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3D Semiconductor Packaging - Global Market Trajectory & Analytics

  • ID: 4804541
  • Report
  • April 2021
  • Region: Global
  • 156 pages
  • Global Industry Analysts, Inc
Global 3D Semiconductor Packaging Market to Reach $14.7 Billion by 2027

Amid the COVID-19 crisis, the global market for 3D Semiconductor Packaging estimated at US$5.6 Billion in the year 2020, is projected to reach a revised size of US$14.7 Billion by 2027, growing at a CAGR of 14.6% over the analysis period 2020-2027. 3D package-on-package, one of the segments analyzed in the report, is projected to record a 14.4% CAGR and reach US$2.7 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the 3D wire-bonded segment is readjusted to a revised 15.9% CAGR for the next 7-year period.



The U.S. Market is Estimated at $1.7 Billion, While China is Forecast to Grow at 14.1% CAGR

The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.7 Billion in the year 2020. China, the world's second largest economy, is forecast to reach a projected market size of US$2.6 Billion by the year 2027 trailing a CAGR of 14.1% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 12.8% and 12.7% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 10.8% CAGR.

3D Fan-out based Segment to Record 14.9% CAGR

In the global 3D Fan-out based segment, USA, Canada, Japan, China and Europe will drive the 14.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$690.3 Million in the year 2020 will reach a projected size of US$1.8 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1.8 Billion by the year 2027.

Select Competitors (Total 44 Featured):
  • Amkor Technology, Inc.
  • EV Group
  • Rudolph Technologies, Inc.
  • Semes Co., Ltd.
  • Suss MicroTec AG
  • Ulvac, Inc.
Note: Product cover images may vary from those shown
I. METHODOLOGY

II. EXECUTIVE SUMMARY
  • Influencer Market Insights
  • World Market Trajectories
  • Impact of Covid-19 and a Looming Global Recession
  • Table 1: World Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 2: World 7-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2020 & 2027
  • Table 3: World Current & Future Analysis for 3D package-on-package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 4: World 7-Year Perspective for 3D package-on-package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 5: World Current & Future Analysis for 3D wire-bonded by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 6: World 7-Year Perspective for 3D wire-bonded by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 7: World Current & Future Analysis for 3D fan-out based by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 8: World 7-Year Perspective for 3D fan-out based by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 9: World Current & Future Analysis for 3D through-silicon-via by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 10: World 7-Year Perspective for 3D through-silicon-via by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 11: World Current & Future Analysis for Other Segments by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 12: World 7-Year Perspective for Other Segments by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 13: World Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 14: World 7-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 15: World Current & Future Analysis for Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 16: World 7-Year Perspective for Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 17: World Current & Future Analysis for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 18: World 7-Year Perspective for Healthcare by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 19: World Current & Future Analysis for IT & telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 20: World 7-Year Perspective for IT & telecommunication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 21: World Current & Future Analysis for Automotive & transport by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 22: World 7-Year Perspective for Automotive & transport by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 23: World Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 24: World 7-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
  • Table 25: World Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 26: World 7-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2020 & 2027
III. MARKET ANALYSIS
  • Table 27: USA Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 28: USA 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 29: USA Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 30: USA 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 31: Canada Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 32: Canada 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 33: Canada Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 34: Canada 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 35: Japan Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 36: Japan 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 37: Japan Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 38: Japan 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 39: China Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 40: China 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 41: China Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 42: China 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 43: Europe Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 44: Europe 7-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2020 & 2027
  • Table 45: Europe Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 46: Europe 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 47: Europe Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 48: Europe 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 49: France Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 50: France 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 51: France Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 52: France 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 53: Germany Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 54: Germany 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 55: Germany Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 56: Germany 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 57: Italy Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 58: Italy 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 59: Italy Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 60: Italy 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 61: UK Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 62: UK 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 63: UK Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 64: UK 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 65: Rest of Europe Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 66: Rest of Europe 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 67: Rest of Europe Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 68: Rest of Europe 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 69: Asia-Pacific Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 70: Asia-Pacific 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 71: Asia-Pacific Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 72: Asia-Pacific 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
  • Table 73: Rest of World Current & Future Analysis for 3D Semiconductor Packaging by Segment - 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 74: Rest of World 7-Year Perspective for 3D Semiconductor Packaging by Segment - Percentage Breakdown of Value Sales for 3D package-on-package, 3D wire-bonded, 3D fan-out based, 3D through-silicon-via and Other Segments for the Years 2020 & 2027
  • Table 75: Rest of World Current & Future Analysis for 3D Semiconductor Packaging by End-Use - Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2020 through 2027 and % CAGR
  • Table 76: Rest of World 7-Year Perspective for 3D Semiconductor Packaging by End-Use - Percentage Breakdown of Value Sales for Industrial, Electronics, Healthcare, IT & telecommunication, Automotive & transport, Aerospace & Defense and Other End-Uses for the Years 2020 & 2027
IV. COMPETITION
  • Total Companies Profiled: 44
Note: Product cover images may vary from those shown
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