Advancements in AI-chipsets, Wearables, and Heads-up Displays

This Microelectronics TOE profiles developments in AI-chipsets, wearables, and HUDs. Smart helmet for distraction-free motorbike riding, multi-core SoC for HD imaging applications, AI-enabled wearable to improve patient doctor interaction, AR headsets enabling cyclists to ride in harsh weather conditions, and waveguide-based technology for compact automotive heads-up displays are in focus in this TOE.

The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

Keywords: AI chipset, artificial intelligence, wearables, head-up display, HUD, smart helmet, SoC, imaging, AR, augmented reality