Global Semiconductor Assembly and Testing Services Market 2017-2021

  • ID: 4416642
  • Report
  • Region: Global
  • 75 pages
  • TechNavio
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FEATURED COMPANIES

  • Amkor Technology
  • Chipbond Technology
  • FormFactor
  • Powertech Technology
  • SIGNETICS
  • Unisem
  • MORE
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About Semiconductor Assembly and Testing Services

The number of electronic devices we use in our day-to-day life has been increasing in the past few decades. These devices range from simple media players, smartphones, laptops, and TVs to wearable smart watches and Internet of Things (IoT) devices such as connected thermostats, automated lighting, and remote health monitoring equipment. Semiconductor assembly and testing services (SATS) or outsourced semiconductor assembly and testing (OSAT) refers to the outsourcing of integrated circuit packaging and final product testing to third-party service providers.

The analysts forecast the global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and testing services market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
The report, Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • Amkor Technology
  • ASE Group
  • Jiangsu Changjiang Electronics Technology (JCET)
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)
Other prominent vendors
  • Chipbond Technology
  • ChipMOS TECHNOLOGIES
  • FormFactor
  • Formosa Advanced Technologies
  • King Yuan ELECTRONICS
  • Lingsen Precision Industries
  • PSi Technologies
  • SIGNETICS
  • Tessolve Semiconductor
  • Tianshui Huatian Technology
  • Unisem
  • UTAC
Market drivers
  • Growth of cloud-based servers and big data services
  • For a full, detailed list, view the full report
Market challenges
  • Highly cyclic nature of electronics industry
  • For a full, detailed list, view the full report
Market trends
  • Growth of advanced system in package (SiP) modules
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2021 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
You can request one free hour of the analyst’s time when you purchase this market report. Details are provided within the report.
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FEATURED COMPANIES

  • Amkor Technology
  • Chipbond Technology
  • FormFactor
  • Powertech Technology
  • SIGNETICS
  • Unisem
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

PART 01: Executive summary

PART 02: Scope of the report

PART 03: Research Methodology

PART 04: Introduction
  • Market outline
PART 05: Market landscape
  • Market overview
  • Market size and forecast
  • Five forces analysis
PART 06: Market segmentation by service
  • Market overview
  • Assembly services
  • Testing services
PART 07: Geographical segmentation
  • Market overview
  • Semiconductor assembly and testing services market in APAC
  • Semiconductor assembly and testing services market in Americas
  • Semiconductor assembly and testing services market in EMEA
PART 08: Decision framework

PART 09: Drivers and challenges
  • Market drivers
  • Market challenges
PART 10: Market trends
  • Growth of advanced system in package (SiP) modules
  • Increasing focus of semiconductor suppliers on core competencies
  • Growing demand for FOWLP solutions
PART 11: Vendor landscape
  • Competitive scenario
  • Other prominent vendors
PART 12: Key vendor analysis
  • Amkor Technology
  • ASE Group
  • Jiangsu Changjiang Electronics Technology (JCET)
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)
PART 13: Appendix
  • List of abbreviations
List of Exhibits
Exhibit 01: Major semiconductor chip end-users
Exhibit 02: Integrated chipset manufacturing process
Exhibit 03: Global semiconductor assembly and testing services market overview
Exhibit 04: Global semiconductor assembly and testing services market 2017-2021 ($ billions)
Exhibit 05: Five forces analysis
Exhibit 06: Global semiconductor assembly and testing services market by service type 2016-2021 (%)
Exhibit 07: Global semiconductor assembly and testing services market by service type 2016-2021 ($ billions)
Exhibit 08: Global semiconductor assembly and testing services market by assembly service 2016-2021 ($ billions)
Exhibit 09: Annual decline in global smartphone ASP (2012-2019)
Exhibit 10: Global semiconductor assembly and testing services market by testing services 2016-2021 ($ billions)
Exhibit 11: Global semiconductor assembly and testing services market by geography 2016 and 2021 (%)
Exhibit 12: Global semiconductor assembly and testing services market by geography 2016-2021 ($ billions)
Exhibit 13: Semiconductor assembly and testing services market in APAC 2017-2021 ($ billions)
Exhibit 14: Per capita GDP growth of selected Asian countries 2010-2015 ($)
Exhibit 15: Semiconductor assembly and testing services market in Americas ($ billions)
Exhibit 16: Semiconductor assembly and testing services market in EMEA ($ billions)
Exhibit 17: Global vehicle sales growth 2011-2016
Exhibit 18: Key vendors 2016
Exhibit 19: Other prominent vendors
Exhibit 20: Amkor Technology: Product portfolio
Exhibit 21: Amkor Technology: Key news
Exhibit 22: ASE Group: Product portfolio
Exhibit 23: ASE Group: Key news
Exhibit 24: Jiangsu Changjiang Electronics Technology: Product portfolio
Exhibit 25: Jiangsu Changjiang Electronics Technology: Key news
Exhibit 26: Powertech technology: Product portfolio
Exhibit 27: Powertech Technology: Key news
Exhibit 28: Silicon Precision Industries: Product portfolio
Exhibit 29: Siliconware Precision Industries: Key news
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FEATURED COMPANIES

  • Amkor Technology
  • Chipbond Technology
  • FormFactor
  • Powertech Technology
  • SIGNETICS
  • Unisem
  • MORE
1h Free Analyst Time

Speak directly to the analyst to clarify any post sales queries you may have.

New Report Released: – Global Semiconductor Assembly and Testing Services Market 2017-2021

The author of the report recognizes the following companies as the key players in the global semiconductor assembly and testing services market: Amkor Technology, ASE Group, Jiangsu Changjiang Electronics Technology (JCET), Powertech Technology, and Siliconware Precision Industries (SPIL).

Other Prominent Vendors in the market are: Chipbond Technology, ChipMOS TECHNOLOGIES, FormFactor, Formosa Advanced Technologies, King Yuan ELECTRONICS, Lingsen Precision Industries, PSi Technologies, SIGNETICS, Tessolve Semiconductor, Tianshui Huatian Technology, Unisem, and UTAC.

Commenting on the report, an analyst from the research team said: “One trend in the market is growth of advanced system in package (SiP) modules. A system in a package refers to the technology that enables the integration of several integrated circuits (ICs) within a single package. These packages combine many of the functions performed by different ICs into a single module, which can perform all these operations single-handedly.”

According to the report, one driver in the market is growth of cloud-based servers and big data services. Cloud computing is an Internet-based computing technology that allows devices with limited processing or storage capabilities to store and process data and resources on remote servers; the processed information is delivered back to the original device in real time. With the information collected by various devices becoming increasingly large and complex, the demand for cloud computing applications is growing exponentially.

Further, the report states that one challenge in the market is highly cyclic nature of electronics industry. The sale of electronic goods and equipment is highly cyclic in nature and their demand varies greatly with the economic situation; this leads to wide fluctuations in unit demand for the services of the SATS industry. SATS companies have low per unit sale margins and are heavily dependent on high volume demand to maintain their growth. Since the cycle of technology and seasonal demand are largely unpredictable, it becomes a challenge for many SATS companies to adjust rapidly to the changes in the market conditions.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
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1h Free Analyst Time

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  • Amkor Technology
  • ASE Group
  • Jiangsu Changjiang Electronics Technology (JCET)
  • Powertech Technology
  • Siliconware Precision Industries (SPIL)
  • Chipbond Technology
  • ChipMOS TECHNOLOGIES
  • FormFactor
  • Formosa Advanced Technologies
  • King Yuan ELECTRONICS
  • Lingsen Precision Industries
  • PSi Technologies
  • SIGNETICS
  • Tessolve Semiconductor
  • Tianshui Huatian Technology
  • Unisem
  • UTAC
Note: Product cover images may vary from those shown
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