As a reader, you'll gain access to MMI's reporting, market analysis and trend spotting as well as MMI Top 50 data and other special features.
You'll benefit from 24 years experience covering electronics assembly as well as the publisher's intimate knowledge of the leading-edge high technology electronics industry.
The newsletter has been published since 1991. Each month, Manufacturing Market Insider gives readers an eight-page briefing of what is happening in the EMS industry. Subscribers can receive the newsletter in print or electronic form.
- EMS industry trends
- EMS market analysis and news
- Unique content such as the annual MMI Top 50 EMS providers
- The annual Scorecard of M&A deals
- The annual outlook for the year ahead, aggregated financial results and market segment data.
Articles are typically staff-written and based on original primary research. Charts may appear in some articles.
- 3CEMS Group
- ALL CIRCUITS
- Benchmark Electronics
- Beyonics Technology
- Computime Limited
- Creation Technologie
- Di-Nikko Engineering
- Ducommun Inc., Electronic Systems Group
- Global Brands Manufacture (GBM)
- Hana Microelectronics
- Hon Hai Precision Industry (Foxconn )
- Integrated Micro-Electronics, Inc.
- Key Tronic
- Kimball Electronics Group
- LACROIX Electronics
- New Kinpo Group
- Neways Electronics International
- Nippon Manufacturing Service
- OnCore Manufacturing
- Orient Semiconductor Electronics
- Scanfil EMS
- Selcom Elettronica
- Shenzhen Kaifa Technology
- SMT Technologies
- UMC Electronics
- Universal Scientific Industrial Co., Ltd
- V.S. Industry
- VIDEOTON Holding
- VTech Communications
- WKK Technology Ltd.
- Wong's International Holdings Limited
- Zollner Elektronik Group
The publisher's forecasts are developed using a four-step approach. First, expectations of world economic growth are set based upon historical data and forecasts obtained from published International Monetary Fund (IMF) reports.
Next, a top-down forecast of electronics industry growth is built. This analysis is based primarily on historical data obtained from the Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS). Because semiconductor content is at the core of electronics products, semiconductor data is a good triangulation point for total assembly value. This data is augmented with information on passive content and estimates of labor and overhead.
Then, a bottom-up forecast is developed for each of the products in each segment. This is accomplished by first creating a unit forecast for each product based on historical data and various industry-leader opinions regarding future growth prospects for each product. A model of the assembly value of each product is then built using teardown analyses and price-based models. The unit volume times the assembly value per unit equals the total assembly value for each product - often referred to as the cost of goods sold (COGS).
Finally, the first three steps are reiterated to achieve a coherent forecast. The forecasts developed by this process are presented in all their industry reports.