Envelope Tracking Chips Market: By Technology; By Application; By End User & Geography - Forecast 2016-2023

  • ID: 4425256
  • Report
  • 160 pages
  • IndustryARC
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Envelope tracking is a power management technology for RF based device that assists in improving energy efficiency, enhancing battery life and minimizing power consumption. Globally demand for envelope tracking chips is being driven by growing demand for high end smartphones and tablet PCs and rising growth rate in the wireless platform market. In addition, hefty investments in power management technologies will create greater opportunities for the envelope tracking chips market. However, high band width requirement and complex architecture for designing ET module are key challenges faced by market.

The global envelope tracking chips market has been analyzed with respect to different parameters such as demand, supply and end-users. ET chip market based on technology is classified into cellular communications, wireless communications and satellite communications. The market is further classified based on application, end-user and by geography.

Geographically, Asia Pacific dominated the global envelope tracking chips market, and is projected to growth with significant growth rates during the forecast period, owing to high internet penetration, and rising demand for the consumer electronics products in this region. Wireless Communication is projected to grow at the highest rate in the ET chips market, among other technologies, owing to demand for ET to reduce the infrastructure involved in the communication. Owing to the rise in utilization of technologies such as Zigbee for compact and light application devices, the ET chips incorporation is estimated to rise. Among all the end-user the market for healthcare is estimated to have highest growth, owing to huge adoption of IoT and connected devices in medical technology and incorporation of ET chips into these devices to reduce power consumption and thereby, enhancing efficiency.

ET chips market is dominated by five companies, namely:
Qualcomm (U.S)
Samsung (South Korea)
Texas Instruments (U.S)
Efficient Power Conversion (U.S)

All these companies together held a major market share in 2015. These companies have significant presence in the envelope tracking chips market with wide service offerings and considerable brand image.

Sample companies profiled in this report are:
Qorvo, Inc. (U.S),
Maxim Integrated Products Inc (U.S),
Analog Devices, Inc (U.S),
Note: Product cover images may vary from those shown
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1. Envelope Tracking Chips - Market Overview
1.1. Introduction
1.2. Classification
1.3. Research Methodology
1.4. Assumptions

2. Executive Summary

3. Envelope Tracking Chips - Market Landscape
3.1. Market Share Analysis
3.2. Comparative Analysis
3.2.1. Product Benchmarking
3.2.2. End user profiling
3.2.3. Patent Analysis
3.2.4. Top 5 Financials Analysis

4. Envelope Tracking Chips - Market Forces
4.1. Market Drivers
4.1.1. Increasing demand of high end smartphones and tablet PCs
4.1.2. Drop in 4G devices prices to ladder up the demand of 4G services
4.1.3. Deployment of new base stations pacing at a significant rate across the globe
4.1.4. Power management technologies witnessing hefty investments by the OEMs
4.1.5. Demand for efficient power solutions in Wearable, IoT & Smart devices
4.1.6. Double digit growth rate reported in the Wireless Platform market
4.2. Market Constraints/Challenges
4.2.1. Complex architecture required for designing the ET module
4.2.2. High bandwidth requirement compared to conventional RF channel
4.3. Attractiveness of the Envelope Tracking Chips Industry
4.3.1. Power of Suppliers
4.3.2. Power of Customers
4.3.3. Threat of New entrants
4.3.4. Threat of Substitution
4.3.5. Degree of Competition

5. Envelope Tracking Chips Market - Strategic Analysis
5.1. Value Chain Analysis
5.2. Pricing Analysis
5.3. Opportunities Analysis
5.3.1. Next Generation Electronic Warfare System centered towards spectrum dominance
5.3.2. Dynamic Envelope Tracking chips in power supply systems of automobiles
5.3.3. 5G base station architecture, a perfect match for the ET chip applications
5.3.4. Requirement for improved power management systems for virtual reality and IoT devices
5.4. Product/Market Life Cycle Analysis
5.5. Suppliers and Distributors

6. Envelope Tracking Chips Market - By Technology
6.1. Introduction
6.2. Cellular Communications
6.2.1. 4G/ LTE
6.2.2. 3G/ WCDMA
6.2.3. Others
6.3. Wireless Communications
6.3.1. Zigbee
6.3.2. Bluetooth
6.3.3. Others
6.4. Satellite Communication

7. Envelope Tracking Chips Market - By Applications
7.1. Introduction
7.2. Smart Phones
7.3. Base Stations
7.4. IoT Devices (M2M)
7.5. Tactical Radios
7.6. Wearable Devices
7.7. Connected Home Devices
7.8. Tablets
7.9. GPS Tracking Devices (Personal, Defense, Marine)
7.10. Others
7.10.1. Wireless Network Enabled Surveillance System (WNESS)
7.10.2. Feature phones

8. Envelope Tracking Chips Market - By End User Industry
8.1. Introduction
8.2. Consumer Electronics
8.3. Space, Avionics & Defence
8.4. Communications and Telecom
8.5. Automotive
8.6. Healthcare
8.7. Others

9. Envelope Tracking Chips Market-Geographic Analysis
9.1. Introduction
9.2. Americas
9.2.1. U.S.
9.2.2. Canada
9.2.3. Mexico
9.2.4. Brazil
9.2.5. Others
9.3. Europe
9.3.1. U.K.
9.3.2. Germany
9.3.3. Russia
9.3.4. France
9.3.5. Others
9.4. APAC
9.4.1. China
9.4.2. Japan
9.4.3. Australia
9.4.4. India
9.4.5. Others
9.5. ROW
9.5.1. Middle East
9.5.2. Africa

10. Envelope Tracking Chips Market Entropy
10.1. New Product Launches
10.2. M&As, Collaborations, JVs and Partnerships

11. Company Profiles (Overview, Financials, SWOT Analysis, Developments, Product Portfolio)
11.1. Qualcomm, Inc.
11.2. Texas Instruments, Inc.
11.3. TriQuint Semiconductor, Inc.
11.4. Samsung Electronics Co., Ltd.
11.5. R2 Semiconductor, Inc.
11.6. Analog Devices, Inc.
11.7. Maxim Integrated
11.8. Linear Technology Corporation
11.9. Efficient Power Conversion Corporation
11.10. Artesyn Embedded Technologies
*More than 10 Companies are profiled in this Research Report*
"*Financials would be provided on a best efforts basis for private companies"

12. Appendix
12.1. Abbreviations
12.2. Sources
12.3. Bibliography
12.4. Compilation of Expert Insights
12.5. Disclaimer
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Note: Product cover images may vary from those shown