+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

Global Flexible Printed Circuit Market - Forecasts from 2018 to 2023

  • PDF Icon


  • 98 Pages
  • March 2018
  • Region: Global
  • Knowledge Sourcing Intelligence LLP
  • ID: 4518599
The global flexible printed circuit market is anticipated to witness a compound annual growth rate of 12.72% during the forecast period to reach a total market size of US$30.897 billion by 2023, increasing from US$15.063 billion in 2017. The demand for flexible printed circuit will be led by manufacturers of smartphones, other mobile devices, LCD display, connectivity antennas, and rechargeable batteries. Increasing adoption of smartphones, rechargeable batteries and connectivity antennas will drive the demand for flexible printed circuits. Some of the other factors driving the demand for these circuits are rising consumption of consumer electronics in developing countries, increasing investment in IoT by major companies, and growing applications in the automotive sector among many others. Quality performance and high packaging flexibility of flexible PCBs will continue to make them highly preferred interconnectivity solutions in the near future.

This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.

Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the pressure sensors value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.

Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the market.

Major industry players profiled as part of the report are LG Innotek, Amphenol- APC, Multi Circuit Boards, Ltd., Cirexx International, Inc., Wurth Elektronik GmbH & Co. KG, and All Flex Flexible Circuits, LLC among others.


The global flexible printed circuit market has been analyzed through following segments:

By Type
  • Single- Sided

  • Double Sided

  • Multilayer

  • Rigid- Flex

  • Others

By End-Use Industry
  • Consumer Electronics

  • Automotive

  • Industrial

  • Others

By Geography
  • North America

  • USA

  • Canada

  • Mexico

  • Others

  • South America

  • Brazil

  • Argentina

  • Others

  • Europe

  • Germany

  • France

  • United Kingdom

  • Spain

  • Others

  • Middle East and Africa

  • UAE

  • Israel

  • South Africa

  • Others

  • Asia Pacific

  • China

  • Japan

  • India

  • South Korea

  • Others

Table of Contents

1. Introduction
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline
2.1. Research Design
2.2. Secondary Sources
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness
5.1. Single- Sided
5.2. Double- Sided
5.3. Multilayer
5.4. Rigid- Flex
5.5. Others
6.1. Consumer Electronics
6.2. Automotive
6.3. Industrial
6.4. Others
7.1. North America
7.1.1. USA
7.1.2. Canada
7.1.3. Mexico
7.1.4. Others
7.2. South America
7.2.1. Brazil
7.2.2. Argentina
7.2.3. Others
7.3. Europe
7.3.1. Germany
7.3.2. France
7.3.3. United Kingdom
7.3.4. Spain
7.3.5. Others
7.4. Middle East and Africa
7.4.1. UAE
7.4.2. Israel
7.4.3. South Africa
7.4.4. Others
7.5. Asia Pacific
7.5.1. China
7.5.2. Japan
7.5.3. India
7.5.4. South Korea
7.5.5. Others
8.1. Market Share Analysis
8.2. Investment Analysis
8.3. Recent Deals
8.4. Strategies of Key Players
9.1. LG Innotek
9.1.1. Company Overview
9.1.2. Financials
9.1.3. Products and Services
9.1.4. Recent Developments
9.2. Amphenol- APC
9.2.1. Company Overview
9.2.2. Financials
9.2.3. Products and Services
9.2.4. Recent Developments
9.3. Multi Circuit Boards, Ltd.
9.3.1. Company Overview
9.3.2. Financials
9.3.3. Products and Services
9.3.4. Recent Developments
9.4. Epec, LLC
9.4.1. Company Overview
9.4.2. Financials
9.4.3. Products and Services
9.4.4. Recent Developments
9.5. Flexible Circuit
9.5.1. Company Overview
9.5.2. Financials
9.5.3. Products and Services
9.5.4. Recent Developments
9.6. 3M
9.6.1. Company Overview
9.6.2. Financials
9.6.3. Products and Services
9.6.4. Recent Developments
9.7. Cirexx International, Inc.
9.7.1. Company Overview
9.7.2. Financials
9.7.3. Products and Services
9.7.4. Recent Developments
9.8. Wurth Elektronik GmbH & Co. KG
9.8.1. Company Overview
9.8.2. Financials
9.8.3. Products and Services
9.8.4. Recent Developments
9.9. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
9.9.1. Company Overview
9.9.2. Financials
9.9.3. Products and Services
9.9.4. Recent Developments
9.10. All Flex Flexible Circuits, LLC
9.10.1. Company Overview
9.10.2. Financials
9.10.3. Products and Services
9.10.4. Recent Developments
List Of FiguresList Of Tables

Companies Mentioned

  • LG Innotek

  • Amphenol- APC

  • Multi Circuit Boards, Ltd.

  • Epec, LLC

  • Flexible Circuit

  • 3M

  • Cirexx International, Inc.

  • Wurth Elektronik GmbH & Co. KG

  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

  • All Flex Flexible Circui