Global Chip Mounter Market 2016-2020

  • ID: 3775976
  • Report
  • Region: Global
  • 58 pages
  • TechNavio
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Essemtec
  • Juki Corporation
  • Nordson
  • Panasonic
  • Sony
  • MORE
About the Chip Mounter Market

The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades. Thus, the chip mounting technology has moved from a big diameter to a small diameter of space.

The analysts forecast the global chip mounter market to grow at a CAGR of 8.05% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global chip mounter market for 2016-2020. To calculate the market size, the report considers revenue from the sales of chip mounter equipment.

The market is divided into the following segments based on geography:
- Americas
- APAC
- EMEA

The report, Global Chip Mounter Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Hitachi
- Juki Corporation
- Nitto Denko Corporation
- Panasonic
- Yamaha Corporation

Other prominent vendors
- ASM Pacific Technology
- Canon
- Essemtec
- Ohashi Engineering
- Nordson
- Samsung Techwin
- Sony
- Sun Electric Industries
- TOA

Market drivers
- Growing adoption of communication-related consumer electronic gadgets
- For a full, detailed list, view the full report

Market challenges
- Uncertain global economic conditions
- For a full, detailed list, view the full report

Market trends
- Emergence of wearable technology
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Essemtec
  • Juki Corporation
  • Nordson
  • Panasonic
  • Sony
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Report coverage
  • Base year and forecast period
  • Geographical segmentation
  • Common currency conversion rates
  • Vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
  • Technology landscape
PART 05: Industry overview
  • Overview of semiconductor packaging industry
  • Global semiconductor industry value chain
PART 06: Market landscape
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by technology
  • Global chip mounter market by technology
  • SMT segment
  • THT segment
PART 08: Market segmentation by application
  • Global chip mounter market by application
  • Application segmentation
PART 09: Geographical segmentation
  • Global chip mounter market by region
  • APAC
  • EMEA
  • Americas
PART 10: Market drivers
  • Growing adoption of communication-related electronic gadgets
  • Increase in chip density
  • Miniaturization of electronics
PART 11: Impact of drivers

PART 12: Market challenges
  • Cyclical nature of semiconductor industry
  • Uncertain global economic conditions
PART 13: Impact of drivers and challenges

PART 14: Market trends
  • Growing focus on IoT
  • Increasing automation in automobiles
  • Emergence of wearable technology
PART 15: Vendor landscape
  • Competitive scenario
  • Other prominent vendors
PART 16: Market summary
  • Market figure snapshot
PART 17: Appendix
  • List of abbreviations
PART 18: About the Author

Exhibit 01: Global chip mounter market segmentation
Exhibit 02: Major countries covered
Exhibit 03: Currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Changes in semiconductor packaging size and component density
Exhibit 06: Evolution of semiconductor IC packaging
Exhibit 07:.5D IC packaging technology using TSVs and silicon interposers
Exhibit 08:D semiconductor packaging technology using TSVs
Exhibit 09: Semiconductor value chain
Exhibit 10: Front-end processes
Exhibit 11: Back-end processes
Exhibit 12: Global chip mounter market forecast 2015-2020 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Global chip mounter market by technology 2015
Exhibit 15: Global chip mounter market by technology 2020
Exhibit 16: SMT segment forecast of global chip mounter market 2015-2020 ($ billions)
Exhibit 17: THT segment forecast of global chip mounter market 2015-2020 ($ millions)
Exhibit 18: Global chip mounter market by application 2015-2020 (% share)
Exhibit 19: Global chip mounter market by application 2015-2020 ($ billions)
Exhibit 20: Global chip mounter market by communication segment 2015-2020 ($ billions)
Exhibit 21: Global chip mounter market by computer segment 2015-2020 ($ billions)
Exhibit 22: Global chip mounter market by consumer electronics segment 2015-2020 ($ millions)
Exhibit 23: Global chip mounter market by automotive segment 2015-2020 ($ millions)
Exhibit 24: Global chip mounter market by region 2015
Exhibit 25: Global chip mounter market by region 2020
Exhibit 26: Chip mounter market in APAC 2015-2020 ($ billions)
Exhibit 27: Chip mounter market in EMEA 2015-2020 ($ billions)
Exhibit 28: Chip mounter market in Americas 2015-2020 ($ billions)
Exhibit 29: Global smartphone shipment forecast 2015-2020 (millions of units)
Exhibit 30: Global tablet shipments forecast 2015-2020 (millions of units)
Exhibit 31: Impact of drivers
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Other prominent vendors
Exhibit 34: Key inferences
Exhibit 35: Market summary of global chip mounter market 2015-2020
Exhibit 36: Technology segments: Year-over-year revenue comparison ($ billions)
Exhibit 37: Geographical segments: Year-over-year revenue comparison ($ billions)
Exhibit 38: Geographical segments: Year-over-year revenue comparison ($ billions)
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • ASM Pacific Technology
  • Essemtec
  • Juki Corporation
  • Nordson
  • Panasonic
  • Sony
  • MORE
New Report Released: – Global Chip Mounter Market 2016-2020

The author of the report recognizes the following companies as the key players in the global chip mounter market: Hitachi, Juki Corporation, Nitto Denko Corporation, Panasonic, and Yamaha Corporation.

Other Prominent Vendors in the market are: ASM Pacific Technology, Canon, Essemtec, Ohashi Engineering, Nordson, Samsung Techwin, Sony, Sun Electric Industries, and TOA.

Commenting on the report, an analyst from the research team said: “A trend which is expected to have a big impact on the market is the emergence of wearable technology. Wearable technology is a form of communication technology that can be attached to the body and can be used to monitor daily activities as well as to use smartphone functionalities. It includes smart watches, smart glasses, smart fabrics, heart rate monitors, and fitness tracking gadgets such as FitBit Surge and Garmin Vivoactive. IC manufacturers such as Toshiba have started developing specialized ICs to fulfill the requirements of wearable technology.”

According to the report, a key growth driver is the growing use of communication related electronic gadgets. The consumer electronics market has seen massive transformations in the last two decades. Smartphones replaced feature phones and laptops replaced PCs. Now, tablets are replacing laptops, and LEDs and Smart TVs are replacing CRT TVs. Household electronics such as coffee makers and washing machines are becoming fully automated. Such advanced transformations require constant upgrades in consumer offerings in terms of design, processing power, power consumption, and user interface.

Further, the report states that one challenge that could dampen market growth is uncertain global economic conditions. Capital investments and the risk involved in terms of the performance of new chip mounting technologies such as SMT are high in the semiconductor market. Therefore, end-products such as miniaturized ICs and their revenue-generation capability in the future need to be robust.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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- Hitachi
- Juki Corporation
- Nitto Denko Corporation
- Panasonic
- Yamaha Corporation
- ASM Pacific Technology
- Canon
- Essemtec
- Ohashi Engineering
- Nordson
- Samsung Techwin
- Sony
- Sun Electric Industries
- TOA
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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