This Microelectronics TOE profiles developments in silicon photonics, solid state lighting, wireless charging, and microLED displays. Innovations include optical comb source system for optical communication, wireless charging of electric vehicles on the drive, natural spectrum LEDs for better illumination, glass-based 3D photonic integrated circuit platform for optical interconnects, and a novel assembly technology for microLEDs.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, G
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
Table of Contents
Innovations in in Silicon Photonics, Solid State Lighting, Wireless Charging, and MicroLED Displays:
- Optical Comb Source System for Optical Communication
- Wireless Charging of Electric Vehicles on the Drive
- Natural Spectrum LEDs for Better Illumination
- Glass-based 3D Photonic Integrated Circuit Platform for Optical Interconnects
- Novel Assembly Technology for MicroLEDs
- Industry Contacts