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Recap and Outlook for Global and Taiwanese IC Design Industries in 2019

  • Report

  • 30 Pages
  • November 2019
  • Region: Global, Taiwan
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 4852520

In 2018, the global IC design demand was affected by the slowdown of the smartphone market and seven consecutive years of declines in personal computers. Despite so, the global fabless IC design industry was still able to continue growth in 2018, driven mainly by the rise of emerging applications involved large-size high-resolution panels, AI (Artificial Intelligence), and 5G technology, which are shaping the industry trend from high computing efficiency toward high quality. In 2019, the continued demand for driver ICs and high-efficiency computing power is expected to slow the decline of the global fabless IC industry, ushering in a new development stage of China's fabless IC design industry. This report recaps the fabless IC industry development in 2018 from global and Taiwan perspectives, and analyzes key trends in 2019 and beyond.

List of Topics:

  • Development of the global IC design industry, touching on market and industry value forecasts for 2019, shipment share by region, and latest trends
  • Current and future developments of leading global IC design houses, as well as the top 10 world rankings, including the top 10 in China and Taiwan
  • Development of Chinese IC design houses, touching on the government's incentives, and M&A deals in recent years
  • Opportunities and challenges facing the IC design industry

Table of Contents

1. Overview
1.1 Global Semiconductor Market Development
1.2 Development of the Global IC Design Industry
1.2.1 Global Industry Value Witness Growth in 2018
1.3 The Fabless IC Design Industry by Region
1.3.1 Chinese IC Design Industry’s Global Share is Increasing Constantly
1.4 Development of Major IC Design Companies
1.5 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

2.Taiwan IC Design Industry Development
2.1 Shipment Value of the Taiwanese Fabless IC Design Industry
2.2 Product Mix Analysis
2.2.1 Fabless ICs for Computing, Communication, and Consumer Applications
2.2.2 Communication ICs Remain Mainstream
2.3 Major Taiwan IC Design Companies
2.4 IC Design Industry Development
2.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones
2.4.2 New Products and Applications to Drive Future Opportunity

3. Opportunities and Challenges
3.1 Impact of the China-US Trade Fight
3.1.1 Fabless IC Design is China’s Key Investment Focus
3.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China
3.1.3 Uncertainties Lead to New Industry Reorganization
3.2 AI Edge Computing Changing the IC Design Industry's Business Model

4. Perspective

Glossary of Terms
List of Companies

List of Tables
Table 1 Global Top 10 IC Design Companies
Table 2 China’s Top 10 Fabless IC Design Companies
Table 3 Taiwan Top 10 IC Design Companies in 2018

List of Figures
Figure 1 Global Semiconductor Market Value, 2013-2019
Figure 2 Global IC Design Industry Shipment Value, 2013-2019
Figure 3 Global IC Design Industry Market Share by Production Base, 2015 - 2019
Figure 4 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019
Figure 5 Taiwan IC Design Industry Shipment Share by Application
Figure 6 Taiwan IC Design Industry Shipment Share by Product Mix



Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • AMD
  • Apple
  • Beijing Horizon Robotics Technology
  • Beijing ISSI
  • Beijing Smartchip Microelectronics
  • Broadcom
  • Cambrian
  • China Electronics Corporation
  • DeePhi Technology
  • Elite
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • Hikvision
  • Himax
  • HiSilicon
  • Huawei
  • Huiding Technology
  • Marvell
  • MediaTek
  • Nokia
  • Novatek Microelectronics
  • NVidia
  • OmniVision
  • OnePlus
  • Oppo
  • Phison
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Silicon Motion
  • Sitronix
  • TSMC
  • Unisoc
  • Vivo
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE
  • ZTE Microelectronic


Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:


  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases


  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis