Global Semiconductor Assembly and Packaging Services Market 2018-2022

  • ID: 4522308
  • Report
  • Region: Global
  • 147 pages
  • TechNavio
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FEATURED COMPANIES

  • Amkor Technology
  • ASE
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC
  • MORE
About Semiconductor Assembly and Packaging Services

Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.

The analysts forecast the global semiconductor assembly and packaging services market to grow at a CAGR of 4.87% during the period 2018-2022.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and packaging services market for 2018-2022. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography:
  • Americas
  • APAC
  • EMEA
The report, Global Semiconductor Assembly and Packaging Services Market 2018-2022, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
  • ASE
  • Amkor Technology
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC
Market drivers
  • Rising number of fabs
  • For a full, detailed list, view the full report
Market challenges
  • Requirement of high initial capital investment
  • For a full, detailed list, view the full report
Market trends
  • Advances in wafer size
  • For a full, detailed list, view the full report
Key questions answered in this report
  • What will the market size be in 2022 and what will the growth rate be?
  • What are the key market trends?
  • What is driving this market?
  • What are the challenges to market growth?
  • Who are the key vendors in this market space?
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Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • ASE
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC
  • MORE
PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE
  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis
PART 05: MARKET SIZING
  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022
PART 06: FIVE FORCES ANALYSIS
  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition
PART 07: MARKET SEGMENTATION BY APPLICATION
  • Segmentation by application
  • Comparison by application
  • Communication sector – Market size and forecast 2017-2022
  • Computing and networking sector – Market size and forecast 2017-2022
  • Industrial and automotive sector – Market size and forecast 2017-2022
  • Consumer electronics sector – Market size and forecast 2017-2022
  • Market opportunity by application
PART 08: MARKET SEGMENTATION BY PACKAGING TYPE
  • Segmentation by packaging type
  • Comparison by packaging type
  • WLP – Market size and forecast 2017-2022
  • Die level packaging – Market size and forecast 2017-2022
  • Market opportunity by technology
PART 09: MARKET SEGMENTATION BY SERVICE PROVIDER
  • Segmentation by service provider
  • Comparison by service provider
  • OSATs – Market size and forecast 2017-2022
  • IDMs – Market size and forecast 2017-2022
  • Foundries – Market size and forecast 2017-2022
  • Market opportunity by service provider
PART 10: CUSTOMER LANDSCAPE

PART 11: REGIONAL LANDSCAPE
  • Geographical segmentation
  • Regional comparison
  • APAC – Market size and forecast 2017-2022
  • Americas – Market size and forecast 2017-2022
  • EMEA – Market size and forecast 2017-2022
  • Key leading countries
  • South Korea
  • Taiwan
  • China
  • Japan
  • US
  • Market opportunity
PART 12: DECISION FRAMEWORK

PART 13: DRIVERS AND CHALLENGES
  • Market drivers
  • Market challenges
PART 14: MARKET TRENDS
  • Advances in wafer size
  • Integration of semiconductor components in automobiles
  • Short product lifecycle of mobile devices
  • Growing number of OSAT vendors in APAC
  • Rising trend of M&A in semiconductor packaging industry
  • Growing requirement for semiconductor memory devices
  • Rising acceptance of wearable devices
PART 15: VENDOR LANDSCAPE
  • Overview
  • Landscape disruption
  • Competitive scenario
PART 16: VENDOR ANALYSIS
  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • ASE
  • Amkor Technology
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC
PART 17: APPENDIX
  • List of abbreviations
List of Exhbits
Exhibit 01: Parent market
Exhibit 02: Global semiconductor market
Exhibit 03: Market characteristics
Exhibit 04: Market segments
Exhibit 05: Market definition - Inclusions and exclusions checklist
Exhibit 06: Market size 2017
Exhibit 07: Validation techniques employed for market sizing 2017
Exhibit 08: Global – Market size and forecast 2017-2022 ($ bn)
Exhibit 09: Global – Year-over-year growth 2018-2022 (%)
Exhibit 10: Five forces analysis 2017
Exhibit 11: Five forces analysis 2022
Exhibit 12: Bargaining power of buyers
Exhibit 13: Bargaining power of suppliers
Exhibit 14: Threat of new entrants
Exhibit 15: Threat of substitutes
Exhibit 16: Threat of rivalry
Exhibit 17: Market condition - Five forces 2017
Exhibit 18: Application – Market share 2017-2022 (%)
Exhibit 19: Comparison by application
Exhibit 20: Communication sector – Market size and forecast 2017-2022 ($ bn)
Exhibit 21: Communication sector – Year-over-year growth 2018-2022 (%)
Exhibit 22: Computing and networking sector – Market size and forecast 2017-2022 ($ bn)
Exhibit 23: Computing and networking sector – Year-over-year growth 2018-2022 (%)
Exhibit 24: Industrial and automotive sector – Market size and forecast 2017-2022 ($ bn)
Exhibit 25: Industrial and automotive sector – Year-over-year growth 2018-2022 (%)
Exhibit 26: Consumer electronics sector – Market size and forecast 2017-2022 ($ bn)
Exhibit 27: Consumer electronics sector – Year-over-year growth 2018-2022 (%)
Exhibit 28: Market opportunity by application
Exhibit 29: Packaging type – Market share 2017-2022 (%)
Exhibit 30: Comparison by packaging type
Exhibit 31: WLP – Market size and forecast 2017-2022 ($ bn)
Exhibit 32: WLP – Year-over-year growth 2018-2022 (%)
Exhibit 33: Die level packaging – Market size and forecast 2017-2022 ($ bn)
Exhibit 34: Die level packaging – Year-over-year growth 2018-2022 (%)
Exhibit 35: Market opportunity by packaging type
Exhibit 36: Service provider – Market share 2017-2022 (%)
Exhibit 37: Comparison by service provider
Exhibit 38: OSATs – Market size and forecast 2017-2022 ($ bn)
Exhibit 39: OSATs – Year-over-year growth 2018-2022 (%)
Exhibit 40: IDMs – Market size and forecast 2017-2022 ($ bn)
Exhibit 41: IDMs – Year-over-year growth 2018-2022 (%)
Exhibit 42: Foundries – Market size and forecast 2017-2022 ($ bn)
Exhibit 43: Foundries – Year-over-year growth 2018-2022 (%)
Exhibit 44: Market opportunity by service provider
Exhibit 45: Customer landscape
Exhibit 46: Global – Market share by geography 2017-2022 (%)
Exhibit 47: Regional comparison
Exhibit 48: APAC – Market size and forecast 2017-2022 ($ bn)
Exhibit 49: APAC – Year-over-year growth 2018-2022 (%)
Exhibit 50: Americas – Market size and forecast 2017-2022 ($ bn)
Exhibit 51: Americas – Year-over-year growth 2018-2022 (%)
Exhibit 52: EMEA – Market size and forecast 2017-2022 ($ bn)
Exhibit 53: EMEA – Year-over-year growth 2018-2022 (%)
Exhibit 54: Key leading countries
Exhibit 55: Market opportunity
Exhibit 56: Global semiconductor market trend 1992-2017 ($ billions)
Exhibit 57: Timeline for semiconductor wafer size advances
Exhibit 58: Forecasted car shipments 2017-2022 (millions of units)
Exhibit 59: CAGR of 3D NAND and DRAM over the forecast period
Exhibit 60: Vendor landscape
Exhibit 61: Landscape disruption
Exhibit 62: Vendors covered
Exhibit 63: Vendor classification
Exhibit 64: Market positioning of vendors
Exhibit 65: ASE: Overview
Exhibit 66: ASE – Business segments
Exhibit 67: ASE – Organizational developments
Exhibit 68: ASE – Geographic focus
Exhibit 69: ASE – Segment focus
Exhibit 70: ASE – Key offerings
Exhibit 71: Amkor Technology: Overview
Exhibit 72: Amkor Technology – Business segments
Exhibit 73: Amkor Technology – Organizational developments
Exhibit 74: Amkor Technology– Geographic focus
Exhibit 75: Amkor Technology – Segment focus
Exhibit 76: Amkor Technology – Key offerings
Exhibit 77: Intel: Overview
Exhibit 78: Intel– Business segments
Exhibit 79: Intel – Organizational developments
Exhibit 80: Intel – Geographic focus
Exhibit 81: Intel – Segment focus
Exhibit 82: Intel – Key offerings
Exhibit 83: SAMSUNG ELECTRONICS: Overview
Exhibit 84: SAMSUNG ELECTRONICS – Business segments
Exhibit 85: SAMSUNG ELECTRONICS – Organizational developments
Exhibit 86: SAMSUNG ELECTRONICS – Geographic focus
Exhibit 87: Samsung Electronics – Segment focus
Exhibit 88: SAMSUNG ELECTRONICS – Key offerings
Exhibit 89: SPIL - Vendor overview
Exhibit 90: SPIL – Business segments
Exhibit 91: SPIL – Organizational developments
Exhibit 92: SPIL – Geographic focus
Exhibit 93: SPIL – Segment focus
Exhibit 94: SPIL – Key offerings
Exhibit 95: TSMC: Overview
Exhibit 96: Taiwan Semiconductor Manufacturing Company (TSMC)– Business segments
Exhibit 97: TSMC – Organizational developments
Exhibit 98: TSMC – Geographic focus
Exhibit 99: TSMC – Segment focus
Exhibit 100: TSMC – Key offerings
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FEATURED COMPANIES

  • Amkor Technology
  • ASE
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC
  • MORE
New Report Released: – Global Semiconductor Assembly and Packaging Services Market 2018-2022

The author of the report recognizes the following companies as the key players in the global semiconductor assembly and packaging services market: ASE, Amkor Technology, Intel, SAMSUNG ELECTRONICS, SPIL, and TSMC.

Commenting on the report, an analyst from the research team said: “One trend in the market is advances in wafer size. The semiconductor industry has seen a drastic transition in wafer size since 1910. The industry has migrated to large diameter wafers to cut down costs by almost 20%-25%. The industry presently uses 300-mm wafers to manufacture ICs.”

According to the report, one driver in the market is rising number of fabs. Semiconductor fabs manufacture a range of semiconductor devices and components. These components are either designed in-house by IDMs or manufactured as per designs provided by the client to foundries.

Further, the report states that one challenge in the market is requirement of high initial capital investment. The establishment of a whole manufacturing setup requires a significant amount of capital investment, as new fab costs on an average $3-4 billion. Therefore, companies that have comparatively low-scale production of ICs outsource the manufacturing to foundries and OSATs such as TSMC and ASE.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.
Note: Product cover images may vary from those shown
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  • ASE
  • Amkor Technology
  • Intel
  • SAMSUNG ELECTRONICS
  • SPIL
  • TSMC
Note: Product cover images may vary from those shown
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Note: Product cover images may vary from those shown
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