Micro and Nanoscale Laser Processing of Hard Brittle Materials examines general laser-material interactions within this type of material, focusing on the nanoprocessing technologies that these phenomena have given rise to. Sections cover laser machining, healing, recovery, sintering, surface modification, texturing and microstructuring. These technologies all benefit from the characteristics of laser processing, its highly localized heating ability, and its well-defined optical properties. The book also describes frontier applications of the developed technologies, thus further emphasizing the possibility of processing hard brittle materials into complex structures with functional surfaces at both the micro and nanoscale.
- Provides readers with a solid understanding of laser-material interactions
- Helps readers choose suitable laser parameters for processing hard brittle materials
- Demonstrates how micro and nanoscale laser processing can be used to machine brittle materials without fracture
1. Introduction 2. Fundamentals of laser processing 3. Laser-material interactions 4. Laser processing technologies 5. Micromachining of single-crystal diamond 6. Micromachining of microstructures on sapphire 7. Laser healing of microcracks in glass 8. Laser recovery of silicon single crystals 9. Surface modification of silicon carbide 10. Modification of surface property of alumina sprayed coating 11. Laser sintering of silicon powder and carbon nanofibers 12. Micropillar formation from silicon powder 13. Surface structuring of silicon 14. Summary and outlook
Jiwang Yan is Professor at the Department of Mechanical Engineering at Keio University, Japan, where he heads up the Yan Laboratory. He is also Adjunct Professor at Tokyo Institute of Technology, Japan. His research interests the laser processing of materials, and ultraprecision and micro and nano manufacturing.
Nozomi Takayama is a researcher at Yan Laboratory, Department of Mechanical Engineering at Keio University, Japan. Her research interest focus on laser processing.