Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

  • ID: 3608869
  • Report
  • Region: Global
  • 67 pages
  • TechNavio
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FEATURED COMPANIES

  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Rudolph Technologies
  • SEMES
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

About Semiconductor Packaging and Assembly Equipment

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

The analysts forecast the global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

The market is divided into the following segments based on type:
- Die- level packaging and assembly equipment
- Wafer-level packaging and assembly equipment

The report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Applied Materials
- ASMPT
- DISCO
- EVG
- Kulicke and Soffa Industries
- TEL
- Tokyo Seimitsu

Other prominent vendors
- Rudolph Technologies
- SEMES
- Suss Microtec
- Ultratech
- Ulvac Technologies

Market drivers
- Rising demand for polymer adhesive wafer bonding equipment
- For a full, detailed list, view the full report

Market challenges
- Fluctuating foreign exchange rates
- For a full, detailed list, view the full report

Market trends
- Higher number of mergers and acquisitions (M&A)
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Rudolph Technologies
  • SEMES
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Market overview
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
  • PEST analysis
PART 04: Introduction
  • Key market highlights
  • Market perspective
PART 05: Technology landscape
  • Back-end chip formation
  • Wafer-level versus die-level packaging and assembly
  • Roadmap of the semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
  • Consumer perspective
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by type
  • Market overview
  • Market size and forecast
PART 08: Geographical segmentation
  • Market overview
  • Global semiconductor packaging and assembly equipment market in APAC
  • Global semiconductor packaging and assembly equipment market in North America
  • Global semiconductor packaging and assembly equipment market in Europe
PART 09: Market drivers and their impact
  • Rising demand for polymer adhesive wafer bonding equipment
  • Growing application of semiconductor ICs in the IoT
  • Growing demand for semiconductor ICs
  • Increasing complexity of semiconductor IC designs
  • Increasing miniaturization of electronic devices
PART 10: Market challenges
  • Fluctuating foreign exchange rates
  • Heavy investment required
  • Cyclical nature of the semiconductor industry
PART 11: Impact of drivers and challenges

PART 12: Market trends
  • Higher number of M&A
  • Rapid technological changes in the semiconductor industry
  • High adoption of semiconductor ICs in automobiles
PART 13: Vendor landscape
  • Competitive scenario
  • Key vendors
  • Other prominent vendors
PART 14: Key vendor analysis
  • Applied Materials
  • ASM Pacific Technology (ASMPT)
  • Disco
  • EV Group (EVG)
  • Kulicke and Soffa Industries
  • Tokyo Electron Ltd. (TEL)
  • Tokyo Seimitsu
PART 15: Key suggestions for investors/vendors

PART 16: Appendix
  • List of abbreviations
PART 17: About the Author

Exhibit 01: Global semiconductor packaging and assembly equipment market segmentation
Exhibit 02: Product offerings
Exhibit 03: Steps in back-end chip formation
Exhibit 04: 2.5D IC block diagram
Exhibit 05: 3D IC block diagram
Exhibit 06: Old supply chain of semiconductor IC packaging industry
Exhibit 07: New supply chain of semiconductor IC packaging industry
Exhibit 08: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 09: Five forces analysis
Exhibit 10: Global semiconductor packaging and assembly equipment market 2015
Exhibit 11: Global semiconductor packaging and assembly equipment market 2015-2020 (% share)
Exhibit 12: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 13: Global semiconductor packaging and assembly equipment market 2015
Exhibit 14: Global semiconductor packaging and assembly equipment market in APAC ($ billions)
Exhibit 15: Global semiconductor packaging and assembly equipment market in North America ($ billions)
Exhibit 16: Global semiconductor packaging and assembly equipment market in Europe ($ millions)
Exhibit 17: Impact of drivers on key customer segments
Exhibit 18: Global MEMS market 2015-2020 ($ billions)
Exhibit 19: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 20: Impact of drivers and challenges
Exhibit 21: Global NAND flash market 2015-2020 (% share)
Exhibit 22: Global car shipments 2015-2020 (shipment growth)
Exhibit 23: Applied Materials: Geographical segmentation by revenue 2014
Exhibit 24: ASMPT: Geographical segmentation by revenue 2014
Exhibit 25: Disco: Geographical segmentation by revenue 2014
Exhibit 26: Kulicke and Soffa Industries: Geographical segmentation by revenue 2014
Exhibit 27: TEL: Geographical segmentation by revenue 2015
Exhibit 28: TEL: Business performance by revenue 2012-2015
Exhibit 29: Tokyo Seimitsu: Geographical segmentation by revenue 2014
Exhibit 30: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • ASMPT
  • DISCO
  • EVG
  • Rudolph Technologies
  • SEMES
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

New Report Released: – Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

The author of the report recognizes the following companies as the key players in the Global Semiconductor Packaging and Assembly Equipment Market: Applied Materials, ASMPT, DISCO, EVG, Kulicke and Soffa Industries, TEL and Tokyo Seimitsu

Other Prominent Vendors in the market are: Rudolph Technologies, SEMES, Suss Microtec, Ultratech, and Ulvac Technologies.

Commenting on the report, an analyst from the research team said: “The global semiconductor packaging and assembly equipment market is observing an increase in the number of M&A. New entrants in the market are taking the M&A route to enter the already highly competitive market. Existing vendors are also turning to M&A to expand their market shares and help them enhance their market position.”

According to the report, the adoption of polymer adhesive wafer bonding equipment is increasing due to higher-quality packaging of vertically stacked and 3D ICs. Further, the boom in the IoT device market and increased adoption of ICs in automotive products will likely drive the demand for semiconductor ICs and their associated packaging and assembly equipment during the next few years.

Further, the report states that Fluctuations in foreign exchange rates will affect the rates of semiconductor packaging and assembly equipment.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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1h Free Analyst Time

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- Applied Materials
- ASMPT
- DISCO
- EVG
- Kulicke and Soffa Industries
- TEL
- Tokyo Seimitsu
- Rudolph Technologies
- SEMES
- Suss Microtec
- Ultratech
- Ulvac Technologies.
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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