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Flip Chip Technology - Global Strategic Business Report

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    Report

  • 179 Pages
  • March 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 4804896

Global Flip Chip Technology Market to Reach $39.6 Billion by 2030

The global market for Flip Chip Technology estimated at US$26.7 Billion in the year 2022, is projected to reach a revised size of US$39.6 Billion by 2030, growing at a CAGR of 5% over the analysis period 2022-2030. Copper Pillar, one of the segments analyzed in the report, is projected to record 5.1% CAGR and reach US$20.5 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the Gold Bumping segment is readjusted to a revised 5.7% CAGR for the next 8-year period.

The U.S. Market is Estimated at $7.8 Billion, While China is Forecast to Grow at 4.7% CAGR

The Flip Chip Technology market in the U.S. is estimated at US$7.8 Billion in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$7 Billion by the year 2030 trailing a CAGR of 4.7% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.5% and 4.1% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 3.8% CAGR.

Select Competitors (Total 12 Featured) -

  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Powertech Technology, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.
  • United Microelectronics Corporation

What's New?

  • Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
  • Global competitiveness and key competitor percentage market shares
  • Market presence across multiple geographies - Strong/Active/Niche/Trivial
  • Online interactive peer-to-peer collaborative bespoke updates
  • Access to digital archives and Research Platform
  • Complimentary updates for one year

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • Flip Chip Technology - Global Key Competitors Percentage Market Share in 2022 (E)
  • Impact of Covid-19 and a Looming Global Recession
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Flip Chip Technology Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • Table 2: World Recent Past, Current & Future Analysis for Flip Chip Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 3: World Historic Review for Flip Chip Technology by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 4: World 16-Year Perspective for Flip Chip Technology by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2023 & 2030
  • Table 5: World Recent Past, Current & Future Analysis for Copper Pillar by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 6: World Historic Review for Copper Pillar by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 7: World 16-Year Perspective for Copper Pillar by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 8: World Recent Past, Current & Future Analysis for Gold Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 9: World Historic Review for Gold Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 10: World 16-Year Perspective for Gold Bumping by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 11: World Recent Past, Current & Future Analysis for Solder Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 12: World Historic Review for Solder Bumping by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 13: World 16-Year Perspective for Solder Bumping by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 14: World Recent Past, Current & Future Analysis for Other Bumping Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 15: World Historic Review for Other Bumping Technologies by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 16: World 16-Year Perspective for Other Bumping Technologies by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 17: World Recent Past, Current & Future Analysis for Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 18: World Historic Review for Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 19: World 16-Year Perspective for Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 20: World Recent Past, Current & Future Analysis for IT & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 21: World Historic Review for IT & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 22: World 16-Year Perspective for IT & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 23: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 24: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 25: World 16-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 26: World Recent Past, Current & Future Analysis for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 27: World Historic Review for Healthcare by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 28: World 16-Year Perspective for Healthcare by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 29: World Recent Past, Current & Future Analysis for Automotive & Transport by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 30: World Historic Review for Automotive & Transport by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 31: World 16-Year Perspective for Automotive & Transport by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 32: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 33: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 34: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 35: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 36: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 37: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
III. MARKET ANALYSIS
UNITED STATES
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
  • Table 38: USA Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 39: USA Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 40: USA 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 41: USA Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 42: USA Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 43: USA 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
CANADA
  • Table 44: Canada Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 45: Canada Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 46: Canada 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 47: Canada Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 48: Canada Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 49: Canada 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
JAPAN
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
  • Table 50: Japan Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 51: Japan Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 52: Japan 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 53: Japan Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 54: Japan Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 55: Japan 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
CHINA
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
  • Table 56: China Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 57: China Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 58: China 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 59: China Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 60: China Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 61: China 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
EUROPE
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
  • Table 62: Europe Recent Past, Current & Future Analysis for Flip Chip Technology by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2022 through 2030 and % CAGR
  • Table 63: Europe Historic Review for Flip Chip Technology by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 64: Europe 16-Year Perspective for Flip Chip Technology by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2023 & 2030
  • Table 65: Europe Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 66: Europe Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 67: Europe 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 68: Europe Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 69: Europe Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 70: Europe 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
FRANCE
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
  • Table 71: France Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 72: France Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 73: France 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 74: France Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 75: France Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 76: France 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
GERMANY
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
  • Table 77: Germany Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 78: Germany Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 79: Germany 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 80: Germany Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 81: Germany Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 82: Germany 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
ITALY
  • Table 83: Italy Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 84: Italy Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 85: Italy 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 86: Italy Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 87: Italy Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 88: Italy 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
UNITED KINGDOM
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
  • Table 89: UK Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 90: UK Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 91: UK 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 92: UK Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 93: UK Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 94: UK 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
REST OF EUROPE
  • Table 95: Rest of Europe Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 96: Rest of Europe Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 97: Rest of Europe 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 98: Rest of Europe Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 99: Rest of Europe Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 100: Rest of Europe 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
ASIA-PACIFIC
  • Flip Chip Technology Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
  • Table 101: Asia-Pacific Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 102: Asia-Pacific Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 103: Asia-Pacific 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 104: Asia-Pacific Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 105: Asia-Pacific Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 106: Asia-Pacific 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
REST OF WORLD
  • Table 107: Rest of World Recent Past, Current & Future Analysis for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 108: Rest of World Historic Review for Flip Chip Technology by Bumping Technology - Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 109: Rest of World 16-Year Perspective for Flip Chip Technology by Bumping Technology - Percentage Breakdown of Value Sales for Copper Pillar, Gold Bumping, Solder Bumping and Other Bumping Technologies for the Years 2014, 2023 & 2030
  • Table 110: Rest of World Recent Past, Current & Future Analysis for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2022 through 2030 and % CAGR
  • Table 111: Rest of World Historic Review for Flip Chip Technology by End-Uses - Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2021 and % CAGR
  • Table 112: Rest of World 16-Year Perspective for Flip Chip Technology by End-Uses - Percentage Breakdown of Value Sales for Electronics, IT & Telecom, Industrial, Healthcare, Automotive & Transport, Aerospace & Defense and Other End-Uses for the Years 2014, 2023 & 2030
IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Powertech Technology, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.
  • United Microelectronics Corporation

Table Information