Recap and Outlook for The Worldwide Wafer Foundry Industry in 2018

  • ID: 4607694
  • Report
  • Region: Global
  • 24 pages
  • Market Intelligence & Consulting Institute (MIC)
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The global wafer foundry industry is highly concentrated with the top-five players taking up about 76% of the total shipments. The increasing share of orders released by IDMs and the proliferation of emerging application ICs such as CPUs, GPUs, FPGAs, and ASICs have been major growth factors to drive the industry's growth over the years. In addition, the rise of automotive electronics, IoT, and 5G applications have also boosted the demand for fingerprint sensor ICs, driver ICs, GPS ICs, and RF ICs. Hence, the market is expected to continue the steady growth this year.

This report reviews the industry's development in 2017 and provides a future outlook for 2018 and beyond. Also included are development highlights of major players: TSMC, GlobalFoundries, UMC, Samsung, and SMIC.

List of Topics:

  • Development of the worldwide and Taiwanese wafer foundry industries, touching on their status of quo and their shipment value for the period 2015-2018
  • Development of the worldwide and Taiwanese wafer foundry industries, touching on their status of quo and their shipment value for the period 2015-2018
  • Chinese foundries' advanced process developments and developers and inventors of next generation memories such as MRAM, PCRAM, ReRAM FeRAM, and XPoint
  • Latest development of major players such as TSMC, GlobalFoundries, UMC, Samsung, and SMIC and includes global foundries' rankings for the period 2014-2017
  • Chinese foundries' advanced process developments and developers and inventors of next generation memories such as MRAM, PCRAM, ReRAM FeRAM, and XPoint
  • Latest development of major players such as TSMC, GlobalFoundries, UMC, Samsung, and SMIC and includes global foundries' rankings for the period 2014-2017
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  • Adesto
  • AMD
  • Apple
  • Avalanche Tech
  • Bitfury
  • Bitmain
  • Canaan
  • Celis
  • Crossbar
  • Cypress
  • EverSpin
  • Faraday Technology
  • Fujitsu
  • GlobalFoundries
  • HiSilicon
  • HuaHong
  • IBM
  • MediaTek
  • Micron
  • NXP
  • Panasonic
  • Powerchip
  • Qualcomm
  • Rohm
  • Samsung
  • SK Hynix
  • SMIC
  • Sony
  • Spin Transfer
  • Telechips
  • TI
  • Toshiba
  • TowerJazz
  • TSMC
  • UMC
  • USCXM
  • VIS
  • WD
  • Winbond
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