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Innovations in AI chips, wireless charging, smart lighting, Heads-up Displays, VCSELs, and Advanced Data Storage

  • ID: 4758381
  • Report
  • 15 Pages
  • Frost & Sullivan
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This Microelectronics TechVision Opportunity Engine (TOE) profiles developments in AI-chipsets, wearables, wireless charging VCSELs, advanced data storage, and HUDs. Innovations include bio-impedance analysis tracker to measure body composition, quantum dot-based smart diffuser, heads-up display for flight data, non-volatile memory using silicon oxide, digitally controlled RF GaN amplifier, 3D chip packaging, and automated reactor technology for VCSEL production.

The Microelectronics TechVision Opportunity Engine captures global electronics-related innovations and developments on a weekly basis. Developments are centred on electronics attributed by low power and cost, smaller size, better viewing, display and interface facilities, wireless connectivity, higher memory capacity, flexibility and wearables. Research focus themes include small footprint lightweight devices (CNTs, graphene), smart monitoring and control (touch and haptics), energy efficiency (LEDs, OLEDs, power and thermal management, energy harvesting), and high speed and improved conductivity devices (SiC, GaN, GaAs).

Miniaturization, a move toward lower power consumption, and the need for enhanced features are driving innovations in the electronics sector. Technology focus areas include semiconductor manufacturing and design, flexible electronics, 3D integration/IC, MEMS and NEMS, solid state lighting, advanced displays, nanoelectronics, wearable electronics, brain computer interface, advanced displays, near field communication, and next generation data storage or memory.

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1. Innovations in AI chips, wireless charging, smart lighting, Heads-up Displays, VCSELs, and Advanced Data Storage

  • High Speed AI Chip that Can Enable Neural Machine Translation and Image Recognition
  • Impact on Sectors and Applications of the AI Chip
  • Analyst Viewpoint

2. Wearable Design Inference Chip Allows Developers to Build the Multimodal Chip Design

  • Impact on Sectors and Applications of the Wearable Design Interface
  • Analyst Viewpoint

3. Wireless Charging Sheet that Can be Cut Into Any Shape and Power Electronic Devices

  • Impact on Sectors and Applications of the Wireless Charger
  • Technical aspects of the wireless charger and Analyst Viewpoint
  • Quantum Dot-based Smart Diffuser Enables Optimal Light Scheduling
  • Impact on Sectors and Applications of the Wireless Charger
  • Technical Specifications of the Smart Diffuser and Analyst Viewpoint
  • Bio-impedance Analysis Tracker to Measure Body Composition
  • Wearable Device Market Poised to Reach $73.2 Billion by 2022
  • Analyst Viewpoint

4. Head-up Display for Projecting Real-time Flight Data

  • HUD Cumulative Market Poised to Reach $10 Billion by 2022
  • Analyst Viewpoint

5. Automated Reactor Technology for Mass Production of VCSELs

  • VCSEL Market Poised to Reach $9 Billion by 2022
  • Analyst Viewpoint

6. Circuit Enabling Integration of Electronic Components for Intelligent Textiles

  • Intelligent Textile Cumulative Market Poised to Reach $11 Billion by 2022
  • Analyst Viewpoint

7. Disruptive Wi-Fi Solution for Optimized User Experience

  • Impact on Sectors and Applications of the Wi-Fi Chips
  • Analyst Viewpoint

8. Innovative 3D Packaging Technology of Logic Chips

  • Impact on Sectors and Applications of Foveros
  • Analyst Viewpoint

9. Digitally Controlled GaN Amplifier for Ultra Wideband Applications

  • Impact on Sectors and Applications of the RF GaN Amplifier
  • Analyst Viewpoint

10. Breakthrough Innovation in Non-volatile Memory using Silicon Oxide

  • Impact on Sectors and Applications of the SiOx ReRAM Technology
  • Analyst Viewpoint

11. Key Contacts

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