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3D Semiconductor Packaging - Global Strategic Business Report

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    Report

  • 293 Pages
  • April 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 4804541

Global 3D Semiconductor Packaging Market to Reach $27 Billion by 2030

The global market for 3D Semiconductor Packaging estimated at US$9.3 Billion in the year 2023, is projected to reach a revised size of US$27 Billion by 2030, growing at a CAGR of 14.2% over the analysis period 2023-2030.

Through Silicon via (TSV), one of the segments analyzed in the report, is projected to record 16.5% CAGR and reach US$14.7 Billion by the end of the analysis period. Growth in the Package-On-package segment is estimated at 13.4% CAGR for the next 8-year period.

The U.S. Market is Estimated at $1.4 Billion, While China is Forecast to Grow at 17.6% CAGR

The 3D Semiconductor Packaging market in the U.S. is estimated at US$1.4 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$9.7 Billion by the year 2030 trailing a CAGR of 17.6% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 10% and 10.4% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 13.2% CAGR.

Exciting New Report Features

  • Full access to influencer engagement stats
  • Free access to digital archives & research platform. The proprietary platform is fully enabled to unlock creativity and market knowledge of domain experts worldwide in a cohesive and collaborative manner. The state-of-art tools bring world class market perspectives while protecting participants` privacy and identity. Numbers, statistics and market narrative in the report are based on fully curated insights shared by domain experts and influencers in this space.
  • Opportunity to engage with interactive questionnaires that come with real-time data simulator tools & bespoke report generation capabilities
  • Full client access to peer collaborative and interactive platform for cross-enterprise smart exchange of ideas
  • Complimentary report updates for one year
  • Competitor coverage with global market shares of major players
  • Player market presence analysis (Strong/Active/Niche/Trivial) across multiple geographies
  • Access to curated YouTube video transcripts of domain experts/influencer interviews, podcasts, press statements and event keynotes

What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 36 Featured)

  • IBM Corporation
  • 3M Company
  • Intel Corporation
  • Advanced Micro Devices, Inc.
  • Applied Materials, Inc.
  • Amkor Technology, Inc.
  • Cadence Design Systems, Inc.
  • Globalfoundries, Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • ASE Technology Holding Co., Ltd.
  • AT & S Austria Technologie & Systemtechnik AG
  • 3D PLUS SA
  • LPKF Laser & Electronics AG
  • China Wafer Level CSP Co., Ltd.
  • EV Group Europe & Asia/Pacific GmbH

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • 3D Semiconductor Packaging - Global Key Competitors Percentage Market Share in 2023 (E)
  • 3D Semiconductor Packaging Competitor Market Share Scenario Worldwide (in %): 2020E
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
  • Semiconductor Advanced Packaging: A Prelude
  • An Introduction to 3D Semiconductor Packaging
  • Global Market Prospects & Outlook
  • Primary Growth Drivers
  • 3D Packaging Reinventing Integration Architectures
  • Analysis by Segment
  • Regional Analysis
  • Competitive Scenario
  • Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
  • 3D IC Packaging Market to Experience Robust Growth
  • Demand for 3D Packaging to Boost Advanced Semiconductor Packaging Market
  • Digital Transformation Drive Energizes the Growth in Advanced Packaging Market
  • Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
  • IoT Ecosystem Accelerates Opportunities for Semiconductor Advanced Packaging
  • Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
  • Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
  • IC Makers Continue to Move towards Advanced Semiconductor Packaging
  • Transition towards Advanced Packaging
  • Increasing Functionality & Application Scope of Semiconductor/IC Packages
  • New Packaging Technologies Crucial to Semiconductor Innovation
  • Demand for Compact, High Functionality Electronic Devices to Impel 3D TSV Packages Market
  • 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
  • 3D InCites - Advanced Packaging for 5G
  • Advanced Packaging Influences Design Chain
  • Interposers for Semiconductor Packaging Applications
  • Innovative Advanced Packaging Techniques to Flood the Market
  • Reducing the Cost of Advanced Packaging
  • Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
  • Post Pandemic Recovery in CE Sector to Augment Prospects
  • Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
  • Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
  • Smartphones
  • Tablet PCs
  • Automobile Electronification Trends Widen the Addressable Market
  • Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
  • Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
  • Sustained High Growth in ICT Sector Augurs Well
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Recent Past, Current & Future Analysis for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 2: World Historic Review for 3D Semiconductor Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 3: World 15-Year Perspective for 3D Semiconductor Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2024 & 2030
  • Table 4: World Recent Past, Current & Future Analysis for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 5: World Historic Review for Through Silicon via (TSV) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 6: World 15-Year Perspective for Through Silicon via (TSV) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 7: World Recent Past, Current & Future Analysis for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 8: World Historic Review for Package-on-Package by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 9: World 15-Year Perspective for Package-on-Package by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 10: World Recent Past, Current & Future Analysis for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 11: World Historic Review for Through Glass Via (tgv) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 12: World 15-Year Perspective for Through Glass Via (tgv) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 13: World Recent Past, Current & Future Analysis for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 14: World Historic Review for Other Packaging Methods by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 15: World 15-Year Perspective for Other Packaging Methods by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 18: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 19: World Recent Past, Current & Future Analysis for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 20: World Historic Review for Telecommunications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 21: World 15-Year Perspective for Telecommunications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 22: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 23: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 24: World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 25: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 26: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 27: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 28: World Recent Past, Current & Future Analysis for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 29: World Historic Review for Military & Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 30: World 15-Year Perspective for Military & Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 31: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2023 through 2030 and % CAGR
  • Table 32: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2022 and % CAGR
  • Table 33: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2024 & 2030
  • Table 34: World 3D Semiconductor Packaging Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
III. MARKET ANALYSIS
UNITED STATES
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
CANADA
JAPAN
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
CHINA
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
EUROPE
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
FRANCE
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
GERMANY
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
ITALY
UNITED KINGDOM
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
REST OF EUROPE
ASIA-PACIFIC
  • 3D Semiconductor Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
REST OF WORLDIV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • IBM Corporation
  • 3M Company
  • Intel Corporation
  • Advanced Micro Devices, Inc.
  • Applied Materials, Inc.
  • Amkor Technology, Inc.
  • Cadence Design Systems, Inc.
  • Globalfoundries, Inc.
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • ASE Technology Holding Co., Ltd.
  • AT & S Austria Technologie & Systemtechnik AG
  • 3D PLUS SA
  • LPKF Laser & Electronics AG
  • China Wafer Level CSP Co., Ltd.
  • EV Group Europe & Asia/Pacific GmbH