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Power Management IC Packaging Market Research Report by Application, by Solution, by Region - Global Forecast to 2026 - Cumulative Impact of COVID-19

  • ID: 4807799
  • Report
  • July 2021
  • Region: Global
  • 180 pages
  • 360iResearch™
UP TO OFF
until Sep 30th 2021
The Global Power Management IC Packaging Market will Grow to USD 57.64 Billion by 2026, at a CAGR of 5.08%

FEATURED COMPANIES

  • 3D Plus, Inc.
  • ABLIC Inc.
  • Dialog Semiconductor
  • HANA Micron Inc.
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
  • MORE
The Global Power Management IC Packaging Market size was estimated at USD 42.82 Billion in 2020 and expected to reach USD 44.85 Billion in 2021, at a Compound Annual Growth Rate (CAGR) 5.08% to reach USD 57.64 Billion by 2026.



Market Statistics:


The report provides market sizing and forecast across five major currencies - USD, EUR GBP, JPY, and AUD. It helps organization leaders make better decisions when currency exchange data is readily available. In this report, the years 2018 and 2019 are considered historical years, 2020 as the base year, 2021 as the estimated year, and years from 2022 to 2026 are considered the forecast period.

Market Segmentation & Coverage:


This research report categorizes the Power Management IC Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:
  • Based on Application, the Power Management IC Packaging Market was studied across Automotive Infotainment & Telematic Devices, Digital Cameras, Digital TV Processor, Fitness Trackers & Wearable Devices, Portable Industrial & Medical Devices, Portable Media Players & Readers, Smartphones, and Tablets & PCs.
  • Based on Type, the Power Management IC Packaging Market was studied across BGA, HSOP32, HVNON10, HVQFN, QFN, and WLCSP.
  • Based on Solution, the Power Management IC Packaging Market was studied across Configurable PMICs, DC-to-DC Solutions, Linear Voltage Regulators, PMICs for Networking, PMICs for i.MX Application Processors, and Switching Regulators.
  • Based on Region, the Power Management IC Packaging Market was studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, and Thailand. The Europe, Middle East & Africa is further studied across France, Germany, Italy, Netherlands, Qatar, Russia, Saudi Arabia, South Africa, Spain, United Arab Emirates, and United Kingdom.

Cumulative Impact of COVID-19:


COVID-19 is an incomparable global public health emergency that has affected almost every industry, and the long-term effects are projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlying COVID-19 issues and potential paths forward. The report delivers insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecasts, considering the COVID-19 impact on the market.

Competitive Strategic Window:


The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies to help the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. It describes the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth during a forecast period.

FPNV Positioning Matrix:


The FPNV Positioning Matrix evaluates and categorizes the vendors in the Power Management IC Packaging Market based on Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Market Share Analysis:


The Market Share Analysis offers the analysis of vendors considering their contribution to the overall market. It provides the idea of its revenue generation into the overall market compared to other vendors in the space. It provides insights into how vendors are performing in terms of revenue generation and customer base compared to others. Knowing market share offers an idea of the size and competitiveness of the vendors for the base year. It reveals the market characteristics in terms of accumulation, fragmentation, dominance, and amalgamation traits.

Company Usability Profiles:


The report profoundly explores the recent significant developments by the leading vendors and innovation profiles in the Global Power Management IC Packaging Market, including 3D Plus, Inc., ABLIC Inc., Analog Devices / Linear Technology, Dialog Semiconductor, Good-Ark Semiconductor USA Corp., HANA Micron Inc., Jilin Sino-Microelectronics Co., Ltd., Maxim Integrated Products Inc, Microchip Technology Inc, NXP Semiconductors N.V., ON Semiconductor Corporation, Semtech Corporation, Shenzhen Electronics Group Co., Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Wuxi China Resources Microelectronics Co. Ltd..

The report provides insights on the following pointers:


1. Market Penetration: Provides comprehensive information on the market offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyze penetration across mature segments of the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, certification, regulatory approvals, patent landscape, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and breakthrough product developments

The report answers questions such as:


1. What is the market size and forecast of the Global Power Management IC Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global Power Management IC Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global Power Management IC Packaging Market?
4. What is the competitive strategic window for opportunities in the Global Power Management IC Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global Power Management IC Packaging Market?
6. What is the market share of the leading vendors in the Global Power Management IC Packaging Market?
7. What modes and strategic moves are considered suitable for entering the Global Power Management IC Packaging Market?
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • 3D Plus, Inc.
  • ABLIC Inc.
  • Dialog Semiconductor
  • HANA Micron Inc.
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
  • MORE
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Limitations
1.7. Assumptions
1.8. Stakeholders

2. Research Methodology
2.1. Define: Research Objective
2.2. Determine: Research Design
2.3. Prepare: Research Instrument
2.4. Collect: Data Source
2.5. Analyze: Data Interpretation
2.6. Formulate: Data Verification
2.7. Publish: Research Report
2.8. Repeat: Report Update

3. Executive Summary
3.1. Introduction
3.2. Market Outlook
3.3. Application Outlook
3.4. Type Outlook
3.5. Solution Outlook
3.6. Region Outlook
3.7. Competitor Outlook

4. Market Overview
4.1. Introduction
4.2. Cumulative Impact of COVID-19

5. Market Insights
5.1. Market Dynamics
5.1.1. Drivers
5.1.1.1. Increasing demand of smart and wearbvle devices
5.1.1.2. Growing trend of minimization of device size and the integration of various components into a single device
5.1.1.3. Need for chip-embedded flexible packaging technology to ensure small size, rapid, and reliable devices
5.1.2. Restraints
5.1.2.1. Complex integration and packaging for multi-power domain SoCs of PMICs
5.1.3. Opportunities
5.1.3.1. 2.5DIC and 3.0DIC technologies evolving.
5.1.3.2. Investment in 3D packaging process design of next-generation smart devices
5.1.4. Challenges
5.1.4.1. limited investment in the unification of packaging standards
5.2. Porters Five Forces Analysis
5.2.1. Threat of New Entrants
5.2.2. Threat of Substitutes
5.2.3. Bargaining Power of Customers
5.2.4. Bargaining Power of Suppliers
5.2.5. Industry Rivalry

6. Power Management IC Packaging Market, by Application
6.1. Introduction
6.2. Automotive Infotainment & Telematic Devices
6.3. Digital Cameras
6.4. Digital TV Processor
6.5. Fitness Trackers & Wearable Devices
6.6. Portable Industrial & Medical Devices
6.7. Portable Media Players & Readers
6.8. Smartphones
6.9. Tablets & PCs

7. Power Management IC Packaging Market, by Type
7.1. Introduction
7.2. BGA
7.3. HSOP32
7.4. HVNON10
7.5. HVQFN
7.6. QFN
7.7. WLCSP

8. Power Management IC Packaging Market, by Solution
8.1. Introduction
8.2. Configurable PMICs
8.3. DC-to-DC Solutions
8.4. Linear Voltage Regulators
8.5. PMICs for Networking
8.6. PMICs for i.MX Application Processors
8.7. Switching Regulators

9. Americas Power Management IC Packaging Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific Power Management IC Packaging Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. Singapore
10.10. South Korea
10.11. Thailand

11. Europe, Middle East & Africa Power Management IC Packaging Market
11.1. Introduction
11.2. France
11.3. Germany
11.4. Italy
11.5. Netherlands
11.6. Qatar
11.7. Russia
11.8. Saudi Arabia
11.9. South Africa
11.10. Spain
11.11. United Arab Emirates
11.12. United Kingdom

12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis
12.3. Market Share Analysis, By Key Player
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration, & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding
12.4.5. Award, Recognition, & Expansion

13. Company Usability Profiles
13.1. 3D Plus, Inc.
13.2. ABLIC Inc.
13.3. Analog Devices / Linear Technology
13.4. Dialog Semiconductor
13.5. Good-Ark Semiconductor USA Corp.
13.6. HANA Micron Inc.
13.7. Jilin Sino-Microelectronics Co., Ltd.
13.8. Maxim Integrated Products Inc
13.9. Microchip Technology Inc
13.10. NXP Semiconductors N.V.
13.11. ON Semiconductor Corporation
13.12. Semtech Corporation
13.13. Shenzhen Electronics Group Co., Ltd.
13.14. Texas Instruments Incorporated
13.15. Toshiba Corporation
13.16. Wuxi China Resources Microelectronics Co. Ltd.

14. Appendix
14.1. Discussion Guide
14.2. License & Pricing

List of Figures
FIGURE 1. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2020 VS 2026 (USD BILLION)
FIGURE 2. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 (USD BILLION)
FIGURE 3. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2020 (USD BILLION)
FIGURE 4. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2020 (USD BILLION)
FIGURE 5. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY REGION, 2020 (USD BILLION)
FIGURE 6. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 7. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: MARKET DYNAMICS
FIGURE 8. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: PORTERS FIVE FORCES ANALYSIS
FIGURE 9. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 VS 2026 (%)
FIGURE 10. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2020 VS 2026 (USD BILLION)
FIGURE 11. COMPETITIVE STRATEGIC WINDOW FOR GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2026
FIGURE 12. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, 2018-2026 (USD BILLION)
FIGURE 13. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 14. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, 2018-2026 (USD BILLION)
FIGURE 15. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 16. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, 2018-2026 (USD BILLION)
FIGURE 17. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 18. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, 2018-2026 (USD BILLION)
FIGURE 19. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 20. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, 2018-2026 (USD BILLION)
FIGURE 21. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 22. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, 2018-2026 (USD BILLION)
FIGURE 23. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 24. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, 2018-2026 (USD BILLION)
FIGURE 25. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 26. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, 2018-2026 (USD BILLION)
FIGURE 27. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 28. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2020 VS 2026 (%)
FIGURE 29. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2020 VS 2026 (USD BILLION)
FIGURE 30. COMPETITIVE STRATEGIC WINDOW FOR GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2026
FIGURE 31. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, 2018-2026 (USD BILLION)
FIGURE 32. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 33. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, 2018-2026 (USD BILLION)
FIGURE 34. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 35. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, 2018-2026 (USD BILLION)
FIGURE 36. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 37. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, 2018-2026 (USD BILLION)
FIGURE 38. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 39. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, 2018-2026 (USD BILLION)
FIGURE 40. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 41. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, 2018-2026 (USD BILLION)
FIGURE 42. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 43. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2020 VS 2026 (%)
FIGURE 44. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2020 VS 2026 (USD BILLION)
FIGURE 45. COMPETITIVE STRATEGIC WINDOW FOR GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2026
FIGURE 46. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, 2018-2026 (USD BILLION)
FIGURE 47. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 48. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, 2018-2026 (USD BILLION)
FIGURE 49. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 50. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, 2018-2026 (USD BILLION)
FIGURE 51. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 52. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, 2018-2026 (USD BILLION)
FIGURE 53. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 54. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, 2018-2026 (USD BILLION)
FIGURE 55. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 56. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, 2018-2026 (USD BILLION)
FIGURE 57. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, BY REGION, 2020 VS 2026 (USD BILLION)
FIGURE 58. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 59. ARGENTINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 60. BRAZIL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 61. CANADA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 62. MEXICO POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 63. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 64. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 65. AUSTRALIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 66. CHINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 67. INDIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 68. INDONESIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 69. JAPAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 70. MALAYSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 71. PHILIPPINES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 72. SINGAPORE POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 73. SOUTH KOREA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 74. THAILAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 75. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 76. FRANCE POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 77. GERMANY POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 78. ITALY POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 79. NETHERLANDS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 80. QATAR POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 81. RUSSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 82. SAUDI ARABIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 83. SOUTH AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 84. SPAIN POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 85. UNITED ARAB EMIRATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 86. UNITED KINGDOM POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
FIGURE 87. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: FPNV POSITIONING MATRIX
FIGURE 88. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: SHARE, BY KEY PLAYER, 2020
FIGURE 89. COMPETITIVE SCENARIO ANALYSIS IN GLOBAL POWER MANAGEMENT IC PACKAGING MARKET, BY TYPE

List of Tables
TABLE 1. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: MARKET SEGMENTATION & COVERAGE
TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2016–2020
TABLE 3. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 4. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2026 (USD BILLION)
TABLE 5. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY AUTOMOTIVE INFOTAINMENT & TELEMATIC DEVICES, BY REGION, 2018-2026 (USD BILLION)
TABLE 6. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL CAMERAS, BY REGION, 2018-2026 (USD BILLION)
TABLE 7. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DIGITAL TV PROCESSOR, BY REGION, 2018-2026 (USD BILLION)
TABLE 8. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY FITNESS TRACKERS & WEARABLE DEVICES, BY REGION, 2018-2026 (USD BILLION)
TABLE 9. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE INDUSTRIAL & MEDICAL DEVICES, BY REGION, 2018-2026 (USD BILLION)
TABLE 10. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PORTABLE MEDIA PLAYERS & READERS, BY REGION, 2018-2026 (USD BILLION)
TABLE 11. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SMARTPHONES, BY REGION, 2018-2026 (USD BILLION)
TABLE 12. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TABLETS & PCS, BY REGION, 2018-2026 (USD BILLION)
TABLE 13. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY TYPE, 2018-2026 (USD BILLION)
TABLE 14. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY BGA, BY REGION, 2018-2026 (USD BILLION)
TABLE 15. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HSOP32, BY REGION, 2018-2026 (USD BILLION)
TABLE 16. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVNON10, BY REGION, 2018-2026 (USD BILLION)
TABLE 17. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY HVQFN, BY REGION, 2018-2026 (USD BILLION)
TABLE 18. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY QFN, BY REGION, 2018-2026 (USD BILLION)
TABLE 19. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY WLCSP, BY REGION, 2018-2026 (USD BILLION)
TABLE 20. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SOLUTION, 2018-2026 (USD BILLION)
TABLE 21. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY CONFIGURABLE PMICS, BY REGION, 2018-2026 (USD BILLION)
TABLE 22. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY DC-TO-DC SOLUTIONS, BY REGION, 2018-2026 (USD BILLION)
TABLE 23. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY LINEAR VOLTAGE REGULATORS, BY REGION, 2018-2026 (USD BILLION)
TABLE 24. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR NETWORKING, BY REGION, 2018-2026 (USD BILLION)
TABLE 25. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY PMICS FOR I.MX APPLICATION PROCESSORS, BY REGION, 2018-2026 (USD BILLION)
TABLE 26. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET SIZE, BY SWITCHING REGULATORS, BY REGION, 2018-2026 (USD BILLION)
TABLE 27. AMERICAS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 28. ARGENTINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 29. BRAZIL POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 30. CANADA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 31. MEXICO POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 32. UNITED STATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 33. ASIA-PACIFIC POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 34. AUSTRALIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 35. CHINA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 36. INDIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 37. INDONESIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 38. JAPAN POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 39. MALAYSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 40. PHILIPPINES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 41. SINGAPORE POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 42. SOUTH KOREA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 43. THAILAND POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 44. EUROPE, MIDDLE EAST & AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 45. FRANCE POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 46. GERMANY POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 47. ITALY POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 48. NETHERLANDS POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 49. QATAR POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 50. RUSSIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 51. SAUDI ARABIA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 52. SOUTH AFRICA POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 53. SPAIN POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 54. UNITED ARAB EMIRATES POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 55. UNITED KINGDOM POWER MANAGEMENT IC PACKAGING MARKET SIZE, 2018-2026 (USD BILLION)
TABLE 56. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: SCORES
TABLE 57. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: BUSINESS STRATEGY
TABLE 58. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: PRODUCT SATISFACTION
TABLE 59. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: RANKING
TABLE 60. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: SHARE, BY KEY PLAYER, 2020
TABLE 61. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: MERGER & ACQUISITION
TABLE 62. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: AGREEMENT, COLLABORATION, & PARTNERSHIP
TABLE 63. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: NEW PRODUCT LAUNCH & ENHANCEMENT
TABLE 64. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: INVESTMENT & FUNDING
TABLE 65. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: AWARD, RECOGNITION, & EXPANSION
TABLE 66. GLOBAL POWER MANAGEMENT IC PACKAGING MARKET: LICENSE & PRICING
Note: Product cover images may vary from those shown
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  • ABLIC Inc.
  • Analog Devices / Linear Technology
  • Dialog Semiconductor
  • Good-Ark Semiconductor USA Corp.
  • HANA Micron Inc.
  • Jilin Sino-Microelectronics Co., Ltd.
  • Maxim Integrated Products Inc
  • Microchip Technology Inc
  • NXP Semiconductors N.V.
  • ON Semiconductor Corporation
  • Semtech Corporation
  • Shenzhen Electronics Group Co., Ltd.
  • Texas Instruments Incorporated
  • Toshiba Corporation
  • Wuxi China Resources Microelectronics Co. Ltd.
Note: Product cover images may vary from those shown

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