Global Semiconductor Advanced Packaging Market 2017-2021

  • ID: 4368869
  • Report
  • Region: Global
  • 84 pages
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Analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021

FEATURED COMPANIES

  • Amkor Technology
  • ChipMOS TECHNOLOGIES
  • HANA Micron
  • Nepes
  • Tianshui Huatian
  • Ultratech
  • MORE
About Semiconductor Advanced Packaging

Analysts forecast the global semiconductor advanced packaging market to grow at a CAGR of 8.45% during the period 2017-2021

Semiconductor packaging is carried out to provide protection to the wafer or substrate. The casing (package) is built from materials such as plastic, metal, glass, or ceramic and contains one or more semiconductor electronic components. Semiconductor advanced packaging is a key component of the semiconductor manufacturing process. The package of a semiconductor device is usually made of materials such as plastic, metal, ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion. It also has contact pins or leads used to connect external circuits to the device; the package also dissipates the heat produced in the device. Some of the advanced packaging technologies used in semiconductor device packaging are fan-out wafer-level packaging (FO WLP), flip-chip, fan-in wafer-level packaging (FI WLP), and 2.5D/3D.

Covered in this report

The report covers the present scenario and the growth prospects of the global semiconductor advanced packaging market for 2017-2021. To calculate the market size, the report considers the sale of semiconductor capital equipment to end-use segments.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
Global Semiconductor Advanced Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key Vendors
  • Advanced Semiconductor Engineering (ASE)
  • Amkor Technology
  • Samsung Semiconductor (SAMSUNG)
  • TSMC (Taiwan Semiconductor Manufacturing Company)
Other Prominent Vendors
  • China Wafer Level CSP
  • ChipMOS TECHNOLOGIES
  • FlipChip International
  • HANA Micron
  • Interconnect Systems (Molex)
  • Jiangsu Changjiang Electronics Technology (JCET)
  • King Yuan Electronics
  • Tongfu Microelectronics
  • Nepes
  • Powertech Technology (PTI)
  • SIGNETICS
  • Tianshui Huatian
  • Ultratech
  • UTAC
Market Drivers
  • Complex semiconductor IC designs
  • For a full, detailed list, view the full report
Market Challenges
  • Rapid technological changes
  • For a full, detailed list, view the full report
Market Trends
  • Changes in wafer size
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.

Research methodology is based on extensive primary and secondary research:
  • Primary research includes in-depth interviews with industry experts, vendors, resellers and customers
  • Secondary research includes the publisher's platform, industry publications, company reports, news articles, analyst reports, trade associations and the data published by government agencies
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • ChipMOS TECHNOLOGIES
  • HANA Micron
  • Nepes
  • Tianshui Huatian
  • Ultratech
  • MORE
PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Market outline
  • Semiconductor value chain
PART 05: Technology landscape
  • Back-end chip formation
  • Wafer-level vs die-level packaging
  • Roadmap of semiconductor packaging industry
  • Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 07: Segmentation by packaging technology
  • Global semiconductor advanced packaging market by technology
  • Flip-chip packaging
  • FI WLP
  • 2.5D/3D packaging
  • FO WLP
PART 08: Segmentation by device type
  • Global semiconductor advanced packaging market by device type
  • Analog and mixed ICs
  • MEMS and sensors
  • Logic and memory devices
  • Wireless connectivity devices
  • CMOS image sensors
PART 09: Geographical segmentation
  • Global semiconductor advanced packaging market by region
  • APAC
  • Americas
  • EMEA
PART 10: Decision framework

PART 11: Drivers and challenges
  • Market drivers
  • Market challenges
PART 12: Market trends
  • Changes in wafer size
  • Integration of semiconductor components in vehicles
  • Increase in number of M&A
  • Short product lifecycle of mobile devices
  • Increase in number of OSAT vendors
  • High need for semiconductor memory devices
  • Growing acceptance of wearable devices
PART 13: Vendor landscape
  • Competitive scenario
  • Leading vendors
  • Other prominent vendors
PART 14: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Semiconductor value chain
Exhibit 02: Description of semiconductor value chain
Exhibit 03: Back-end chip formation steps
Exhibit 04: Roadmap of semiconductor packaging industry
Exhibit 05: Block diagram for SoC
Exhibit 06: Block diagram of SiP
Exhibit 07:.5D IC block diagram
Exhibit 08: 3D IC block diagram
Exhibit 09: Old semiconductor IC packaging industry supply chain
Exhibit 10: New semiconductor IC packaging industry supply chain
Exhibit 11: Overview of global semiconductor advanced packaging market 2016
Exhibit 12: Global semiconductor advanced packaging market 2016-2021 ($ billions)
Exhibit 13: Five forces analysis
Exhibit 14: Global semiconductor advanced packaging market by technology 2016-2021
Exhibit 15: Revenue trend-line for technologies in advanced semiconductor packaging 2016-2021 ($ billions)
Exhibit 16: Global semiconductor advanced packaging market in flip-chip packaging 2016-2021 ($ billions)
Exhibit 17: Global semiconductor advanced packaging market FI WLP 2016-2021 ($ billions)
Exhibit 18: Global semiconductor advanced packaging market in 2.5D/3D packaging 2016-2021 ($ billions)
Exhibit 19: Global semiconductor advanced packaging market for fan-out WLP 2016-2021 ($ billions)
Exhibit 20: Global semiconductor advanced packaging market by device type 2016-2021
Exhibit 21: Revenue trend-line for global semiconductor advanced packaging market by device type 2016-2021 ($ billions)
Exhibit 22: Global semiconductor advanced packaging market for analog and mixed ICs 2016-2021 ($ billions)
Exhibit 23: Global semiconductor advanced packaging market for MEMS and sensors 2016-2021 ($ billions)
Exhibit 24: Global semiconductor advanced packaging market for logic and memory devices 2016-2021 ($ billions)
Exhibit 25: Global semiconductor advanced packaging market for wireless connectivity devices 2016-2021 ($ billions)
Exhibit 26: Global semiconductor advanced packaging market for CMOS image sensors 2016-2021 ($ billions)
Exhibit 27: Global semiconductor advanced packaging market by region 2016-2021
Exhibit 28: Revenue trend-line for global semiconductor advanced packaging market by region 2016-2021 ($ billions)
Exhibit 29: Semiconductor advanced packaging market in APAC 2016-2021 ($ billions)
Exhibit 30: Semiconductor advanced packaging market in the Americas 2016-2021 ($ billions)
Exhibit 31: Semiconductor advanced packaging market in EMEA 2016-2021 ($ billions)
Exhibit 32: Global IoT market by devices 2016-2021 ($ billions)
Exhibit 33: Global wrist computer market 2016-2021 ($ millions)
Exhibit 34: Product segmentation of global rugged handheld devices market 2016-2021 ($ millions)
Exhibit 35: Global semiconductor market trend 1992-2016 ($ billions)
Exhibit 36: Timeline: Advances in semiconductor wafer size
Exhibit 37: Global car shipment 2016-2021 (million units)
Exhibit 38: CAGR of 3D NAND and DRAM during 2016-2021
Exhibit 39: Global wearable devices market 2016-2021 ($ billions)
Exhibit 40: Other vendors in global semiconductor advanced packaging market 2016
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FEATURED COMPANIES

  • Amkor Technology
  • ChipMOS TECHNOLOGIES
  • HANA Micron
  • Nepes
  • Tianshui Huatian
  • Ultratech
  • MORE
New Research Report - Global Semiconductor Advanced Packaging Market 2017-2021

The publisher recognizes the following companies as the key players in the global semiconductor advanced packaging market: Advanced Semiconductor Engineering (ASE), Amkor Technology, Samsung Semiconductor (SAMSUNG), and TSMC (Taiwan Semiconductor Manufacturing Company).

Other Prominent Vendors in the market are: China Wafer Level CSP, ChipMOS TECHNOLOGIES, FlipChip International, HANA Micron, Interconnect Systems (Molex), Jiangsu Changjiang Electronics Technology (JCET), King Yuan Electronics, Tongfu Microelectronics, Nepes, Powertech Technology (PTI), SIGNETICS, Tianshui Huatian, Ultratech, and UTAC.

Commenting on the report, an analyst from the research team said: “The latest trend gaining momentum in the market is Changes in wafer size. The semiconductor industry has seen a drastic transition in wafer size over the last five decades (1910-2016). The industry is focusing on producing larger diameter wafers, which is expected to cut down the manufacturing cost by 20%-25%. As of 2016, the semiconductor industry is using 300-mm wafer, with foundries investing in developing more such fabs. For instance, SK Hynix is building an M14 fab for the 300-mm technology in South Korea.”

According to the report, one of the major drivers for this market is Complex semiconductor IC designs. The number of features and functionalities offered by consumer electronic devices is on the rise as electronic device manufacturers look to differentiate their offerings from those of competitors. Consequently, there has been increasing need for multifunctional ICs. Semiconductor device manufacturers have addressed this need by developing new and more complex architecture and designs for semiconductor ICs. An instance of this is the development of 3D ICs, which are compact, consume less power, and are highly efficient, but also have complex designs and elaborate manufacturing processes.

Further, the report states that one of the major factors hindering the growth of this market is Rapid technological changes. The rapid technological advancements in wafer processing have always been a major challenge faced by vendors in the semiconductor advanced packaging market. The semiconductor industry is continuously seeing transitions, such as the miniaturization of nodes and the increase in wafer sizes with respect to ultra-large-scale integration (ULSI) fabrication technology. This prompts semiconductor manufacturers to increase the development and adoption of new technologies, especially packaging solutions. Hence, to withstand the competition in the market, packaging vendors must develop new technologies that are in line with the changes in semiconductor IC architecture. As a result, manufacturers incur high costs on R&D.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • Advanced Semiconductor Engineering (ASE)
  • Amkor Technology
  • Samsung Semiconductor (SAMSUNG)
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • China Wafer Level CSP
  • ChipMOS TECHNOLOGIES
  • FlipChip International
  • HANA Micron
  • Interconnect Systems (Molex)
  • Jiangsu Changjiang Electronics Technology (JCET)
  • King Yuan Electronics
  • Tongfu Microelectronics
  • Nepes
  • Powertech Technology (PTI)
  • SIGNETICS
  • Tianshui Huatian
  • Ultratech
  • UTAC
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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