+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

PRINTER FRIENDLY

Global Radiation Hardened Electronics Market: Focus on Manufacturing Techniques (Rad-Hard by Design (RHBD), Rad-Hard by Process (RHBP), and Rad-Hard by Software (RHBS)); Component Type; and End Users - Analysis and Forecast, 2018-2023

  • ID: 4750792
  • Report
  • Region: Global
  • 206 pages
  • BIS Research
1 of 6
The Global Radiation Hardened Electronics Market Anticipated to Reach $1.71 Billion by 2023

FEATURED COMPANIES

  • Analog Devices Inc.
  • BAE Systems
  • Data Device Corporation
  • Maxwell Technologies Inc.
  • Micropac Industries Inc.
  • pSemi Corporation
  • MORE

The global radiation hardened electronics market is expected to witness stable growth during the forecast period 2018-2023, due to factors such as the increase of space missions and developing reconfigurable components for communication, navigation, science, space exploration, and remote sensing. The radiation hardened electronics market comprises sophisticated radiation hardened electronics systems used for various space, military, and commercial applications. Radiation hardened electronics components play a critical role in sustaining harmful space radiations, thus preventing physical damage and failure of the components. The global radiation hardened electronics market is expected to grow, owing to the increasing number of commercial satellites and increasing use of radiation hardened products in the military and other harsh environment applications.

According to the analysis, the global radiation hardened electronics market generated $1.45 billion in 2018 and is estimated to grow at a CAGR of 3.34%, during 2018-2023. Region-wise, North America dominated the global radiation hardened electronics market in 2017, with the U.S. acquiring the most significant market share, globally. However, Asia-Pacific is expected to pace at the highest growth rate during the forecast period, 2018-2023.

The following points provide a detailed description of the report content and the topics covered in the report:

  • The study examines the prime supply-side factors, which affect the growth of the market, along with the current and future trends, market drivers, restraints, and challenges prevalent in the global radiation hardened electronics market.
  • A detailed market share analysis, which focuses on the key market developments and strategies, followed by the top players in the market, has been included in this report. Additionally, the report includes competitive benchmarking of the players in the global radiation hardened electronics market.
  • A detailed Porter’s Five Forces has been included in the report.
  • This report identifies the global radiation hardened electronics market under different segments such as component types, manufacturing techniques, end users, and region.
  • The global radiation hardened electronics market for the major regions, including North America, Europe, Asia-Pacific, and Latin America, Middle East, and Africa, has been analyzed in the report.
  • In the company profiles section, the study provides a detailed analysis of 15 key players in the global radiation hardened electronics market, namely, Analog Devices Inc., BAE Systems, Cobham plc, Data Device Corporation, Honeywell International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronic Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx. This section covers their business financials, company snapshots, key products and services, major developments, and the individual SWOT analysis.

*Enterprisewide customers will receive an Excel spreadsheet containing additional data.*

Note: Product cover images may vary from those shown
2 of 6

FEATURED COMPANIES

  • Analog Devices Inc.
  • BAE Systems
  • Data Device Corporation
  • Maxwell Technologies Inc.
  • Micropac Industries Inc.
  • pSemi Corporation
  • MORE

Executive Summary

1 Market Dynamics
1.1 Market Drivers
1.1.1 Advancement in Microprocessor and FPGA Technologies
1.1.2 Rising Demand from Communication Satellite Segment
1.1.3 Increasing Space Missions
1.2 Market Challenges
1.2.1 High Designing and Developing Cost
1.2.2 Difficulties in Creating Real Testing Environment
1.3 Market Opportunities
1.3.1 Increasing demand of COTS in Healthcare and Consumer Electronics
1.3.2 Increasing Demand for Reconfigurable Radiation Hardened Components

2 Competitive Insights
2.1 Key Strategies and Developments
2.1.1 New Product Launch
2.1.2 Acquisitions
2.1.3 Partnerships, Agreements, and Contracts
2.1.4 Other Developments
2.2 Competitive Benchmarking
2.3 Market Share Analysis

3 Industry Analysis
3.1 Overview
3.2 Comparison of Radiation Hardened Products Standard Requirements for End User
3.3 Evolving Radiation Hardened Electronics in New Space
3.4 Radiation Hardened Electronics Manufacturers and Certifications
3.5 Supply Chain Analysis
3.6 Industry Attractiveness: Porter’s Five Forces
3.6.1 Threat from New Entrants
3.6.2 Threat from Substitutes
3.6.3 Bargaining Power of Buyers
3.6.4 Bargaining Power of Suppliers
3.6.5 Intensity of Competitive Rivalry

4 Global Radiation Hardened Electronics Market, 2017 to 2023
4.1 Assumptions and Limitations
4.2 Market Overview

5 Global Radiation Hardened Electronics Market (by Manufacturing Technique)
5.1 Market Overview
5.2 Rad-Hard by Design (RHBD)
5.2.1 Total Ionizing Doze
5.2.2 Single Event Effect
5.3 Rad-Hard by Process (RHBP)
5.3.1 Silicon on Insulator (SOI)
5.3.2 Silicon on Sapphire (SOS)
5.4 Rad-Hard by Software (RHBS)

6 Global Radiation Hardened Electronics Market (by Component Type)
6.1 Market Overview
6.2 Microprocessors and Controllers
6.3 Discrete Semiconductors
6.4 Power Sources
6.5 Memory
6.6 Field-Programmable Gate Array
6.7 Analog and Mixed Signals
6.8 Sensors
6.9 Application-Specific Integrated Circuit
6.10   Others

7 Global Radiation Hardened Electronics Market (by End User)
7.1 Market Overview
7.2 Space
7.2.1 New Space
7.2.2 Conventional Space
7.2.3 Space End-User Market by QLM V Qualification
7.2.4 Business Opportunities for Radiation Hardened Electronics in Small Satellite
7.3 Military
7.3.1 Military End-User Market by QLM Q Qualification
7.4 Nuclear Power Plants
7.5 Others

8 Global Radiation Hardened Electronics Market (by Region)
8.1 Market Overview
8.2 North America
8.2.1 North America Radiation Hardened Electronics Market Size (by End User)
8.2.2 North America Radiation Hardened Electronics Market Size (by Component Type)
8.2.3 North America Radiation Hardened Electronics Market Size (by Manufacturing Technique)
8.2.4 North America Radiation Hardened Electronics Market Size (by Country)
8.2.4.1 The U.S.
8.2.4.1.1 The U.S. Market (by ITAR Affiliation)
8.2.4.2 Canada
8.2.4.3 Rest-of-North America
8.3 Europe
8.3.1 Europe Radiation Hardened Electronics Market Size (by End User)
8.3.2 Europe Radiation Hardened Electronics Market Size (by Component Type)
8.3.3 Europe Radiation Hardened Electronics Market Size (by Manufacturing Technique)
8.3.4 Europe Radiation Hardened Electronics Market Size (by Country)
8.3.4.1 The U.K.
8.3.4.2 Germany
8.3.4.3 France
8.3.4.4 Russia
8.3.4.5 Spain
8.3.4.6 Rest-of-Europe
8.4 Asia-Pacific
8.4.1 Asia-Pacific Radiation Hardened Electronics Market Size (by End User)
8.4.2 Asia-Pacific Radiation Hardened Electronics Market Size (by Component Type)
8.4.3 Asia-Pacific Radiation Hardened Electronics Market Size (by Manufacturing Technique)
8.4.4 Asia-Pacific Radiation Hardened Electronics Market Size (by Country)
8.4.4.1 China
8.4.4.2 Japan
8.4.4.3 South Korea
8.4.4.4 Australia
8.4.4.5 India
8.4.4.6 Rest-of-Asia-Pacific
8.5 Rest-of-the-World
8.5.1 Rest-of-the-World Radiation Hardened Electronics Market Size (by End User)
8.5.2 Rest-of-the-World Radiation Hardened Electronics Market Size (by Component Type)
8.5.3 Rest-of-the-World Radiation Hardened Electronics Market Size (by Manufacturing Technique)
8.5.4 Rest-of-the-World Radiation Hardened Electronics Market Size (by Country)
8.5.4.1 Brazil
8.5.4.2 U.A.E.
8.5.4.3 South Africa
8.5.4.4 Mexico

9 Company Profiles
9.1 Overview
9.2 Analog Devices Inc.
9.2.1 Company Overview
9.2.2 Product and Services
9.2.3 Overall Financials
9.2.4 Financial Summary
9.2.5 SWOT Analysis
9.3 BAE Systems
9.3.1 Company Overview
9.3.2 Products and Services
9.3.3 Overall Financials
9.3.4 Financial Summary
9.3.5 SWOT Analysis
9.4 Cobham plc
9.4.1 Company Overview
9.4.2 Products and Services
9.4.3 Overall Financials
9.4.4 Financial Summary
9.4.5 SWOT Analysis
9.5 Data Device Corporation
9.5.1 Company Overview
9.5.2 Corporate Summary
9.5.3 Products and Services
9.5.4 SWOT Analysis
9.6 Honeywell International Inc.
9.6.1 Company Overview
9.6.2 Products and Services
9.6.3 Overall Financials
9.6.4 Financial Summary
9.6.5 SWOT Analysis
9.7 IBM Corporation
9.7.1 Company Overview
9.7.2 Product and Services
9.7.3 Overall Financials
9.7.4 Financial Summary
9.7.5 SWOT Analysis
9.8 Infineon Technologies Inc.
9.8.1 Company Overview
9.8.2 Products and Services
9.8.3 Overall Financials
9.8.4 Financial Summary
9.8.5 SWOT Analysis
9.9 Microchip Technology Inc.
9.9.1 Company Overview
9.9.2 Products and Services
9.9.3 Overall Financials
9.9.4 Financial Summary
9.9.5 SWOT Analysis
9.10   Micropac Industries Inc.
9.10.1 Company Overview
9.10.2 Corporate Summary
9.10.3 SWOT Analysis
9.11   Renesas Electronics Corporation
9.11.1 Company Overview
9.11.2 Products and Services
9.11.3 Overall Financials
9.11.4 Financial Summary
9.11.5 SWOT Analysis
9.12   Solid State Devices Inc.
9.12.1 Company Overview
9.12.2 Corporate Summary
9.12.3 Products and Services
9.12.4 SWOT Analysis
9.13   STMicroelectronics N.V
9.13.1 Company Overview
9.13.2 Products and Services
9.13.3 Overall Financials
9.13.4 Financial Summary
9.13.5 SWOT Analysis
9.14   Texas Instruments Inc.
9.14.1 Company Overview
9.14.2 Products and Services
9.14.3 Overall Financials
9.14.4 Financial Summary
9.14.5 SWOT Analysis
9.15   The Boeing Company
9.15.1 Company Overview
9.15.2 Product and Services
9.15.3 Overall Financials
9.15.4 Financial Summary
9.15.5 SWOT Analysis
9.16   Xilinx Inc.
9.16.1 Company Overview
9.16.2 Products and Services
9.16.3 Overall Financials
9.16.4 Financial Summary
9.16.5 SWOT Analysis
9.17   Other Key Players
9.17.1 Anaren Inc.
9.17.2 Maxwell Technologies Inc.
9.17.3 Microsemi Corporation
9.17.4 pSemi Corporation
9.17.5 TT Electronics

10 Research Scope & Methodology
10.1 Scope of the Report
10.2 Global Radiation Hardened Electronics Market Research Methodology

List of Tables
Table 1: Market Snapshot: Global Radiation Hardened Electronics Market, 2017 and 2023
Table 1.1: Impact Analysis of Market Drivers
Table 1.2: Impact Analysis of Market Challenges
Table 1.3: Impact Analysis of Market Opportunities
Table 1.4 Satellite Launches, 2016-2018
Table 1.5 Satellite Launches, 2017
Table 1.6 Comparison between COTS and QML Rad-Hard
Table 2.1: Product Launch
Table 2.2: Acquisitions
Table 2.3: Partnerships, Agreements, and Contracts in the Radiation Hardened Electronics Market
Table 2.4: Other Developments
Table 3.1: End User Specifications
Table 3.2: List of Certifications
Table 3.3: Analysing Factors of Threat from New Entrants
Table 3.4: Analysing Factors of Threat from Substitutes
Table 3.5: Analysing Factors of Bargaining Power of Buyers
Table 3.6: Analyzing Factors of Bargaining Power of Suppliers
Table 3.7: Analysing Factors of Intensity of Competitive Rivalry
Table 5.1: Global Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
Table 6.1: Global Radiation Hardened Electronics Market (by Component Type), 2017-2023
Table 6.2: Microprocessors and Controllers Market (by Qualified Manufacturers List)
Table 6.3: Discrete Semiconductor Market (by Qualified Manufacturers List):
Table 6.4: Power Sources Market (by Qualified Manufacturers List):
Table 6.5: Memory Market (by Qualified Manufacturers List):
Table 6.6: Field-Programmable Gate Array (FPGAs) Market (by Qualified Manufacturers):
Table 6.7: Sensors Market (by Qualified Manufacturers):
Table 6.8: Application-Specific Integrated Circuit (ASIC) Market (by Qualified Manufacturers):
Table 7.1: Global Radiation Hardened Electronics Market (by End User), 2017-2023
Table 7.2: Global Radiation Hardened Electronics Market (by Space), 2017-2023
Table 8.1: Global Radiation Hardened Electronics Market (by Region), 2017-2023
Table 8.2: North America Radiation Hardened Electronics Market (by End User), 2017-2023
Table 8.3: North America Radiation Hardened Electronics Market (by Components), 2017-2023
Table 8.4: North America Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
Table 8.5: Europe Radiation Hardened Electronics Market (by End User), 2017-2023
Table 8.6: Europe Radiation Hardened Electronics Market (by Components), 2017-2023
Table 8.7: Europe Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
Table 8.8: Asia-Pacific Radiation Hardened Electronics Market (by End User), 2017-2023
Table 8.9: Asia-Pacific Radiation Hardened Electronics Market (by Components), 2017-2023
Table 8.10: Asia-Pacific Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
Table 8.11: Rest of the World Radiation Hardened Electronics Market (by Components), 2017-2023
Table 8.12: Rest of the World Radiation Hardened Electronics Market (by Manufacturing Technique), 2017-2023
Table 8.13: Rest-of-the-World Radiation Hardened Electronics Market (by End User) 2017-2023

List of Figures
Figure 1: Global Radiation Hardened Electronics Market Snapshot
Figure 2: Global Radiation Hardened Electronics Market (by Component Type), 2017 and 2023
Figure 3: Global Radiation Hardened Electronics Market (by Manufacturing Technique), 2017 and 2023
Figure 4: Global Radiation Hardened Electronics Market (by End User), 2017 and 2023
Figure 5: Global Radiation Hardened Electronics Market: Global Scenario, 2017 and 2023
Figure 1.1: Market Dynamics Snapshot
Figure 2.1: Key Strategies Adopted by Market Players
Figure 2.2: Percentage Share of Strategies Adopted by the Market Players, January 2015 - October 2018
Figure 2.3: Competitive Benchmarking, 2017
Figure 2.4: Market Share of Leading Players in Global Radiation Hardened Electronics Market, 2017
Figure 3.1: Supply Chain Analysis
Figure 3.2: Radiation Hardened Electronics: Porter’s Five Forces Analysis
Figure 4.1: Global Radiation Hardened Electronics Market, 2018-2023
Figure 5.1: Global Radiation Hardened Market (by Manufacturing Technique)
Figure 5.2: Rad-Hard by Design, 2017 – 2023
Figure 5.3: Rad-Hard by Process, 2017 – 2023
Figure 5.4: Rad-Hard by Software, 2017 - 2023
Figure 6.1: Classification of Radiation Hardened Electronics Market (by Component Type)
Figure 6.2: Global Radiation Hardened Electronics Market (by Microprocessors and Controllers), 2017 – 2023
Figure 6.3: Global Radiation Hardened Electronics Market (by Discrete Semiconductors), 2017 – 2023
Figure 6.4: Global Radiation Hardened Electronics Market (by Power Sources), 2017 – 2023
Figure 6.5: Global Radiation Hardened Electronics Market (by Memory), 2017-2023
Figure 6.6: Global Radiation Hardened Electronics Market (by Field-Programmable Gate Array), 2017 – 2023
Figure 6.7: Global Radiation Hardened Electronics Market (by Analog and Mixed Signals), 2017 – 2023
Figure 6.8: Global Radiation Hardened Electronics Market (by Sensors), 2017 - 2023
Figure 6.9: Global Radiation Hardened Electronics Market (by Application-Specific Integrated Circuit), 2017 – 2023
Figure 6.10: Global Radiation Hardened Electronics Market (by Others), 2017-2023
Figure 7.1: Classification of Radiation Hardened Electronics Market (by End User)
Figure 7.2: Global Radiation Hardened Electronics Market (by Space), 2017 – 2023
Figure 7.3: Global Radiation Hardened Electronics Market (by Military), 2017 - 2023
Figure 7.4: Global Radiation Hardened Electronics Market (by Nuclear Power Plants), 2017-2023
Figure 7.5: Global Radiation Hardened Electronics Market (by Others), 2017 - 2023
Figure 8.1: Classification of Radiation Hardened Electronics Market (by Region)
Figure 8.2: Regional Distribution of the Global Radiation Hardened Electronics Market, 2017 and 2023
Figure 8.3: North America Radiation Hardened Electronics Market, 2017– 2023
Figure 8.4: The U.S. Radiation Hardened Electronics Market, 2017–2023
Figure 8.5: Canada Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.6: Rest-of-North America Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.7: Europe Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.8: The U.K. Radiation Hardened Electronics Market, 2017–2023
Figure 8.9: Germany Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.10: France Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.11: Russia Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.12: Spain Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.13: Rest-of-Europe Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.14: Asia-Pacific Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.15: China Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.16: Japan Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.17: South Korea Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.18: Australia Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.19: India Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.20: Rest-of-Asia-Pacific Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.21: Rest-of-the-World Radiation Hardened Electronics Market, 2017–2023
Figure 8.22: Brazil Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.23: U.A.E. Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.24: South Africa Radiation Hardened Electronics Market, 2017 – 2023
Figure 8.25: Mexico Radiation Hardened Electronics Market, 2017 – 2023
Figure 9.1: Share of Key Companies
Figure 9.2: Analog Devices Inc.: Overall Financials, 2015-2017
Figure 9.3: Analog Devices Inc.: Business Revenue Mix, 2015-2017
Figure 9.4: Analog Devices Inc.: Region Revenue Mix, 2015-2017
Figure 9.5: SWOT Analysis – Analog Devices Inc.
Figure 9.6: BAE Systems: Overall Financials, 2015-2017
Figure 9.7: BAE Systems: Business Revenue Mix, 2015-2017
Figure 9.8: BAE Systems: Region Revenue Mix, 2015-2017
Figure 9.9: SWOT Analysis – BAE Systems
Figure 9.10: Cobham plc: Overall Financials, 2015-2017
Figure 9.11: Cobham plc: Business Revenue Mix, 2015-2017
Figure 9.12: Cobham plc: Region Revenue Mix, 2015-2017
Figure 9.13: SWOT Analysis – Cobham plc
Figure 9.14: SWOT Analysis – Data Device Corporation
Figure 9.15: Honeywell International Inc.: Overall Financials, 2015-2017
Figure 9.16: Honeywell International Inc.: Business Revenue Mix, 2015-2017
Figure 9.17: Honeywell International Inc.: Region Revenue Mix, 2015-2017
Figure 9.18: SWOT Analysis – Honeywell International Inc.
Figure 9.19: IBM Corporation: Overall Financials, 2015-2017
Figure 9.20: IBM Corporation: Business Revenue Mix, 2015-2017
Figure 9.21: IBM Corporation: Region Revenue Mix, 2015-2017
Figure 9.22: SWOT Analysis – IBM Corporation
Figure 9.23: Infineon Technologies Inc.: Overall Financials, 2015-2017
Figure 9.24: Infineon Technologies Inc.: Business Revenue Mix, 2015-2017
Figure 9.25: Infineon Technologies Inc.: Region Revenue Mix, 2015-2017
Figure 9.26: SWOT Analysis – Infineon Technologies Inc.
Figure 9.27: Microchip Technology Inc.: Overall Financials, 2015-2017
Figure 9.28: Microchip Technology Inc.: Business Revenue Mix, 2015-2017
Figure 9.29: Microchip Technology Inc.: Region Revenue Mix, 2015-2017
Figure 9.30: SWOT Analysis – Microchip Technology Inc.
Figure 9.31: SWOT Analysis – Micropac Industries Inc.
Figure 9.32: Renesas Electronics Corporation: Overall Financials, 2015-2017
Figure 9.33: Renesas Electronics Corporation: Region Revenue Mix, 2017
Figure 9.34: SWOT Analysis – Renesas Electronics Corporation
Figure 9.35: SWOT Analysis – Solid State Devices Inc.
Figure 9.36: STMicroelectronics N.V: Overall Financials, 2015-2017
Figure 9.37: STMicroelectronics N.V: Business Revenue Mix, 2015-2017
Figure 9.38: STMicroelectronics N.V: Region Revenue Mix, 2015-2017
Figure 9.39: SWOT Analysis – STMicroelectronics NV
Figure 9.40: Texas Instruments Inc.: Overall Financials, 2015-2017
Figure 9.41: Texas Instruments Inc.: Business Revenue Mix, 2015-2017
Figure 9.42: Texas Instruments Inc.: Region Revenue Mix, 2015-2017
Figure 9.43: SWOT Analysis – Texas Instruments Inc.
Figure 9.44: The Boeing Company: Overall Financials, 2015-2017
Figure 9.45: The Boeing Company: Business Revenue Mix, 2015-2017
Figure 9.46: The Boeing Company: Region Revenue Mix, 2015-2017
Figure 9.47: SWOT Analysis – The Boeing Company
Figure 9.48: Xilinx Inc.: Overall Financials, 2016-2018
Figure 9.49 Xilinx Inc.: Business Revenue Mix, 2016-2018
Figure 9.50 Xilinx Inc.: Region Revenue Mix, 2016-2018
Figure 9.51: SWOT Analysis – Xilinx Inc.
Figure 10.1: Global Radiation Hardened Electronics Market Scope
Figure 10.2: Research Design and Flow
Figure 10.3: Top-Down and Bottom-up Approach
Figure 10.4: Radiation Hardened Electronics Market: Influencing Factors
Figure 10.5: Assumptions and Limitations

Note: Product cover images may vary from those shown
3 of 6

Loading
LOADING...

4 of 6

FEATURED COMPANIES

  • Analog Devices Inc.
  • BAE Systems
  • Data Device Corporation
  • Maxwell Technologies Inc.
  • Micropac Industries Inc.
  • pSemi Corporation
  • MORE

According to a new market intelligence report titled "Global Radiation Hardened Electronics Market, Analysis and Forecast, 2018 - 2023", the radiation hardened electronics industry is currently at the cusp of a major revolution. Radiation hardened electronics are employed in satellite switching regulators, system power supply, and microprocessors in military and space applications. Therefore, they require extensive testing and development for their production.

The radiation hardened electronics market has witnessed a high growth rate owing to the extensive demand for radiation hardened components for their application in space, medical, and nuclear power plants. Innovations, such as the development of cost-effective and reliable components and services, are anticipated to enable the radiation hardened electronics market to reach a wider segment of consumers in the industry.

According to the analysis, the global radiation hardened electronics market was estimated to be approximately $1.45 billion in 2018.

The global radiation hardened electronics market is categorized on the basis of component types that include microprocessors and controllers, sensors, application-specific integrated circuit, field-programmable gate array, memory, power sources, discrete semiconductors, and analog and mixed signals, and others. The application-specific integrated circuit component type is estimated to grow at the highest CAGR of 3.65%, during the forecast period, 2018-2023.

According to Swati Chaturvedi, Senior Research Analyst, “North America is one of the most prominent regions for the growth of the global radiation hardened electronics market. In 2017, North America dominated the global radiation hardened electronics market with the U.S. acquiring the maximum market share, globally. However, the geographical analysis of this market unveils an immense potential for its growth in the Asia-Pacific region. In Asia-Pacific, China acquired the largest market share and is expected to witness the highest growth rate in this region, during the forecast period, 2018-2023. Similarly, the Europe market is also likely to witness numerous growth opportunities during the forecast period 2018-2023.”

The market report provides a detailed analysis of the recent trends influencing the market, along with a comprehensive study of the future trends and technological developments. It also includes a competitive analysis of the leading players in the industry, including their corporate overview, financial summary, and SWOT analysis. The overall market has been segmented by manufacturing type, component type, end user, and region. The report also includes a comprehensive section on the geographical analysis including country analysis for more than 10 different countries.

This report is a meticulous compilation of research on more than 50 players in the radiation hardened electronics ecosystem and draws upon the insights from in-depth interviews with key opinion leaders of the leading companies, market participants, and vendors. The report has profiles of 15 companies, namely, Analog Devices Inc., BAE Systems, Cobham plc, Data Device Corporation, Honeywell International, IBM, Infineon Technologies, Microchip Technology, Micropac Industries, Renesas Electronic Corporation, Solid State Devices, STMicroelectronics, Texas Instruments, Inc., The Boeing Company, and Xilinx.

Key questions answered in the report:

  • What are the trends in the global radiation hardened electronic market across different regions?
  • What are the major driving forces that tend to increase the demand for the global radiation hardened electronics market during the forecast period, 2018-2023?
  • What are the major challenges inhibiting the growth of the global radiation hardened electronics market?
  • Who are the key players in the global radiation hardened electronics market and what are their competitive benchmarking?
  • What is the revenue generated by the global radiation hardened electronics market by segments (component types, manufacturing techniques, and end users) in 2017, and what will be the estimates by 2023?
  • How is each segment of the global radiation hardened electronics market expected to grow during the forecast period, and what will be the expected revenue generated by each of the segments by the end of 2023?
  • What are the trends in the global radiation hardened electronics market across different regions?
  • How is the industry expected to evolve during the forecast period 2018-2023?
  • Which region is expected to contribute to the highest sales of the global radiation hardened electronics market during the forecast period?
  • What are the new strategies adopted by the existing market players to make a mark in the industry?
  • What are the major opportunities that the radiation hardened electronics manufacturers foresee?
Note: Product cover images may vary from those shown
5 of 6
  • Analog Devices Inc.
  • Anaren Inc.
  • BAE Systems
  • Cobham plc
  • Data Device Corporation
  • Honeywell International Inc.
  • IBM Corporation
  • Infineon Technologies Inc.
  • Maxwell Technologies Inc.
  • Microchip Technology Inc.
  • Micropac Industries Inc.
  • Microsemi Corporation
  • pSemi Corporation
  • Renesas Electronics Corporation
  • STMicroelectronics N.V
  • Solid State Devices Inc.
  • TT Electronics
  • Texas Instruments Inc.
  • The Boeing Company
  • Xilinx Inc.
Note: Product cover images may vary from those shown
6 of 6

Loading
LOADING...

Adroll
adroll