP Design
4. GLOBAL MARKET PERSPECTIVE
III. MARKET ANALYSIS
GEOGRAPHIC MARKET ANALYSIS
UNITED STATES
Market Facts & Figures
US System-in-Package (SiP) Technology Market Share (in %) by Company: 2020 & 2025
Market Analytics
CANADA
JAPAN
CHINA
EUROPE
Market Facts & Figures
European System-in-Package (SiP) Technology Market: Competitor Market Share Scenario (in %) for 2020 & 2025
Market Analytics
FRANCE
GERMANY
ITALY
UNITED KINGDOM
SPAIN
RUSSIA
REST OF EUROPE
ASIA-PACIFIC
AUSTRALIA
INDIA
SOUTH KOREA
REST OF ASIA-PACIFIC
LATIN AMERICA
ARGENTINA
BRAZIL
MEXICO
REST OF LATIN AMERICA
MIDDLE EAST
IRAN
ISRAEL
SAUDI ARABIA
UNITED ARAB EMIRATES
REST OF MIDDLE EAST
AFRICA
IV. COMPETITION
Total Companies Profiled: 51
