Global Front End of the Line Semiconductor Equipment Market 2016-2020

  • ID: 3832392
  • Report
  • Region: Global
  • 63 pages
  • TechNavio
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FEATURED COMPANIES

  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • KLA-Tencor
  • Lam Research
  • MORE
About Semiconductor Equipment Industry and Front-End Process

The semiconductor equipment industry is an important part of the overall semiconductor market, with semiconductor chipmakers investing 20% of their sales in obtaining manufacturing equipment. The equipment manufacturing companies are leading the development of most core process technologies in the semiconductor market.

The semiconductor production equipment industry is divided into front-end and back-end process equipment. The front-end process includes advanced technology and integration. Investment in front-end equipment is more than back-end equipment, with 60% of the total investment made for front-end equipment. The front-end process is subdivided into front-end-of-the-line (FEOL) and back-end-of-the-line (BEOL).

The analysts forecast the global front-end-of-the-line (FEOL) semiconductor equipment market to grow at a CAGR of 1.78% during the period 2016-2020.

Covered in this report

The report covers the present scenario and the growth prospects of the global front-end-of-the-line (FEOL) semiconductor equipment market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of FEOL semiconductor equipment.

The market is divided into the following segments based on geography:

- Americas
- APAC
- EMEA

The report, Global Front-End-Of-The-Line (FEOL) Semiconductor Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- Applied Materials
- ASML
- KLA-Tencor
- Lam Research
- Tokyo Electron

Other prominent vendors
- Dainippon Screen Manufacturing
- Hitachi High-Technologies
- Nikon
- Hitachi Kokusai Electric

Market drivers
- Increase in number of fabs worldwide

Market challenges
- High cost of equipment

Market trends
- Proliferation of automotive electronics

Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • KLA-Tencor
  • Lam Research
  • MORE
PART 01: Executive summary
  • Highlights
PART 02: Scope of the report
  • Market overview
  • Definition
  • Source year and forecast period
  • Product segmentation
  • End-user segmentation
  • Geographical segmentation
  • Common currency conversion rates
  • Top-vendor offerings
PART 03: Market research methodology
  • Research methodology
  • Economic indicators
PART 04: Introduction
  • Key market highlights
PART 05: Technology landscape
  • Technology landscape of wafer fab equipment
  • Wafer-level manufacturing equipment categories
  • Key customers
PART 06: Market landscape
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 07: Market segmentation by product
  • Market overview
  • Market size and forecast
PART 08: Market segmentation by end-user
  • Market overview
  • Market size and forecast
  • Foundry
  • Memory
  • IDM
PART 09: Geographical segmentation
  • Global FEOL semiconductor equipment market by geography
  • Market size and forecast
  • APAC
  • Americas
  • EMEA
PART 10: Key leading countries
  • Taiwan
  • South Korea
  • Japan
PART 11: Market drivers
  • Increase in number of fabs worldwide
  • Growth of advanced consumer electronics market
  • Miniaturization of electronic devices
  • Advent of 3D ICs
PART 12: Impact of drivers

PART 13: Market challenges
  • High cost of equipment
  • Long payback period
  • Fluctuations in the semiconductor industry
PART 14: Impact of drivers and challenges

PART 15: Market trends
  • Proliferation of automotive electronics
  • Growing number of connected devices through IoT and other emerging markets
  • Increasing investment in memory capacity
  • Shorter replacement cycle of smart devices
  • Adoption of FinFET architecture
PART 16: Vendor landscape
  • Competitive scenario
  • Other prominent vendors
PART 17: About the Author

List of Exhibits

Exhibit 01: List of major countries considered
Exhibit 02: Product offerings
Exhibit 03: Semiconductor production equipment
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Wafer-level manufacturing equipment categories
Exhibit 08: Requirements of a manufacturing equipment
Exhibit 09: Global FEOL semiconductor equipment market 2015-2020 ($ billions)
Exhibit 10: Five forces analysis
Exhibit 11: Global FEOL semiconductor equipment market by product 2015-2020 (% share)
Exhibit 12: Global FEOL semiconductor equipment market by product 2015-2020 ($ billions)
Exhibit 13: Global FEOL semiconductor equipment market by end-user 2015-2020 (% share)
Exhibit 14: Global FEOL semiconductor equipment market by end-user 2015-2020 ($ billions)
Exhibit 15: Global FEOL semiconductor equipment market by foundry segment 2015-2020 ($ billions)
Exhibit 16: Global FEOL semiconductor equipment market by memory segment 2015-2020 ($ billions)
Exhibit 17: Global FEOL semiconductor equipment market by IDM segment 2015-2020 ($ billions)
Exhibit 18: Global FEOL semiconductor equipment market by geography 2015-2020 (% share)
Exhibit 19: Global FEOL semiconductor equipment market by geography 2015-2020 ($ billions)
Exhibit 20: FEOL semiconductor equipment market in APAC 2015-2020 ($ billions)
Exhibit 21: Global wearables market 2015-2020 ($ billions)
Exhibit 22: FEOL semiconductor equipment market in Americas 2015-2020 ($ billions)
Exhibit 23: FEOL semiconductor equipment market in EMEA 2015-2020 ($ billions)
Exhibit 24: Global NAND flash market 2015-2020 (% share)
Exhibit 25: Consumer electronics market 2015-2020 (unit shipment in millions)
Exhibit 26: Global MEMS market 2015-2020
Exhibit 27: Impact of drivers
Exhibit 28: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 29: Impact of drivers and challenges
Exhibit 30: Cars shipment growth forecast 2015-2020 (% growth)
Exhibit 31: IoT spending and device penetration 2014, 2015, and 2020
Exhibit 32: CAGR of 3D NAND and DRAM 2015-2020
Exhibit 33: Key vendors
Exhibit 34: ASML customers by end-user segment
Exhibit 35: Other prominent vendors
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Applied Materials
  • ASML
  • Hitachi High-Technologies
  • Hitachi Kokusai Electric
  • KLA-Tencor
  • Lam Research
  • MORE
New Report Released: - Global Front-End-Of-The-Line (FEOL) Semiconductor Equipment Market 2016-2020

The author of the report recognizes the following companies as the key players in the global front-end-of-the-line (FEOL) semiconductor equipment market: Applied Materials, ASML, KLA-Tencor, Lam Research, and Tokyo Electron

Other Prominent Vendors in the market are: Dainippon Screen Manufacturing, Hitachi High-Technologies, Nikon, and Hitachi Kokusai Electric

Commenting on the report, an analyst from the research team said that proliferation of automotive electronics is one of the trends spurring growth for the market. The automotive market is going through a lot of changes with electronics such as advanced driver assistance systems (ADAS), connected vehicles, and electric energy, having good growth potential. In the future, most of the automobile buying decisions will be made based on the electronics content of the vehicles and the associated services. In 2015, 70 million units of cars were sold globally, and 73.54 million units will be sold in 2016. The semiconductor content will increase in vehicles during the forecast period.

According to the report, increase in number of fabs worldwide is a key driver aiding to the growth of this market. Financial services are one of the most data-intensive industries. The semiconductor market will see a high demand for semiconductor chips and memory devices from 2017 onward due to the growing adoption of IoT, high demand for connected devices, and increased vehicle automation. Semiconductor device manufacturers are increasing their capital spending by expanding their production facilities or constructing new fabs. The majority of the investment for new facilities will be for the development of memory and logic ICs due to their high demand.

Further, the report states that high cost of equipment is challenge the market is facing. Semiconductor manufacturing equipment is expensive. The cost of constructing a semiconductor fab is between $3 and $4 billion, with equipment accounting for the majority of this cost. By 2020, a semiconductor fab will cost around $20 billion. This is because of the growing adoption of 3D packaging solutions like TSV, stacked packaging, flip chip packaging, and MEMS packaging, which require upgraded equipment. The price of equipment varies widely, depending on its function. For instance, the equipment used in front-end wafer fabrication are relatively more expensive than back-end testing and assembly equipment. This is due to the high level of sophistication of the operations they perform.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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- Applied Materials
- ASML
- KLA-Tencor
- Lam Research
- Tokyo Electron
- Dainippon Screen Manufacturing
- Hitachi High-Technologies
- Nikon
- Hitachi Kokusai Electric
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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