Global PUR Adhesives in Electronics Market - Segmented by Product Type, Application, and Geography - Growth, Trends, and Forecast (2018 - 2023)

  • ID: 4515807
  • Report
  • Region: Global
  • 139 pages
  • Mordor Intelligence
until Mar 31st 2019
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  • 3M
  • Bostik SA
  • Dymax
  • Henkel AG & Co. KGaA
  • Indium Corporation
  • LG Chemical Ltd
  • MORE
The global PUR adhesives in electronics market is expected to register a CAGR of approximately 9.5% during 2018-2023 (the forecast period). The market is driven by factors, such as increasing demand from the automotive industry and growing technological dominance. In addition, few factors, such as government regulations about limiting VOC emissions, etc., act as restraints to the market.

Demand from the Automotive Sector Driving the Market

The automotive sector has been the main driver for the growth of the market. The demand from the automotive sector is mainly because of increasing demand for electric vehicles across the globe. According to International Energy Agency, there has been a rapid market evolution in electric cars, and this demand for electric vehicles is increasing the production of PUR adhesives. In addition, the market is technology-driven, and investments for the development of new technology and products are likely, which is expected to drive the market in the forecast period.

“Electrically Conductive Adhesives” the Dominant Segment

The market is segmented by application and product type. By product type, electrically conductive adhesives is expected to dominate the market, and is expected to grow at a healthy rate because of their superior intrinsic properties, like thermal dissipation functionality, making them suitable for many applications.

Asia-Pacific Leads the Market

The market is further segmented by geography into - North America, Europe, Asia-Pacific (APAC), and the Rest of the World (ROW). Asia-Pacific has the largest market for PUR adhesive, followed by North America and Europe. The Asia-Pacific region is expected to show positive growth during the forecast period, due to the increasing demand for consumer electronics, such as LCD/LED, smartphones, etc., along with advanced technological developments in the market.

Major Players: 3M, Ashland Inc., Avery Dennison Corporation, BASF SE, Beardow & Adams (Adhesives) Ltd, Bostik SA, Dow Chemicals Co. Dymax, Evonik, H.B. Fuller, Henkel AG & Co. KGaA, Huntsman Corporation, Jowat AG, LG Chemical Ltd, Sika AG, among others.

Reason to Purchase this Report

Current and future global PUR adhesives in Electronics market outlook in the developed and emerging markets
Analyzing various perspectives of the market with the help of Porter’s five forces analysis
Segment that is expected to dominate the market
Regions that are expected to witness the fastest growth during the forecast period
Identify the latest developments, market shares, and strategies employed by the major market players
3 months analyst support, along with the Market Estimate sheet (in excel)

Customization of the Report

This report can be customized to meet your requirements..
Note: Product cover images may vary from those shown
2 of 5


  • 3M
  • Bostik SA
  • Dymax
  • Henkel AG & Co. KGaA
  • Indium Corporation
  • LG Chemical Ltd
  • MORE
1. Introduction
1.1 Scope of the Report
1.2 Research Phases
1.3 Study Deliverables

2. Executive Summary

3. Market Insights
3.1 Industry Value Chain Analysis
3.2 Industry Attractiveness - Porter’s Five Forces Analysis
3.2.1 Bargaining Power of Suppliers
3.2.2 Bargaining Power of Consumers
3.2.3 Threat of New Entrants
3.2.4 Threat of Substitute Products and Services
3.2.5 Degree of Competition

4. Market Dynamics
4.1 Drivers
4.1.1 Increasing Demand from the Automotive Industry
4.1.2 Growing Technological Dominance
4.1.3 Other Drivers
4.2 Restraints
4.2.1 Impulsive Market Conditions and Product Costs
4.2.2 Other Restraints
4.3 Opportunities
4.3.1 Expansion and Acquisition of Local Businesses
4.3.2 Other Opportunities

5. Market Segmentation and Analysis - (Market size, Growth, and Forecast)
5.1 By Product Type
5.1.1 Electrically Conductive Adhesive
5.1.2 Thermally Conductive Adhesive
5.1.3 UV Curing Adhesive
5.1.4 Others
5.2 By Application
5.2.1 Surface Mounting
5.2.2 Conformal Coatings
5.2.3 Wire Tacking
5.2.4 Potting
5.2.5 Encapsulation

6. Regional Market Analysis (Market size, Growth, and Forecast)
6.1 Asia-Pacific
6.1.1 China
6.1.2 India
6.1.3 Japan
6.1.4 South Korea
6.1.5 Rest of APAC
6.2 Europe
6.2.1 Germany
6.2.2 United Kingdom
6.2.3 France
6.2.4 Italy
6.2.5 Rest of Europe
6.3 North America
6.3.1 United States
6.3.2 Canada
6.3.3 Mexico
6.3.4 Rest of North America
6.4 ROW
6.4.1 Brazil
6.4.2 Rest of the World

7. Future of the Market

8. Competitive Landscape
8.1 Mergers and Acquisitions, Joint Ventures, Collaborations, and Agreements
8.2 Market Share Analysis**
8.3 Strategies Adopted by Leading Players

9. Company Profiles (Overview, Financials**, Products & services, Recent Developments, and Analyst View)
9.1 3M
9.2 Ashland Inc.
9.3 Avery Dennison Corporation
9.5 Beardow & Adams (Adhesives) Ltd
9.6 Bostik SA
9.8 Dow Chemicals Co.
9.9 Dymax
9.10 Evonik
9.11 H.B. Fuller
9.12 Henkel AG & Co. KGaA
9.13 Hitachi Chemical Co. Ltd
9.14 Huntsman Corporation
9.15 Indium Corporation
9.16 Jowat AG
9.17 Kyocera Chemical Corporation
9.18 L.D. Davis
9.19 LG Chemical Ltd
9.20 Mitsui Chemicals Inc.
9.21 Nordson
9.22 Sika AG
*( List not exhaustive)

10. Disclaimer
**Subject to availability on the public domain
Note: Product cover images may vary from those shown
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4 of 5
  • 3M
  • Ashland Inc.
  • Avery Dennison Corporation
  • Beardow & Adams (Adhesives) Ltd
  • Bostik SA
  • Dow Chemicals Co.
  • Dymax
  • Evonik
  • H.B. Fuller
  • Henkel AG & Co. KGaA
  • Hitachi Chemical Co. Ltd
  • Huntsman Corporation
  • Indium Corporation
  • Jowat AG
  • Kyocera Chemical Corporation
  • L.D. Davis
  • LG Chemical Ltd
  • Mitsui Chemicals Inc.
  • Nordson
  • Sika AG
Note: Product cover images may vary from those shown
5 of 5
Note: Product cover images may vary from those shown