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Flip Chip Technology - Market Analysis, Trends, and Forecasts

  • ID: 4804896
  • Report
  • 151 pages
  • Global Industry Analysts, Inc
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FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • Intel Corporation
  • Powertech Technology
  • Stats Chippac Pte.
  • MORE
Flip Chip Technology market worldwide is projected to grow by US$13.1 Billion, driven by a compounded growth of 6.8%. Copper (Cu) Pillar, one of the segments analyzed and sized in this study, displays the potential to grow at over 7.3%. The shifting dynamics supporting this growth makes it critical for businesses in this space to keep abreast of the changing pulse of the market. Poised to reach over US$17.1 Billion by the year 2025, Copper (Cu) Pillar will bring in healthy gains adding significant momentum to global growth.

Representing the developed world, the United States will maintain a 7.8% growth momentum. Within Europe, which continues to remain an important element in the world economy, Germany will add over US$598.3 Million to the region's size and clout in the next 5 to 6 years. Over US$611.5 Million worth of projected demand in the region will come from Rest of Europe markets. In Japan, Copper (Cu) Pillar will reach a market size of US$1.4 Billion by the close of the analysis period. As the world’s second largest economy and the new game changer in global markets, China exhibits the potential to grow at 6.5% over the next couple of years and add approximately US$2.3 Billion in terms of addressable opportunity for the picking by aspiring businesses and their astute leaders.

Presented in visually rich graphics are these and many more need-to-know quantitative data important in ensuring quality of strategy decisions, be it entry into new markets or allocation of resources within a portfolio. Several macroeconomic factors and internal market forces will shape growth and development of demand patterns in emerging countries in Asia-Pacific. All research viewpoints presented are based on validated engagements from influencers in the market, whose opinions supersede all other research methodologies.

Competitors identified in this market include:
  • Amkor Technology, Inc.
  • ASE Group
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
  • Powertech Technology, Inc.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (SPIL)
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.
  • United Microelectronics Corporation
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • Amkor Technology
  • Ase Group
  • Intel Corporation
  • Powertech Technology
  • Stats Chippac Pte.
  • MORE

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Global Competitor Market Shares

Flip Chip Technology Competitor Market Share Scenario Worldwide (in %): 2019 & 2025

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

TABLE 1: Flip Chip Technology Global Market Estimates and Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 2: Flip Chip Technology Global Retrospective Market Scenario in US$ Million by Region/Country: 2009-2017

TABLE 3: Flip Chip Technology Market Share Shift across Key Geographies Worldwide: 2009 VS 2019 VS 2025

TABLE 4: Copper (Cu) Pillar (Wafer Bumping Process) World Market by Region/Country in US$ Million: 2018 to 2025

TABLE 5: Copper (Cu) Pillar (Wafer Bumping Process) Historic Market Analysis by Region/Country in US$ Million: 2009 to 2017

TABLE 6: Copper (Cu) Pillar (Wafer Bumping Process) Market Share Breakdown of Worldwide Sales by Region/Country: 2009 VS 2019 VS 2025

TABLE 7: Lead-Free (Wafer Bumping Process) Potential Growth Markets Worldwide in US$ Million: 2018 to 2025

TABLE 8: Lead-Free (Wafer Bumping Process) Historic Market Perspective by Region/Country in US$ Million: 2009 to 2017

TABLE 9: Lead-Free (Wafer Bumping Process) Market Sales Breakdown by Region/Country in Percentage: 2009 VS 2019 VS 2025

TABLE 10: Tin/Lead Eutectic Solder (Wafer Bumping Process) Geographic Market Spread Worldwide in US$ Million: 2018 to 2025

TABLE 11: Tin/Lead Eutectic Solder (Wafer Bumping Process) Region Wise Breakdown of Global Historic Demand in US$ Million: 2009 to 2017

TABLE 12: Tin/Lead Eutectic Solder (Wafer Bumping Process) Market Share Distribution in Percentage by Region/Country: 2009 VS 2019 VS 2025

TABLE 13: Gold Stud+ Plated Solder (Wafer Bumping Process) World Market Estimates and Forecasts by Region/Country in US$ Million: 2018 to 2025

TABLE 14: Gold Stud+ Plated Solder (Wafer Bumping Process) Market Historic Review by Region/Country in US$ Million: 2009 to 2017

TABLE 15: Gold Stud+ Plated Solder (Wafer Bumping Process) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025

TABLE 16: Consumer Electronics (Application) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 17: Consumer Electronics (Application) Global Historic Analysis in US$ Million by Region/Country: 2009-2017

TABLE 18: Consumer Electronics (Application) Distribution of Global Sales by Region/Country: 2009 VS 2019 VS 2025

TABLE 19: Telecommunication (Application) Sales Estimates and Forecasts in US$ Million by Region/Country for the Years 2018 through 2025

TABLE 20: Telecommunication (Application) Analysis of Historic Sales in US$ Million by Region/Country for the Years 2009 to 2017

TABLE 21: Telecommunication (Application) Global Market Share Distribution by Region/Country for 2009, 2019, and 2025

TABLE 22: Automotive (Application) Global Opportunity Assessment in US$ Million by Region/Country: 2018-2025

TABLE 23: Automotive (Application) Historic Sales Analysis in US$ Million by Region/Country: 2009-2017

TABLE 24: Automotive (Application) Percentage Share Breakdown of Global Sales by Region/Country: 2009 VS 2019 VS 2025

TABLE 25: Industrial Sector (Application) Worldwide Sales in US$ Million by Region/Country: 2018-2025

TABLE 26: Industrial Sector (Application) Historic Demand Patterns in US$ Million by Region/Country: 2009-2017

TABLE 27: Industrial Sector (Application) Market Share Shift across Key Geographies: 2009 VS 2019 VS 2025

TABLE 28: Medical Devices (Application) Global Market Estimates & Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 29: Medical Devices (Application) Retrospective Demand Analysis in US$ Million by Region/Country: 2009-2017

TABLE 30: Medical Devices (Application) Market Share Breakdown by Region/Country: 2009 VS 2019 VS 2025

TABLE 31: Smart Technologies (Application) Demand Potential Worldwide in US$ Million by Region/Country: 2018-2025

TABLE 32: Smart Technologies (Application) Historic Sales Analysis in US$ Million by Region/Country: 2009-2017

TABLE 33: Smart Technologies (Application) Share Breakdown Review by Region/Country: 2009 VS 2019 VS 2025

TABLE 34: Military & Aerospace (Application) Worldwide Latent Demand Forecasts in US$ Million by Region/Country: 2018-2025

TABLE 35: Military & Aerospace (Application) Global Historic Analysis in US$ Million by Region/Country: 2009-2017

TABLE 36: Military & Aerospace (Application) Distribution of Global Sales by Region/Country: 2009 VS 2019 VS 2025

III. MARKET ANALYSIS

GEOGRAPHIC MARKET ANALYSIS

UNITED STATES

Market Facts & Figures

US Flip Chip Technology Market Share (in %) by Company: 2019 & 2025

TABLE 37: United States Flip Chip Technology Market Estimates and Projections in US$ Million by Wafer Bumping Process: 2018 to 2025

TABLE 38: Flip Chip Technology Market in the United States by Wafer Bumping Process: A Historic Review in US$ Million for 2009-2017

TABLE 39: United States Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 40: United States Flip Chip Technology Latent Demand Forecasts in US$ Million by Application: 2018 to 2025

TABLE 41: Flip Chip Technology Historic Demand Patterns in the United States by Application in US$ Million for 2009-2017

TABLE 42: Flip Chip Technology Market Share Breakdown in the United States by Application: 2009 VS 2019 VS 2025

CANADA

TABLE 43: Canadian Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018 to 2025

TABLE 44: Canadian Flip Chip Technology Historic Market Review by Wafer Bumping Process in US$ Million: 2009-2017

TABLE 45: Flip Chip Technology Market in Canada: Percentage Share Breakdown of Sales by Wafer Bumping Process for 2009, 2019, and 2025

TABLE 46: Canadian Flip Chip Technology Market Quantitative Demand Analysis in US$ Million by Application: 2018 to 2025

TABLE 47: Flip Chip Technology Market in Canada: Summarization of Historic Demand Patterns in US$ Million by Application for 2009-2017

TABLE 48: Canadian Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025

JAPAN

TABLE 49: Japanese Market for Flip Chip Technology: Annual Sales Estimates and Projections in US$ Million by Wafer Bumping Process for the Period 2018-2025

TABLE 50: Flip Chip Technology Market in Japan: Historic Sales Analysis in US$ Million by Wafer Bumping Process for the Period 2009-2017

TABLE 51: Japanese Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 52: Japanese Demand Estimates and Forecasts for Flip Chip Technology in US$ Million by Application: 2018 to 2025

TABLE 53: Japanese Flip Chip Technology Market in US$ Million by Application: 2009-2017

TABLE 54: Flip Chip Technology Market Share Shift in Japan by Application: 2009 VS 2019 VS 2025

CHINA

TABLE 55: Chinese Flip Chip Technology Market Growth Prospects in US$ Million by Wafer Bumping Process for the Period 2018-2025

TABLE 56: Flip Chip Technology Historic Market Analysis in China in US$ Million by Wafer Bumping Process: 2009-2017

TABLE 57: Chinese Flip Chip Technology Market by Wafer Bumping Process: Percentage Breakdown of Sales for 2009, 2019, and 2025

TABLE 58: Chinese Demand for Flip Chip Technology in US$ Million by Application: 2018 to 2025

TABLE 59: Flip Chip Technology Market Review in China in US$ Million by Application: 2009-2017

TABLE 60: Chinese Flip Chip Technology Market Share Breakdown by Application: 2009 VS 2019 VS 2025

EUROPE

Market Facts & Figures

European Flip Chip Technology Market: Competitor Market Share Scenario (in %) for 2019 & 2025

TABLE 61: European Flip Chip Technology Market Demand Scenario in US$ Million by Region/Country: 2018-2025

TABLE 62: Flip Chip Technology Market in Europe: A Historic Market Perspective in US$ Million by Region/Country for the Period 2009-2017

TABLE 63: European Flip Chip Technology Market Share Shift by Region/Country: 2009 VS 2019 VS 2025

TABLE 64: European Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018-2025

TABLE 65: Flip Chip Technology Market in Europe in US$ Million by Wafer Bumping Process: A Historic Review for the Period 2009-2017

TABLE 66: European Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 67: European Flip Chip Technology Addressable Market Opportunity in US$ Million by Application: 2018-2025

TABLE 68: Flip Chip Technology Market in Europe: Summarization of Historic Demand in US$ Million by Application for the Period 2009-2017

TABLE 69: European Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025

FRANCE

TABLE 70: Flip Chip Technology Market in France by Wafer Bumping Process: Estimates and Projections in US$ Million for the Period 2018-2025

TABLE 71: French Flip Chip Technology Historic Market Scenario in US$ Million by Wafer Bumping Process: 2009-2017

TABLE 72: French Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 73: Flip Chip Technology Quantitative Demand Analysis in France in US$ Million by Application: 2018-2025

TABLE 74: French Flip Chip Technology Historic Market Review in US$ Million by Application: 2009-2017

TABLE 75: French Flip Chip Technology Market Share Analysis: A 17-Year Perspective by Application for 2009, 2019, and 2025

GERMANY

TABLE 76: Flip Chip Technology Market in Germany: Recent Past, Current and Future Analysis in US$ Million by Wafer Bumping Process for the Period 2018-2025

TABLE 77: German Flip Chip Technology Historic Market Analysis in US$ Million by Wafer Bumping Process: 2009-2017

TABLE 78: German Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 79: Flip Chip Technology Market in Germany: Annual Sales Estimates and Forecasts in US$ Million by Application for the Period 2018-2025

TABLE 80: German Flip Chip Technology Market in Retrospect in US$ Million by Application: 2009-2017

TABLE 81: Flip Chip Technology Market Share Distribution in Germany by Application: 2009 VS 2019 VS 2025

ITALY

TABLE 82: Italian Flip Chip Technology Market Growth Prospects in US$ Million by Wafer Bumping Process for the Period 2018-2025

TABLE 83: Flip Chip Technology Historic Market Analysis in Italy in US$ Million by Wafer Bumping Process: 2009-2017

TABLE 84: Italian Flip Chip Technology Market by Wafer Bumping Process: Percentage Breakdown of Sales for 2009, 2019, and 2025

TABLE 85: Italian Demand for Flip Chip Technology in US$ Million by Application: 2018 to 2025

TABLE 86: Flip Chip Technology Market Review in Italy in US$ Million by Application: 2009-2017

TABLE 87: Italian Flip Chip Technology Market Share Breakdown by Application: 2009 VS 2019 VS 2025

UNITED KINGDOM

TABLE 88: United Kingdom Market for Flip Chip Technology: Annual Sales Estimates and Projections in US$ Million by Wafer Bumping Process for the Period 2018-2025

TABLE 89: Flip Chip Technology Market in the United Kingdom: Historic Sales Analysis in US$ Million by Wafer Bumping Process for the Period 2009-2017

TABLE 90: United Kingdom Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 91: United Kingdom Demand Estimates and Forecasts for Flip Chip Technology in US$ Million by Application: 2018 to 2025

TABLE 92: United Kingdom Flip Chip Technology Market in US$ Million by Application: 2009-2017

TABLE 93: Flip Chip Technology Market Share Shift in the United Kingdom by Application: 2009 VS 2019 VS 2025

REST OF EUROPE

TABLE 94: Rest of Europe Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018-2025

TABLE 95: Flip Chip Technology Market in Rest of Europe in US$ Million by Wafer Bumping Process: A Historic Review for the Period 2009-2017

TABLE 96: Rest of Europe Flip Chip Technology Market Share Breakdown by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 97: Rest of Europe Flip Chip Technology Addressable Market Opportunity in US$ Million by Application: 2018-2025

TABLE 98: Flip Chip Technology Market in Rest of Europe: Summarization of Historic Demand in US$ Million by Application for the Period 2009-2017

TABLE 99: Rest of Europe Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025

ASIA-PACIFIC

TABLE 100: Flip Chip Technology Market in Asia-Pacific by Wafer Bumping Process: Estimates and Projections in US$ Million for the Period 2018-2025

TABLE 101: Asia-Pacific Flip Chip Technology Historic Market Scenario in US$ Million by Wafer Bumping Process: 2009-2017

TABLE 102: Asia-Pacific Flip Chip Technology Market Share Analysis by Wafer Bumping Process: 2009 VS 2019 VS 2025

TABLE 103: Flip Chip Technology Quantitative Demand Analysis in Asia-Pacific in US$ Million by Application: 2018-2025

TABLE 104: Asia-Pacific Flip Chip Technology Historic Market Review in US$ Million by Application: 2009-2017

TABLE 105: Asia-Pacific Flip Chip Technology Market Share Analysis: A 17-Year Perspective by Application for 2009, 2019, and 2025

REST OF WORLD

TABLE 106: Rest of World Flip Chip Technology Market Estimates and Forecasts in US$ Million by Wafer Bumping Process: 2018 to 2025

TABLE 107: Rest of World Flip Chip Technology Historic Market Review by Wafer Bumping Process in US$ Million: 2009-2017

TABLE 108: Flip Chip Technology Market in Rest of World: Percentage Share Breakdown of Sales by Wafer Bumping Process for 2009, 2019, and 2025

TABLE 109: Rest of World Flip Chip Technology Market Quantitative Demand Analysis in US$ Million by Application: 2018 to 2025

TABLE 110: Flip Chip Technology Market in Rest of World: Summarization of Historic Demand Patterns in US$ Million by Application for 2009-2017

TABLE 111: Rest of World Flip Chip Technology Market Share Analysis by Application: 2009 VS 2019 VS 2025

IV. COMPETITION

ASE GROUP

AMKOR TECHNOLOGY

INTEL CORPORATION

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY

POWERTECH TECHNOLOGY

STATS CHIPPAC PTE.

SAMSUNG ELECTRONICS CO., LTD.

SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)

TAIWAN SEMICONDUCTOR MANUFACTURING

UNITED MICROELECTRONICS CORPORATION

V. CURATED RESEARCH

Note: Product cover images may vary from those shown
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  • Ase Group
  • Amkor Technology
  • Intel Corporation
  • Jiangsu Changjiang Electronics Technology
  • Powertech Technology
  • Stats Chippac Pte.
  • Samsung Electronics Co., Ltd.
  • Siliconware Precision Industries Co., Ltd. (Spil)
  • Taiwan Semiconductor Manufacturing
  • United Microelectronics Corporation
Note: Product cover images may vary from those shown
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