Encapsulation Technologies for Electronic Applications. Edition No. 2. Materials and Processes for Electronic Applications

  • ID: 4430023
  • Book
  • 550 Pages
  • Elsevier Science and Technology
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Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.

In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.

Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.

  • Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics
  • Includes coverage of environmentally friendly 'green encapsulants'
  • Presents coverage of faults and defects, and how to analyze and avoid them
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1. Introduction
2. Plastic Encapsulant Materials
3. Encapsulation Process Technology
4. Characterization of Encapsulant Properties
5. Encapsulation Defects and Failures
6. Defect and Failure Analysis Techniques for Encapsulated Microelectronics
7. Qualification and Quality Assurance
8. Trends and Challenges
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Zhang, Jiawei
Jiawei Zhang has 10 years of experience working in the development and implementation of advanced packages. He is currently Staff Engineer at Qualcomm, San Diego. Previously, he served as Development Senior Staff Engineer at Broadcom Corporation responsible for IC package co-design flow (Die/Package/System). He is experienced in advanced package, FCBGA, MCM, and SiP. He has published over 30 external papers, including two which won best Conference Paper Awards (2012 IMAPS and 2014 SMTAI) He has been honored with one Broadcom Corporation Outstanding Technical Achievement Awards for design flow. He also served on the IWLPC Technical Committee from 2013 to 2015 and as the session Chair in 2013.
Ardebili, Haleh
Dr. Haleh Ardebili has a BS honors degree in Engineering Science and Mechanics from Pennsylvania State University at University Park, MS degree in Mechanical Engineering from Johns Hopkins University and PhD degree in Mechanical Engineering from University of Maryland at College Park. She has three years of industry experience as research scientist at General Electric Global Research Center at Niskayuna, New York. She is a recipient of GE Invention Fulcrum of Progress Award. She has several years of experience teaching engineering courses at University of Houston. In Sep 2010, she joined as Assistant Professor in the Mechanical Engineering Department at University of Houston. Her research work is mainly focused on nanomaterials for Energy Storage and Electronics.
Pecht, Michael
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