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Materials Science of Thin Films. Depositon and Structure. Edition No. 2

  • Book

  • 864 Pages
  • October 2001
  • Elsevier Science and Technology
  • ID: 2485199

This is the first book that can be considered a textbook on thin film science, complete with exercises at the end of each chapter. Ohring has contributed many highly regarded reference books to the AP list, including Reliability and Failure of Electronic Materials and the Engineering Science of Thin Films. The knowledge base is intended for science and engineering students in advanced undergraduate or first-year graduate level courses on thin films and scientists and engineers who are entering or require an overview of the field.

Since 1992, when the book was first published, the field of thin films has expanded tremendously, especially with regard to technological applications. The second edition will bring the book up-to-date with regard to these advances. Most chapters have been greatly updated, and several new chapters have been added.

Please Note: This is an On Demand product, delivery may take up to 11 working days after payment has been received.

Table of Contents

1. A Review of Materials Science 2. Vacuum Science and Technology 3. Thin-Film Evaporation Processes4. Discharges, Plasmas, and Ion-Surface Interactions5. Plasma and Ion Beam Processing of Thin Films6. Chemical Vapor Deposition7. Substrate Surfaces and Thin-Film Nucleation 8. Epitaxy9. Film Structure10. Characterization of Thin Films and Surfaces11. Interdiffusion, Reactions, and Transformations in Thin Films12. Mechanical Properties of Thin Films

Authors

Milton Ohring Stevens Institute of Technology, Hoboken, NJ, USA (Retired). Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.