In the semiconductor industry, packaging has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product, owing to the growing demand across various end-user verticals of the industry. The identification of 2.5D and 3D packaging mechanism, as of mid-2010, has made semiconductor manufacturers to extend their flip-chip and wafer-level capabilities, owing to their enhanced functionality. The advent of IoT, artificial intelligence (AI), and proliferation of sophisticated electronics are the factors driving the high-end application segment across the consumer electronics and automotive industries. These dynamics have increased the rate of adoption of the latest semiconductor packaging technologies, to meet the growing demand.
Collaboration of OSAT Players, Manufacturers, and Foundries to Change the Game
In the past few years, dramatic changes have taken place in the supply chain of the semiconductor industry. The semiconductor industry is no longer dominated by the big players. Companies are not just concentrating on must now follow a different path, competing not so much on their performance and price. Increasing concerns, regarding what data capture and communications services their chips enable, along with their ability to collaborate with other players across the IoT value chain, are making semiconductor companies to approach their markets.
Semiconductor companies must be able to distinguish their products in new ways. The ability to partner with downstream players is considered to be one of the biggest factors to achieve this differentiation. Collaboration of big companies, like companies Google, Amazon, Tesla, Microsoft, and AMD, with several major foundries in the market indicates the shift in market trends. On the other hand, many consumer electronics companies invest in R&D activities, in order to produce their own hardware to reduce the costs, thus fueling the demand for semiconductor packaging services across the globe.
Asia-Pacific to Spearhead the Demand
Asia-Pacific is one of the most active manufacturing hubs in the world. Countries, like China, Japan, South Korea, Indonesia, Singapore, and Australia, have witnessed heavy manufacturing in the consumer electronics and automotive & transportation sectors. This factor is a key source of demand for semiconductor packaging in the region. China is the largest source of demand for semiconductor packaging. It is the largest exporter of electronics in Asia- Pacific, with exports contributing to a significant share of the country’s GDP. The huge R&D investments in cutting-edge technology and shorter product-life cycles have driven the exports of electronic goods, across the globe. Signs of market consolidation are also evident in the Chinese market.
Many major players are collaborating to expand their packaging product capabilities. In 2015, the acquisition of STATSChipPAC by JCET, propelled JCET into the fourth place amongst OSATs (Outsourced Semiconductor Assembly and Test), marked a huge change in the Asia-Pacific market. Also, the policy framework released by the State Council of the People’s Republic of China in June 2014, which aims to make advanced packaging a technology priority across the semiconductor industry, is expected to propel the semiconductor packaging market in Asia-Pacific..
High Rate of Adoption observed in the Consumer Electronics Industry
The electronics market constantly demands higher power dissipation, faster speeds, and higher pin counts, along with smaller footprints and lower profiles. The miniaturization and integration of semiconductors has given a rise to smaller, lighter, and more portable devices, like tablets, smartphones, and the emerging IoT devices. Each iteration of the consumer electronics products is becoming smarter, lighter, and more energy efficient than its predecessors. This creates a huge expectation in the customers for the next iteration of product, which is a major selling point for the producers of consumer electronics.
This trend is clearly evident in the biggest smart phone brand, Apple. The Apple’s 2007 version of iPhone had involved just two wafer level packaging. By the time of third iteration of iPhone (iPhone 5), the device consisted of seven wafer level packaging. In 2016, the iPhone 7 series had about 44 wafer level packaging in the device. This is the case with all the other consumer electronics giants in the market. The constant need for developing better products to meet the ever-changing consumer needs and high competition in consumer electronics market are expected to drive the demand for semiconductor packaging in the sector.
Major Players: ASE Group, Amkor Technology, STATS ChipPAC/JCET, Siliconware Precision Industries Co. Ltd (SPIL), Powertech Technology Inc., UTAC Group, Intel Corporation, and Samsung Electronics Co. Ltd., among others.
Key Developments in the Market
October 2017 - At the company's technology conference in Santa Clara, California, AMD announced that it is working directly with Tesla. This collaboration is expected to benefit both the parties, especially Tesla as Global Foundries, which fabricates chips, has a wafer supply agreement in place with AMD through 2020.
May 2017 - Amkor Technology acquired Nanium SA, a manufacturer of WLFO technology. The acquisition is aimed at strengthening Amkor in the fast-growing market of wafer-level packaging for smartphones, tablets, and other applications.
Reasons to Purchase This Report
- Current and future of semiconductor packaging market outlook in the developed and emerging markets
- Analyzing various perspectives of the market with the help of Porter’s five forces analysis
- The segment that is expected to dominate the market
- Regions that are expected to witness fastest growth during the forecast period
- Identify the latest developments, market shares and strategies employed by the major market players.
- 3 months analyst support along with the Market Estimate sheet (in excel).
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1.1 Study Deliverables
1.2 Study Assumptions
1.3 Market Definition
2. Research Methodology
2.1 Research Phases
2.2 Analysis Methodology
3. Executive Summary
4. Market Analysis
4.1 Market Overview
4.2 Introduction to Market Drivers and Restraints
4.3 Market Drivers
4.3.1 Growing Consumption of Semiconductor Devices Across Industries
4.3.2 Need for Miniaturization of Semiconductor Devices
4.4 Market Restraints
4.4.1 Hgh Initial Investment and Increasing Complexity of Semiconductor Devices
4.5 Industry Attractiveness - Porter's Five Forces
4.5.1 Bargaining Power Of Suppliers
4.5.2 Bargaining Power Of Consumers
4.5.3 Threat Of New Entrants
4.5.4 Threat Of Substitute Product
4.5.5 Competitive Rivalry Within The Industry
4.6 Value Chain Analysis
5. Market Segmentation - By Packaging Platform
5.1 Flip Chip
5.2 Embedded Die
5.3 Fan-In Wafer Level Packaging (Fi Wlp)
5.4 Fan-Out Wafer Level Packaging (Fo Wlp)
6. Market Segmentation - By End-User Industry
6.1 Consumer Electronics Industry
6.2 Aerospace And Defense
6.3 Medical Devices
6.4 Communications And Telecom
6.5 Automotive Industry
6.6 Energy And Lighting
7. Market Segmentation - By Geography
7.1 North America
7.4 Middle East And Africa
7.5 Latin America
8. Competitive Intelligence
8.1 ASE Group
8.2 Amkor Technology
8.3 Jcet/Stats Chippac Ltd.
8.4 Siliconware Precision Industries Co., Ltd (Spil)
8.5 Powertech Technology Inc.
8.6 Tianshui Huatian Technology Co., Ltd
8.7 Fujitsu Ltd.
8.8 UTAC Group
8.9 Chipmos Technologies Inc.
8.10 Chipbond Technology Corporation
8.11 Intel Corporation
8.12 Samsung Electronics Co Ltd
8.13 Unisem (M) Berhad
8.14 Interconnect Systems, Inc. (ISI)
*List Not Exhaustive
9. Investment Analysis
10. Future of the Market