This Microelectronics TechVision Opportunity Engine profiles developments in molecular engineering, traffic control systems, smart lighting, and wafer bonding. Innovations include engineering microelectronic devices on the molecular level, 3D AI identification to relieve traffic jams, a smart light bulb, a switch that enables Internet of Things, dual-layer materials that make better bonding of fan-out wafers, and a switch for harvesting energy at the press of a button.
The Microelectronics TechVision Opportunity Engine (TOE) captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).
Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.
1. Innovations in Molecular Engineering, Traffic Control Systems, Smart Lighting, and Wafer Bonding
- Engineering Microelectronic Devices on the Molecular Level
- 3D AI Identification To Relieve Traffic Jams
- Smart Light Bulb and Switch Enables Internet of Things
- Dual-layer Materials Make Better Bonding of Fan-out Wafers
- Switch Harvests Energy from Pressing a Button
- Industry Contacts