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Global Flexible Printed Circuit Board Market - Forecasts from 2019 to 2024

  • ID: 4895759
  • Report
  • November 2019
  • Region: Global
  • 135 pages
  • Knowledge Sourcing Intelligence LLP
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FEATURED COMPANIES

  • 3M
  • Amphenol Printed Circuits
  • CIREXX INTERNATIONAL
  • Epec, LLC
  • LG INNOTEK
  • MORE
The global flexible printed circuit board market was valued at US$15.937 billion in 2018 and is estimated to grow at a CAGR of 6.03% to reach a market value of US$22.649 billion by 2024. The demand for flexible printed circuit is primarily driven by the manufacturers of smartphones, other mobile devices, LCD display, connectivity antennas, and rechargeable batteries. Quality performance and high packaging flexibility of flexible PCBs are the key factors that are leading to its growing incorporation in various types of electronics across industries. Rising adoption of smartphones, rechargeable batteries and connectivity antennas are the major factors driving the demand for flexible printed circuits. In general, growing adoption of consumer electronics in developing regions have contributed to the development of flexible PCB market. This coupled with the increasing investment in IoT by major companies, and its burgeoning applications in the automotive sector are further fueling the flexible PCB market growth. will continue to make them highly preferred interconnectivity solutions in the near future.

The Global Flexible Printed Board Circuit - Forecasts from 2019 to 2024 is an exhaustive study which aims to present the key market trends through various chapters focusing on different aspects of the market. The study provides a detailed market overview through the market dynamics sections which detail key market, drivers, restraints, and opportunities in the current market. The report analyzes key opportunity regional markets, and the current technology penetration through lifecycle analysis. The report also analyzes the market through comprehensive market segmentation by type, material, application, and geography.

The global flexible printed circuit board market has been segmented based on type, material, application, and geography. By type, the market has been classified into single-sided flex, double sided flex, multi-layer flex, high density interconnects, and flex-rigid. By material used, the market has been classified as adhesives, finishes and insulators. By end-user industry, the market has been segmented as consumer electronics, automobile, power electronics, and others.

Regional analysis has been provided with detailed analysis and forecast for the period 2018 to 2024. The global market has been broken down into North America, South America, Europe, Middle East and Africa, and the Asia Pacific regions. The report also analyzes 15 countries across these regions with thorough analysis and forecast along with prevailing market trends and opportunities which each of these countries present for the manufacturers.

Major players in the global flexible printed circuit market have been covered along with their relative competitive position and strategies. The report also mentions recent deals and investments of different market players over the last year. The company profiles section details the business overview, financial performance for the past three years, key products and services being offered along with the recent developments of these important players in the global flexible printed circuit market.

Segmentation:

By Type
  • Single Sided Flex
  • Double Sided Flex
  • Multi-Layer Flex
  • High Density Interconnects
  • Flex-Rigid
By Material
  • Adhesives
  • Finishes
  • Insulators
By Application
  • Consumer Electronics
  • Automobile
  • Power Electronics
  • Others
By Geography

North America
  • USA
  • Mexico
  • Canada
  • South America
  • Brazil
  • Argentina
  • Others
Europe
  • Germany
  • France
  • United Kingdom
  • Spain
  • Others
Middle East and Africa
  • Saudi Arabia
  • UAE
  • Others
Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Others
The report will be delivered in 3 working days.
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • 3M
  • Amphenol Printed Circuits
  • CIREXX INTERNATIONAL
  • Epec, LLC
  • LG INNOTEK
  • MORE
1. Introduction
1.1. Market Definition
1.2. Market Segmentation

2. Research Methodology
2.1. Research Data
2.2. Assumptions

3. Executive Summary
3.1. Research Highlights

4. Market Dynamics
4.1. Market Drivers
4.2. Market Restraints
4.3. Porters Five Forces Analysis
4.3.1. Bargaining Power of Suppliers
4.3.2. Bargaining Power of Buyers
4.3.3. Threat of New Entrants
4.3.4. Threat of Substitutes
4.3.5. Competitive Rivalry in the Industry
4.4. Industry Value Chain Analysis

5. Global Flexible Printed Circuit Board Market Analysis, by Type
5.1. Introduction
5.2. Single Sided Flex
5.3. Double Sided Flex
5.4. Multi- Layer Flex
5.5. High Density Interconnect (HDI)

6. Global Flexible Printed Circuit Board Market Analysis, by Material
6.1. Introduction
6.2. Adhesives
6.3. Finishes
6.4. Insulators

7. Global Flexible Printed Circuit Board Market Analysis, by Application
7.1. Introduction
7.2. Consumer Electronics
7.3. Automobile
7.4. Power Electronics
7.5. Others

8. Global Flexible Printed Circuit Board Market Analysis, by Geography
8.1. Introduction
8.2. North America
8.2.1. North America Flexible Printed Circuit Market, By Type, 2018 to 2024
8.2.2. North America Flexible Printed Circuit Market, By Material, 2018 to 2024
8.2.3. North America Flexible Printed Circuit Market, By Application, 2018 to 2024
8.2.4. By Country
8.2.4.1. USA
8.2.4.1.1. By Type
8.2.4.1.2. By Material
8.2.4.1.3. By Application
8.2.4.2. Canada
8.2.4.2.1. By Type
8.2.4.2.2. By Material
8.2.4.2.3. By Application
8.2.4.3. Mexico
8.2.4.3.1. By Type
8.2.4.3.2. By Material
8.2.4.3.3. By Application
8.3. South America
8.3.1. South America Flexible Printed Circuit Market, By Type, 2018 to 2024
8.3.2. South America Flexible Printed Circuit Market, By Material, 2018 to 2024
8.3.3. South America Flexible Printed Circuit Market, By Application, 2018 to 2024
8.3.4. By Country
8.3.4.1. Brazil
8.3.4.1.1. By Type
8.3.4.1.2. By Material
8.3.4.1.3. By Application
8.3.4.2. Argentina
8.3.4.2.1. By Type
8.3.4.2.2. By Material
8.3.4.2.3. By Application
8.3.4.3. Others
8.4. Europe
8.4.1. Europe Flexible Printed Circuit Market, By Type, 2018 to 2024
8.4.2. Europe Flexible Printed Circuit Market, By Material, 2018 to 2024
8.4.3. Europe Flexible Printed Circuit Market, By Application, 2018 to 2024
8.4.4. By Country
8.4.4.1. Germany
8.4.4.1.1. By Type
8.4.4.1.2. By Material
8.4.4.1.3. By Application
8.4.4.2. France
8.4.4.2.1. By Type
8.4.4.2.2. By Material
8.4.4.2.3. By Application
8.4.4.3. United Kingdom
8.4.4.3.1. By Type
8.4.4.3.2. By Material
8.4.4.3.3. By Application
8.4.4.4. Spain
8.4.4.4.1. By Type
8.4.4.4.2. By Material
8.4.4.4.3. By Application
8.4.4.5. Others
8.5. Middle East and Africa
8.5.1. Middle East and Africa Flexible Printed Circuit Market, By Type, 2018 to 2024
8.5.2. Middle East and Africa Flexible Printed Circuit Market, By Material, 2018 to 2024
8.5.3. Middle East and Africa Flexible Printed Circuit Market, By Application, 2018 to 2024
8.5.4. By Country
8.5.4.1. Saudi Arabia
8.5.4.1.1. By Type
8.5.4.1.2. By Material
8.5.4.1.3. By Application
8.5.4.2. UAE
8.5.4.2.1. By Type
8.5.4.2.2. By Material
8.5.4.2.3. By Application
8.5.4.3. Others
8.6. Asia Pacific
8.6.1. Asia Pacific Flexible Printed Circuit Market, By Type, 2018 to 2024
8.6.2. Asia Pacific Flexible Printed Circuit Market, By Material, 2018 to 2024
8.6.3. Asia Pacific Flexible Printed Circuit Market, By Application, 2018 to 2024
8.6.4. By Country
8.6.4.1. China
8.6.4.1.1. By Type
8.6.4.1.2. By Material
8.6.4.1.3. By Application
8.6.4.2. Japan
8.6.4.2.1. By Type
8.6.4.2.2. By Material
8.6.4.2.3. By Application
8.6.4.3. South Korea
8.6.4.3.1. By Type
8.6.4.3.2. By Material
8.6.4.3.3. By Application
8.6.4.4. India
8.6.4.4.1. By Type
8.6.4.4.2. By Material
8.6.4.4.3. By Application
8.6.4.5. Others

9. Competitive Environment and Analysis
9.1. Major Players and Strategy Analysis
9.2. Emerging Players and Market Lucrativeness
9.3. Mergers, Acquisitions, Agreements, and Collaborations
9.4. Vendor Competitiveness Matrix

10. Company Profiles
10.1. Eltek Ltd., a Nistec Company
10.2. 3M
10.3. LG INNOTEK
10.4. Amphenol Printed Circuits
10.5. Millennium Circuits Limited
10.6. Epec, LLC
10.7. CIREXX INTERNATIONAL
10.8. All Flex Flexible Circuits & Heaters
10.9. Wurth Elektronik GmbH & Co. KG
10.10. AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
10.11.

11. Appendix
Note: Product cover images may vary from those shown
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  • Eltek Ltd., a Nistec Company
  • 3M
  • LG INNOTEK
  • Amphenol Printed Circuits
  • Millennium Circuits Limited
  • Epec, LLC
  • CIREXX INTERNATIONAL
  • All Flex Flexible Circuits & Heaters
  • Wurth Elektronik GmbH & Co. KG
  • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Note: Product cover images may vary from those shown
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