Three-dimensional Integrated Circuit Market - Forecasts from 2018 to 2023

  • ID: 4542583
  • Report
  • 80 pages
  • Knowledge Sourcing Intelligence LLP
1 of 4

FEATURED COMPANIES

  • Amkor Technology
  • Aveni
  • Invensas
  • Stats ChipPAC Pte. Ltd.
  • Tezzaron Semiconductor
  • Xilinx, Inc.
  • MORE
The three dimensional integrated circuit market was valued at US$4.909 billion in 2017 and is expected to reach US$15.104 billion in 2023 growing at a CAGR of 20.60% during the forecast period. Growing demand for consumer electronics worldwide is the key driver of global 3D integrated circuit market as these ICs are used to minimize the size and reduce the cost of electronic products. An increasing number of smartphone users is augmenting the demand for 3D integrated circuits for high-functionality of smartphones along with other features such as high battery backup, HD display, multi-tasking abilities, and fast processing speed. By application, storage devices and sensors are projected to hold significant market share due to declining prices of sensors along with the improvement in designs. Furthermore, the emergence of newer applications such as graphics processor unit, cell broadband engine, hybrid memory, and low-density parity check decoder will provide a potential market for 3D integrated circuits in the forthcoming years. Geographically, Asia Pacific will witness significant market growth owing to escalating demand for various consumer electronic products such as smartphones, tablets, and laptops, coupled with booming automotive industry. However, the growth of global 3D integrated circuit market will be restrained by high costs and thermal and testing issues during the forecast period.

This research study examines the current market trends related to the demand, supply, and sales, in addition to the recent developments. Major drivers, restraints, and opportunities have been covered to provide an exhaustive picture of the market. The analysis presents in-depth information regarding the development, trends, and industry policies and regulations implemented in each of the geographical regions. Further, the overall regulatory framework of the market has been exhaustively covered to offer stakeholders a better understanding of the key factors affecting the overall market environment.

Identification of key industry players in the industry and their revenue contribution to the overall business or relevant segment aligned to the study have been covered as a part of competitive intelligence done through extensive secondary research. Various studies and data published by industry associations, analyst reports, investor presentations, press releases and journals among others have been taken into consideration while conducting the secondary research. Both bottom-up and top down approaches have been utilized to determine the market size of the overall market and key segments. The values obtained are correlated with the primary inputs of the key stakeholders in the pressure sensors value chain. The last step involves complete market engineering which includes analyzing the data from different sources and existing proprietary datasets while using various data triangulation methods for market breakdown and forecasting.

Market intelligence is presented in the form of analysis, charts, and graphics to help the clients in gaining faster and efficient understanding of the market.
Major industry players profiled as part of the report are Invensas, Amkor Technology, Xilinx, Inc., Tezzaron Semiconductor, Aveni, and Stats ChipPAC Pte. Ltd. among others.

Segmentation:

The three-dimensional integrated circuit market has been analyzed through following segments:

By Technology:
  • Monolithic
  • Wafer on Wafer
  • Die on Wafer
  • Die on Die
By Application:
  • MEMS
  • Storage Devices
  • Sensors
  • Others
By Geography:

North America
  • USA
  • Canada
  • Mexico
  • Others
South America
  • Brazil
  • Argentina
  • Others
Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
Middle East and Africa
  • UAE
  • Israel
  • South Africa
  • Others
Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Others
READ MORE
Note: Product cover images may vary from those shown
2 of 4

FEATURED COMPANIES

  • Amkor Technology
  • Aveni
  • Invensas
  • Stats ChipPAC Pte. Ltd.
  • Tezzaron Semiconductor
  • Xilinx, Inc.
  • MORE
1. INTRODUCTION
1.1. Market Overview
1.2. Market Definition
1.3. Scope of the Study
1.4. Currency
1.5. Assumptions
1.6. Base, and Forecast Years Timeline

2. RESEARCH METHODOLOGY
2.1. Research Design
2.2. Secondary Sources

3. EXECUTIVE SUMMARY

4. MARKET DYNAMICS
4.1. Market Segmentation
4.2. Market Drivers
4.3. Market Restraints
4.4. Market Opportunities
4.5. Porter’s Five Force Analysis
4.5.1. Bargaining Power of Suppliers
4.5.2. Bargaining Power of Buyers
4.5.3. Threat of New Entrants
4.5.4. Threat of Substitutes
4.5.5. Competitive Rivalry in the Industry
4.6. Life Cycle Analysis - Regional Snapshot
4.7. Market Attractiveness

5. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY TECHNOLOGY
5.1. Monolithic
5.2. Wafer on wafer
5.3. Die on wafer
5.4. Die on die

6. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY APPLICATION
6.1. MEMS
6.2. Storage Device
6.3. Sensors
6.4. Others

7. THREE-DIMENSIONAL INTEGRATED CIRCUIT MARKET BY GEOGRAPHY
7.1. North America
7.1.1. USA
7.1.2. Canada
7.1.3. Mexico
7.1.4. Others
7.2. South America
7.2.1. Brazil
7.2.2. Argentina
7.2.3. Others
7.3. Europe
7.3.1. Germany
7.3.2. France
7.3.3. United Kingdom
7.3.4. Spain
7.3.5. Others
7.4. Middle East and Africa
7.4.1. UAE
7.4.2. Israel
7.4.3. South Africa
7.4.4. Others
7.5. Asia Pacific
7.5.1. China
7.5.2. Japan
7.5.3. India
7.5.4. South Korea
7.5.5. Others

8. COMPETITIVE INTELLIGENCE
8.1. Market Share Analysis
8.2. Investment Analysis
8.3. Recent Deals
8.4. Strategies of Key Players

9. COMPANY PROFILES
9.1. Invensas
9.1.1. Company Overview
9.1.2. Financials
9.1.3. Products and Services
9.1.4. Recent Developments
9.2. Amkor Technology
9.2.1. Company Overview
9.2.2. Financials
9.2.3. Products and Services
9.2.4. Recent Developments
9.3. Xilinx, Inc.
9.3.1. Company Overview
9.3.2. Financials
9.3.3. Products and Services
9.3.4. Recent Developments
9.4. Tezzaron Semiconductor
9.4.1. Company Overview
9.4.2. Financials
9.4.3. Products and Services
9.4.4. Recent Developments
9.5. Aveni
9.5.1. Company Overview
9.5.2. Financials
9.5.3. Products and Services
9.5.4. Recent Developments
9.6. Stats ChipPAC Pte. Ltd.
9.6.1. Company Overview
9.6.2. Financials
9.6.3. Products and Services
9.6.4. Recent Developments
List is not exhaustive*
LIST OF FIGURES
LIST OF TABLES
Note: Product cover images may vary from those shown
3 of 4

Loading
LOADING...

4 of 4
  • Invensas
  • Amkor Technology
  • Xilinx, Inc.
  • Tezzaron Semiconductor
  • Aveni
  • Stats ChipPAC Pte. Ltd.
Note: Product cover images may vary from those shown
5 of 4
Note: Product cover images may vary from those shown
Adroll
adroll