Global Die Bonder Equipment Market 2017-2021

  • ID: 4199053
  • Report
  • Region: Global
  • 70 pages
  • TechNavio
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FEATURED COMPANIES

  • Besi
  • DIAS Automation
  • Hesse
  • Hybond
  • Kulicke & Soffa
  • Palomar Technologies
  • MORE
Die bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step. bonder equipment are a type of semiconductor packaging and assembly equipment in which wafers are cut into dies, and the functional dies are separated from the defective ones, which are already marked before this step.

The analysts forecast the global die bonder equipment market to grow at a CAGR of 2.28% during the period 2017-2021.

Covered in this report

The report covers the present scenario and the growth prospects of the global die bonder equipment market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:

- Americas
- APAC
- EMEA

The report, Global Die Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
- ASM Pacific Technology (ASMPT)
- Kulicke & Soffa
- Palomar Technologies

Other prominent vendors
- Besi
- DIAS Automation
- Hesse
- Hybond
- SHINKAWA
- Toray Engineering
- West-Bond

Market drivers
- Demand for high-quality semiconductor ICs for wireless devices and IoT applications.
- For a full, detailed list, view the full report

Market challenges
- High demand for polymer adhesive wafer bonding equipment.
- For a full, detailed list, view the full report

Market trends
- Increase in M&A in the semiconductor packaging and assembly market.
- For a full, detailed list, view the full report

Key questions answered in this report
- What will the market size be in 2021 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?

You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Besi
  • DIAS Automation
  • Hesse
  • Hybond
  • Kulicke & Soffa
  • Palomar Technologies
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Key market highlights
PART 05: Market landscape
  • Overview of semiconductor packaging and assembly equipment
  • Ecosystem of semiconductor IC packaging industry
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by end-user
  • Market overview
  • OSATs
  • IDMs
PART 07: Geographical segmentation
  • Die bonder equipment market in APAC
  • Die bonder equipment market in Americas
  • Die bonder equipment market in EMEA
PART 08: Key leading countries
  • Taiwan
  • South Korea
  • Japan
  • China
PART 09: Decision framework

PART 10: Drivers and challenges
  • Market drivers
  • Impact of drivers on key customer segments
  • Market challenges
  • Impact of challenges on key customer segments
PART 11: Market trends
  • Growing use of 3D chip packaging
  • Increase in number of OSAT vendors
  • Increase in M&A in the semiconductor packaging and assembly market
  • Advent of FOWLP technology
  • Automation in automobiles
PART 12: Vendor landscape
  • Competitive scenario
  • Major vendors
  • Other prominent vendors
PART 13: Appendix
  • List of abbreviations
List of Exhibits

Exhibit 01: Steps involved in back-end chip formation
Exhibit 02: Supply chain in traditional semiconductor IC packaging industry
Exhibit 03: Supply chain in new semiconductor IC packaging industry
Exhibit 04: Global die bonder market
Exhibit 05: Global die bonder equipment market 2016-2021 ($ millions)
Exhibit 06: Five forces analysis
Exhibit 07: Global die bonder equipment market: Segmentation by end-user 2016-2021 (% share)
Exhibit 08: Global die bonder equipment market: Segmentation by end-user 2016-2021 ($ million)
Exhibit 09: Global die bonder equipment market by OSATs 2016-2021 ($ millions)
Exhibit 10: Global die bonder equipment market by IDMs 2016-2021 ($ millions)
Exhibit 11: Global die bonder equipment market: Segmentation by geography 2016-2021 (% share)
Exhibit 12: Global die bonder equipment market: Segmentation by region-wise revenue trend-line 2016-2021 ($ millions)
Exhibit 13: Die bonder equipment market in APAC 2016-2021 ($ millions)
Exhibit 14: Die bonder equipment market in Americas 2016-2021 ($ millions)
Exhibit 15: Die bonder equipment market in EMEA 2016-2021 ($ millions)
Exhibit 16: Key leading countries
Exhibit 17: Percentage share of key leading countries over the forecast period (2016-2021)
Exhibit 18: Impact of drivers
Exhibit 19: Global semiconductor market trend 1992-2016 ($ billions)
Exhibit 20: Impact of challenges
Exhibit 21: Global automobile unit production 2016-2021 (Million units)
Exhibit 22: Other vendors in the global die bonder equipment market
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Besi
  • DIAS Automation
  • Hesse
  • Hybond
  • Kulicke & Soffa
  • Palomar Technologies
  • MORE
New Report Released: - Global Die Bonder Equipment Market 2017-2021

The author of the report recognizes the following companies as the key players in the global die bonder equipment market: ASM Pacific Technology (ASMPT), Kulicke & Soffa, and Palomar Technologies.

Other Prominent Vendors in the market are: Besi, DIAS Automation, Hesse, Hybond, SHINKAWA, Toray Engineering, and West-Bond.

Commenting on the report, an analyst from the research team said: “One trend in market is increase in number of OSAT vendors. The number of OSATs in APAC, especially China, is growing at a considerable pace since these companies have a strong liquidity and financial backing. This enables OSATs to have adequate funds for R&D and capacity expansion. Moreover, governmental support toward the development of the semiconductor industry from major APAC countries, such as South Korea, China, and Japan, is propelling the growth of these facilities.

The easy availability of capital is likely to boost the development of these companies while ensuring scale and technical competence through acquisitions. The increase in the number of OSATS signifies that most companies in the semiconductor market are resorting to the fabless model. This is to increase the orders received for packaging by these OSATs who must increase their production capacities. This is expected to generate a significant demand for the die bonder equipment in the market during the forecast period.”

According to the report, one driver in market is incentives and discounts for long-term customers. The semiconductor capital equipment industry is defined by relationship-based sales. The selling price of such equipment is usually in the range of $100,000 to $1,000,000. Therefore, manufacturers develop long-standing relations with customers for buying their products. The main aim of such relations is to convince their customers to procure the necessary equipment from them by offering incentives and discounts for future purchases. Equipment manufacturers mostly target those customers who tend to procure equipment for a significant sum, thereby accounting for more than 5%-10% of their global sales. Semiconductor device manufacturers and packaging houses may consider repeated purchase in the future as they get attracted by the discounts and incentives. Thus, equipment vendors offer price discounts to have a sustaining customer base.

Further, the report states that one challenge in market is cyclical nature of semiconductor industry. The cyclical nature of the semiconductor equipment industry affects the operating results of the equipment vendors due to severe downturns. The equipment manufacturers face risks such as overcapacity, low demand, and high price competition. Changes in customer requirements due to new manufacturing capacity and advances in technology affect equipment manufacturers considerably.

The capital expenditure of semiconductor device manufacturers affects the semiconductor manufacturing equipment vendors. During the period of overcapacity, device manufacturers reduce their capital expenditure and demand for semiconductor manufacturing equipment. This results in underutilization of vendor factories. During this cyclical period, customers reduce purchases, delay delivery of ordered products, or cancel orders. This results in reduced net sales and backlog, delays in revenue recognition, and excess inventory for the vendors, which act as a major challenge for the vendors. In addition, high price competition due to low demand in the market affects their gross margins.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • ASM Pacific Technology (ASMPT)
  • Kulicke & Soffa
  • Palomar Technologies
  • Besi
  • DIAS Automation
  • Hesse
  • Hybond
  • SHINKAWA
  • Toray Engineering
  • West-Bond
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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