Increasing Application as a Printed Circuit Board (PCB) Material
High-end copper foils are used in the manufacturing of single- and double-sided printed circuit boards (PCBs). PCBs usually consist of a woven glass epoxy base material, which is clad with copper on one or both sides of the board, with varying thickness. The development of PCBs offers the electronics industry a reliable and cost-effective way to inter-connect electronics components. With the growing global population and increasing disposable income of individuals, the demand for electronics devices, such as tablets, cell phones, mobile radios, electronic warfare apparatus, and guidance control systems is increasing. With the increasing implementation of PCBs in numerous electronic equipment and devices, the demand for high-end copper foils is expected to increase over the forecast period.
Growing Usage in Circuit Boards
Most of the electronics products manufactured contain printed circuit boards (PCBs). High-quality PCB manufacturing technology has allowed the electronic products manufacturers to produce smaller and more complex products. Rolled copper foil is used extensively for flexible circuit boards, where smooth surface is preferred. The demand for consumer gadgets, such as smartphones, PCs, tablets, and medical electronics products is rapidly increasing across the world, with India and China expected to remain at the top of market. As printed circuit boards are deployed in almost all electronics products, the application is likely to drive the demand for high-quality copper foil, over the forecast period.
Asia-Pacific to Dominate the Market
Asia-Pacific accounted for the largest share of over 65% of the global high-end copper foil market in 2017. China is the global leader in the electric car market and the government is offering attractive financial and non-financial incentives to boost the electric cars sales in the country. Additionally, the Indian electronics industry is one of the fastest growing in the world. The domestic demand for PCB is expected to register robust growth, due to the increasing demand from smartphones and the consumer electronics industry. Further, the increasing demand for circuit boards and batteries in the region is anticipated to boost the demand for high-end copper foil during the forecast period.
Major Players: Mitsui Mining & Smelting Co. Ltd, The Furukawa Electric Co. Ltd, JX Nippon Mining & Metals Corporation, and Olin Brass (Global Brass and Copper Holdings Inc.), among others.
July 2017: Mitsui Mining & Smelting Co. Ltd boosted the production for electro-deposited copper foil for flexible printed circuits.
May 2017: Mitsui Mining & Smelting Co. Ltd increased the monthly production of its ultra-thin copper foil with carrier product, to 3.3 million m2.
Reason to Purchase this Report
- Analyzing various perspectives of the market, with the help of Porter’s five forces analysis.
- The application that is expected to dominate the market.
- The regions that are expected to witness the fastest growth during the forecast period.
- Identify the latest developments, market shares, and strategies employed by the major market players.
- 3 months analyst support along with the Market Estimate sheet (In excel).
This report can be customized to meet your requirements. Please contact us for more information.
1.1 Research Phases
1.2 Scope of the Report
1.3 Study Deliverables
2. Executive Summary
3. Market Insights
3.1 Industry Value Chain Analysis
3.2 Industry Attractiveness - Porter's Five Forces Analysis
3.2.1 Bargaining Power of Suppliers
3.2.2 Bargaining Power of Consumers
3.2.3 Threat of New Entrants
3.2.4 Threat of Substitute Products and Services
3.2.5 Degree of Competition
4. Market Dynamics
4.1.1 Growing Application as a Printed Circuit Board (PCB) Material
4.1.2 Increasing Demand for Lithium-ion Batteries from the Transportation and Energy Storage Sectors
4.2.1 Development of Single Crystal Graphene Sheet as a Substitute for Copper Foil
4.3.1 Copper Foils in Transformer and Grid-level Energy Storage
5. Market Segmentation and Analysis (Market Size, Growth, and Forecast)
5.1 By Type
5.1.1 Rolled Copper Foil
5.1.2 Electrodeposited (ED) Copper Foil
5.2 By Application
5.2.1 Circuit Boards
5.2.3 Solar and Alternative Energy
6. Regional Market Analysis (Market Size, Growth, and Forecast)
6.1.4 South Korea
6.1.5 Australia & New Zealand
6.1.6 Rest of Asia-Pacific
6.2.4 United Kingdom
6.2.6 Rest of Europe
6.3 North America
6.3.1 United States
6.3.4 Rest of North America
6.4 South America
6.4.3 Rest of South America
6.5 Middle East & Africa
6.5.1 South Africa
6.5.2 Saudi Arabia
6.5.3 Rest of Middle East & Africa
7. Future of the Market
8. Competitive Landscape
8.1 Mergers & Acquisitions, Joint Ventures, Collaborations, and Agreements
8.2 Market Share Analysis**
8.3 Strategies Adopted by Leading Players
9. Company Profiles (Overview, Financials**, Products & Services, and Recent Developments)
9.1 Mitsui Mining & Smelting Co. Ltd
9.2 The Furukawa Electric Co. Ltd
9.3 JX Nippon Mining & Metals Corporation
9.4 Fukuda Metal Foil & Powder Co. Ltd
9.5 Chang Chun Petrochemical Co. Ltd
9.6 Targray Technology International Inc.
9.7 Olin Brass (Global Brass and Copper Holdings Inc.)
9.8 Sumitomo Metal Mining Co. Ltd
9.9 SH Copper Products Co. Ltd
9.10 Doosan Corporation
9.11 Civen Metal Material(Shanghai) Co. Ltd
9.12 UACJ Foil Corporation
*List not exhaustive
** Subject to availability on public domain
- Mitsui Mining & Smelting Co. Ltd.
- The Furukawa Electric Co. Ltd.
- JX Nippon Mining & Metals Corporation
- Fukuda Metal Foil & Powder Co. Ltd.
- Chang Chun Petrochemical Co. Ltd.
- Targray Technology International Inc.
- Olin Brass (Global Brass and Copper Holdings Inc.)
- Sumitomo Metal Mining Co. Ltd.
- SH Copper Products Co. Ltd.
- Doosan Corporation
- Civen Metal Material(Shanghai) Co. Ltd.
- UACJ Foil Corporation