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System-in-Package (SiP) Technology - Global Market Trajectory & Analytics

  • ID: 2255359
  • Report
  • April 2021
  • Region: Global
  • Global Industry Analysts, Inc

FEATURED COMPANIES

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
Global System-in-Package (SiP) Technology Market to Reach $34 Billion by 2027

Amid the COVID-19 crisis, the global market for System-in-Package (SiP) Technology estimated at US$21.4 Billion in the year 2020, is projected to reach a revised size of US$34 Billion by 2027, growing at a CAGR of 6.8% over the analysis period 2020-2027. 2-D IC Packaging, one of the segments analyzed in the report, is projected to record a 6.6% CAGR and reach US$18.4 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 2.5-D IC Packaging segment is readjusted to a revised 6.8% CAGR for the next 7-year period.









The U.S. Market is Estimated at $5.8 Billion, While China is Forecast to Grow at 10.5% CAGR

The System-in-Package (SiP) Technology market in the U.S. is estimated at US$5.8 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$7.4 Billion by the year 2027 trailing a CAGR of 10.3% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 3.7% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.4% CAGR.

3-D IC Packaging Segment to Record 7.6% CAGR

In the global 3-D IC Packaging segment, USA, Canada, Japan, China and Europe will drive the 7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$3.2 Billion in the year 2020 will reach a projected size of US$5.2 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$4.6 Billion by the year 2027, while Latin America will expand at a 9% CAGR through the analysis period.

Select Competitors (Total 51 Featured):
  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technologies Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co., Ltd.
  • Si2 Microsystems Private Limited
  • STATS ChipPAC Ltd.
Frequently Asked Questions about the Global Market for System-in-Package (SiP) Technology

What is the estimated value of the Global Market for System-in-Package (SiP) Technology?

The Global Market for System-in-Package (SiP) Technology was estimated to be valued at $21.4 Billion in 2020.

What is the growth rate of the Global Market for System-in-Package (SiP) Technology?

The growth rate of the Global Market for System-in-Package (SiP) Technology is 6.8%, with an estimated value of $34.0 Billion by 2027.

What is the forecasted size of the Global Market for System-in-Package (SiP) Technology?

The Global Market for System-in-Package (SiP) Technology is estimated to be worth $34.0 Billion by 2027.

Who are the key companies in the Global Market for System-in-Package (SiP) Technology?

Key companies in the Global Market for System-in-Package (SiP) Technology include Amkor Technology Inc., ChipMOS Technologies Inc., Fujitsu Limited, GS Nanotech, Insight SiP, Intel Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Powertech Technologies Inc. and Samsung Electronics Co. Ltd..
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Small Form Factor, High Performance & Energy Efficiency Needs of Electronics Industry Bolster Demand for System-in-Package (SiP) Technology
  • Recent Market Activity
  • Growing Demand for Miniature and High Performance Electronic Devices & Systems Drive SiP Market
  • Developing Countries Offer Growth Prospects
  • Flip Chip Type of Interconnection Technology Leads SiP Technology Market
  • Consumer Electronics Sector Fuels Revenue Growth in SiP Market
  • PorTable Electronic Devices Stir Demand for Flat Packaging
  • 2.5D IC Packaging Technology Dominates SiP Market
  • Challenges Confronting the SiP Market
  • Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS
  • Amkor Technology, Inc. (USA)
  • ASE Group (Taiwan)
  • ChipMOS Technologies Inc. (Taiwan)
  • Fujitsu Limited (Japan)
  • GS Nanotech (Russia)
  • Insight SiP (France)
  • Intel Corporation (USA)
  • Jiangsu Changjiang Electronics Technology Co. Ltd. (China)
  • Kulicke & Soffa Pte Ltd. (Singapore)
  • Nanium S.A. (Portugal)
  • O.C.E. Technology Ltd. (Ireland)
  • Powertech Technologies, Inc. (Taiwan)
  • Renesas Electronics Corporation (Japan)
  • Samsung Electronics Co., Ltd. (South Korea)
  • ShunSin Technology (Zhongshan) Limited (China)
  • Si2 Microsystems Private Limited (India)
  • Siliconware Precision Industries Co. Ltd. (SPIL) (Taiwan)
  • STATS ChipPAC Ltd. (Singapore)
  • Unimicron Corporation (Taiwan)

3. MARKET TRENDS & DRIVERS
  • Importance of SiP Technology in Electronics
  • Rising Demand for High Performance and Compact Consumer Electronics Drive Growth
  • List of Select SiP Solutions for Connected Devices
  • Growing Demand for Smart, Energy Efficient Electronics Provides Business Case for SiP
  • Growing Sales of Smartphones Bode Well for SiP Market
  • Growing Demand for Tablet PCs - A Key Growth Driver
  • Applications in Set Top Boxes Boosts Demand for SiP Technology
  • Computing Devices - A Key Growth Driver
  • IoT Opens New Growth Avenues for SiP
  • TSVs for Die-to-Die/Die-to-Package Substrate Communication
  • Advanced Nodes Demand Innovative Package Technologies
  • PCB Considerations Vital for Using SiP in IoT Systems
  • WLCSP for Compact Form Factors
  • Trend Towards Smart Homes Offers Growth Opportunities
  • Miniaturization of Electronics - A Major Growth Driver for SiP
  • Need for Compact and High Speed Performance Products Spurs Market Growth
  • Shift in Direction towards "More Than Moore's Law" Benefits the SiP Market
  • SMBs Spur the Adoption of SiP
  • Expanding Applications in Non- Battery Operated Systems Spur Market Growth
  • SoC Design Complexities Bring Focus onto SiP
  • Combined SoC and SiP Technology Gains Increased Demand
  • Need to Reduce Cost Per Function of ICs Boosts Market Demand
  • Advanced SiP Packaging Transforming System-Level Integration Landscape
  • Wafer-Based Advanced SiP
  • Laminate-based Advanced SiP
  • SiP Technology to Impact Fan-In Packaging Platform
  • Foundries Focus on Offering Turnkey Services with System-in-Package
  • Vendors Offer Advanced Capabilities for SiP Design

4. GLOBAL MARKET PERSPECTIVE
III. MARKET ANALYSIS
  • UNITED STATES
  • CANADA
  • JAPAN
  • CHINA
  • EUROPE
  • FRANCE
  • GERMANY
  • ITALY
  • UNITED KINGDOM
  • SPAIN
  • RUSSIA
  • REST OF EUROPE
  • ASIA-PACIFIC
  • AUSTRALIA
  • INDIA
  • SOUTH KOREA
  • REST OF ASIA-PACIFIC
  • LATIN AMERICA
  • ARGENTINA
  • BRAZIL
  • MEXICO
  • REST OF LATIN AMERICA
  • MIDDLE EAST
  • IRAN
  • ISRAEL
  • SAUDI ARABIA
  • UNITED ARAB EMIRATES
  • REST OF MIDDLE EAST
  • AFRICA

IV. COMPETITION
  • Total Companies Profiled: 51
Note: Product cover images may vary from those shown

A selection of companies mentioned in this report includes:

  • Amkor Technology Inc.
  • ChipMOS Technologies Inc.
  • Fujitsu Limited
  • GS Nanotech
  • Insight SiP
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Powertech Technologies Inc.
  • Renesas Electronics Corporation
  • Samsung Electronics Co. Ltd.
  • Si2 Microsystems Private Limited
  • STATS ChipPAC Ltd.
Note: Product cover images may vary from those shown