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Advancements in Silicon Photonics, AI Chips, and Spintronics

  • ID: 4592782
  • Report
  • July 2018
  • Region: Global
  • 15 Pages
  • Frost & Sullivan

This Microelectronics TOE profiles developments in silicon photonics, AI chips, and spintronics. Innovations include a lock-in amplifier that accelerates cQED numerical computation, a platform for the development of silicon photonic integrated circuits, a high-speed optical interconnect, and augmenting computers with photonics for artificial intelligence.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Note: Product cover images may vary from those shown

Innovations in Silicon Photonics, AI Chips, and Spintronics

  • Lock-in Amplifier Accelerates cQED Numerical Computation
  • Platform for the development of Silicon Photonic Integrated Circuits
  • High-speed Optical Interconnect
  • Augmenting Computers with Photonics for Artificial Intelligence
  • Spintronics Enables Low-power and High-performance Isolators
  • Industry Contacts
Note: Product cover images may vary from those shown
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