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Global ASIC Chip Market (2019-2025)

  • ID: 4900427
  • Report
  • December 2019
  • Region: Global
  • 200 pages
  • Marqual IT Solutions Pvt. Ltd (KBV Research)

FEATURED COMPANIES

  • Bitmain Tech
  • Infineon Technologies AG
  • Intel Corporation
  • Xilinx, Inc.
  • MORE
The Global ASIC Chip Market size is expected to reach $24.7 billion by 2025, rising at a market growth of 8.2% CAGR during the forecast period. Application Specific Integrated Circuit (ASIC) is the kind of integrated circuit (IC) for a particular purpose or application. An ASIC will boost performance because the desired feature is specifically designed to perform. These chip forms are highly customized to deliver superior performance in specific applications. However, once it is put into production, ASIC cannot be changed.

ASIC's market growth can be related to the increased demand for ASIC in the consumer electronics sector due to energy-efficient solutions and low implementation costs. On the basis of the complexity of the design, two or three ASICs are used by automotive manufacturers. Premium vehicle manufacturers use three ASICs for crash bags, air sensing, and audio amplifiers. Increasing demand for electric vehicles is expected to increase the use of ASICs in the automobile industry. The demand for application-specific ICs is also growing in other applications, like smart cards. The growing acceptance of contactless payments has an impact on the growth of the smart card IC industry. The growing penetration of mobile internet has increased transactions through smartphones and tablets, boosting the demand for EMV cards.

Based on Application, the market is segmented into Data Processing Systems, Consumer Electronics, Telecommunication Systems, Aerospace Subsystem & Sensors, Medical Instrumentation and Others. Based on Type, the market is segmented into Semi- Based Custom, Programmable Logic Devices and Others. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa. The U.S. is the fastest adopter of technology due to high growth in consumer electronics products, new automotive technology such as electric and hybrid vehicles, healthcare monitoring systems, and others. An increase in people's disposable income in the U.S. drives chip sales in this region. Therefore, growth in the semiconductor industry combined with an increase in trends
The major strategies followed by the market participants are Product launches and Partnerships & Collaborations. Based on the Analysis presented in the Cardinal matrix, Intel Corporation and Samsung Electronics Co., Ltd. (Samsung Group) are some of the forerunners in the ASIC Chip Market. The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Advanced Micro Devices, Inc., Samsung Electronics Co., Ltd. (Samsung Group), ON Semiconductor Corporation, Xilinx, Inc., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Intel Corporation, Infineon Technologies AG, Bitmain Technologies Holding Company, Nvidia Corporation, and Texas Instruments, Inc.

Recent strategies deployed in the ASIC Chip Market

Partnerships, Collaborations, and Agreements:

Oct-2019: Bitmain collaborated with DMG, a blockchain and technology company. In this collaboration, DMG will provide management and hosting services for Bitmain's Texas Facility and together they will work for the expansion of the capacity of its facility and will ascertain the efficient operations of Bitmain's newest technology ASIC miners.

Apr-2019: ON Semiconductor signed an agreement with GlobalFoundries in which GlobalFoundries will transfer the ownership of its 300mm fab facility located in East Fishkill, New York.

Feb-2019: Infineon teamed up with Xilinx and Xylon in which they launched logiHSSL, a new Xylon IP core. This allows high sped communication between Xilinx’ SoC, MPSoC and FPGA devices and Infineon’s AURIX™ TC2xx and TC3xx microcontrollers through Infineon High Speed Serial Link (HSSL). The HSSL interface has been used to exchange the data between customers' ASICs and AURIX devices for functional extension or performance.

Sep-2018: Samsung came into partnership with Squire Mining and Ganochips for manufacturing ASIC chips FPGA prototype in Korea. The companies are developing chips to mine the Bitcoin, Bitcoin Cash, and other associated cryptocurrencies with the use of wafer process technology.

May-2018: Samsung Electronics partnered with Avnet ASIC Israel Ltd., a leading provider of System on Chip and ASIC solutions. In this partnership, the companies will engaged in ASIC designing and manufacturing services that helps the customers in getting benefits from innovative ASIC design solutions implemented with wide proven silicon-proven ICs and most advanced process technologies.

Acquisition and Mergers:

Jun-2019: Intel signed an agreement for the acquisition of Barefoot Networks, a computer networking company. The acquisition supports Intel's focus on end-to-end infrastructure and cloud networking leadership and enables it to continue to deliver new experiences, workloads, and capabilities for data center customers.

Mar-2019: Nvidia signed a definitive agreement to acquire Mellanox, a supplier of computer networking products using InfiniBand and Ethernet technology. These companies will unite for high performance computing, and optimizes datacenter scale workloads across entire networking, computing, and storage stack for greater utilization, achieving high performance, and reducing the operating costs for customers.

Jul-2018: Intel acquired eASIC, a fabless semiconductor company that produces customizable eASIC chips for use in cloud and wireless environments. Through the acquisition, Intel is aimed at delivering eASIC as a transition to its customers as well as competitors who are using FPGA already and thinking for the migration on new things.

Jul-2018: Xilinx took over DeePhi, a startup focused towards the development of deep learning software for its FPGAs. The acquisition helps in grabbing hard-to find deep learning talent that develops neural-networking software already for Xilinx FPGAs.

Product Launches and Product Expansions:

Nov-2019: Intel unveiled Nervana™ Neural Network Processors (NNP) for training (NNP-T1000) and inference (NNP-I1000), its first purpose built ASICs for complex deep learning with incredible efficiency and scale for data center and cloud customers.

Aug-2019: Xilinx introduced the Virtex UltraScale+ VU19P, world's largest FPGA chip. This chip is an extension of its 16 nanometer (nm) Virtex UltraScale+ range and has 35 billion transistors and its increased capacity enables the prototyping and emulation of tomorrow's most advanced SoC and ASIC technologies.

Mar-2019: Infineon unveiled new voltage regulator solution, aimed at increasing the performance of advanced compute chips that are utilized in artificial intelligence (AI) servers and 5G data communication applications. Its latest DC-DC voltage regulators having the high phase count feature enables the GPUs, CPUs, FPGAs, ASICs, and other advanced chips for supporting high data workloads in efficient, secure, and cost-effective manner.

Mar-2019: Infineon extended its portfolio of high current system chipset solutions with the launch of XDPE132G5C, 16-phase digital PWM multiphase controller. The portfolio allows the current of 500 to 1000 A and higher for next generation FPGA, CPUs, ASICs, and GPUs used in 5G datacom applications and artificial intelligence servers.

Feb-2019: Bitmain launched BM1397, a new ASIC that improves the performance, energy efficiency, and chip size in mining proof-of-work cryptocurrencies. These cryptocurrencies are based on SHA256 algorithm, such as bitcoin cash (BCH) and bitcoin (BTC). This ASIC has been made with 7nm FinFET process from Bitmain chip supplier Taiwan Semiconductor Manufacturing Company and will feature in new Antminer mining devices - the S17 and T17.

Sep-2018: Bitmain introduced next-generation ASIC chip BM1391 for mining cryptocurrencies using SHA256 algorithm. This chip has been made with 7nm FinFET, world's most advanced semiconductor manufacturing technologies. This chip can be combined with more than a billion transistors and is optimized for maximum efficiency.

Scope of the Study

Market Segmentation:

By Application
  • Data Processing Systems
  • Consumer Electronics
  • Telecommunication Systems
  • Aerospace Subsystem & Sensors
  • Medical Instrumentation
  • Others
By Type
  • Semi- Based Custom
  • Programmable Logic Devices
  • Others
By Geography

North America
  • US
  • Canada
  • Mexico
  • Rest of North America
Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA
Companies Profiled
  • Advanced Micro Devices, Inc.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ON Semiconductor Corporation
  • Xilinx, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • Intel Corporation
  • Infineon Technologies AG
  • Bitmain Technologies Holding Company
  • Nvidia Corporation
  • Texas Instruments, Inc.
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Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Bitmain Tech
  • Infineon Technologies AG
  • Intel Corporation
  • Xilinx, Inc.
  • MORE
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global ASIC Chip Market, by Application
1.4.2 Global ASIC Chip Market, by Type
1.4.3 Global ASIC Chip Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Mergers & Acquisitions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2015-2019)
3.3.2 Key Strategic Move: (Collaborations, Partnerships and Agreements : 2019-Oct - 2017-Dec) Leading Players
3.3.3 Key Strategic Move: (Product Launches and Product Expansions: 2019-Nov - 2015-Aug) Leading Players

Chapter 4. Global ASIC Chip Market by Application
4.1 Global ASIC Chip Data Processing Systems Market by Region
4.2 Global ASIC Chip Consumer Electronics Market by Region
4.3 Global ASIC Chip Telecommunication Systems Market by Region
4.4 Global ASIC Chip Aerospace Subsystem & Sensors Market by Region
4.5 Global ASIC Chip Medical Instrumentation Market by Region
4.6 Global Other Application ASIC Chip Market by Region

Chapter 5. Global ASIC Chip Market by Type
5.1 Global Semi- Based Custom Market by Region
5.2 Global Programmable Logic Devices Market by Region
5.3 Global ASIC Chip Others Market by Region

Chapter 6. Global ASIC Chip Market by Region
6.1 North America ASIC Chip Market
6.1.1 North America ASIC Chip Market by Application
6.1.1.1 North America ASIC Chip Data Processing Systems Market by Country
6.1.1.2 North America ASIC Chip Consumer Electronics Market by Country
6.1.1.3 North America ASIC Chip Telecommunication Systems Market by Country
6.1.1.4 North America ASIC Chip Aerospace Subsystem & Sensors Market by Country
6.1.1.5 North America ASIC Chip Medical Instrumentation Market by Country
6.1.1.6 North America Other Application ASIC Chip Market by Country
6.1.2 North America ASIC Chip Market by Type
6.1.2.1 North America Semi- Based Custom Market by Country
6.1.2.2 North America Programmable Logic Devices Market by Country
6.1.2.3 North America ASIC Chip Others Market by Country
6.1.3 North America ASIC Chip Market by Country
6.1.3.1 US ASIC Chip Market
6.1.3.1.1 US ASIC Chip Market by Application
6.1.3.1.2 US ASIC Chip Market by Type
6.1.3.2 Canada ASIC Chip Market
6.1.3.2.1 Canada ASIC Chip Market by Application
6.1.3.2.2 Canada ASIC Chip Market by Type
6.1.3.3 Mexico ASIC Chip Market
6.1.3.3.1 Mexico ASIC Chip Market by Application
6.1.3.3.2 Mexico ASIC Chip Market by Type
6.1.3.4 Rest of North America ASIC Chip Market
6.1.3.4.1 Rest of North America ASIC Chip Market by Application
6.1.3.4.2 Rest of North America ASIC Chip Market by Type
6.2 Europe ASIC Chip Market
6.2.1 Europe ASIC Chip Market by Application
6.2.1.1 Europe ASIC Chip Data Processing Systems Market by Country
6.2.1.2 Europe ASIC Chip Consumer Electronics Market by Country
6.2.1.3 Europe ASIC Chip Telecommunication Systems Market by Country
6.2.1.4 Europe ASIC Chip Aerospace Subsystem & Sensors Market by Country
6.2.1.5 Europe ASIC Chip Medical Instrumentation Market by Country
6.2.1.6 Europe Other Application ASIC Chip Market by Country
6.2.2 Europe ASIC Chip Market by Type
6.2.2.1 Europe Semi- Based Custom Market by Country
6.2.2.2 Europe Programmable Logic Devices Market by Country
6.2.2.3 Europe ASIC Chip Others Market by Country
6.2.3 Europe ASIC Chip Market by Country
6.2.3.1 Germany ASIC Chip Market
6.2.3.1.1 Germany ASIC Chip Market by Application
6.2.3.1.2 Germany ASIC Chip Market by Type
6.2.3.2 UK ASIC Chip Market
6.2.3.2.1 UK ASIC Chip Market by Application
6.2.3.2.2 UK ASIC Chip Market by Type
6.2.3.3 France ASIC Chip Market
6.2.3.3.1 France ASIC Chip Market by Application
6.2.3.3.2 France ASIC Chip Market by Type
6.2.3.4 Russia ASIC Chip Market
6.2.3.4.1 Russia ASIC Chip Market by Application
6.2.3.4.2 Russia ASIC Chip Market by Type
6.2.3.5 Spain ASIC Chip Market
6.2.3.5.1 Spain ASIC Chip Market by Application
6.2.3.5.2 Spain ASIC Chip Market by Type
6.2.3.6 Italy ASIC Chip Market
6.2.3.6.1 Italy ASIC Chip Market by Application
6.2.3.6.2 Italy ASIC Chip Market by Type
6.2.3.7 Rest of Europe ASIC Chip Market
6.2.3.7.1 Rest of Europe ASIC Chip Market by Application
6.2.3.7.2 Rest of Europe ASIC Chip Market by Type
6.3 Asia Pacific ASIC Chip Market
6.3.1 Asia Pacific ASIC Chip Market by Application
6.3.1.1 Asia Pacific ASIC Chip Data Processing Systems Market by Country
6.3.1.2 Asia Pacific ASIC Chip Consumer Electronics Market by Country
6.3.1.3 Asia Pacific ASIC Chip Telecommunication Systems Market by Country
6.3.1.4 Asia Pacific ASIC Chip Aerospace Subsystem & Sensors Market by Country
6.3.1.5 Asia Pacific ASIC Chip Medical Instrumentation Market by Country
6.3.1.6 Asia Pacific Other Application ASIC Chip Market by Country
6.3.2 Asia Pacific ASIC Chip Market by Type
6.3.2.1 Asia Pacific Semi- Based Custom Market by Country
6.3.2.2 Asia Pacific Programmable Logic Devices Market by Country
6.3.2.3 Asia Pacific ASIC Chip Others Market by Country
6.3.3 Asia Pacific ASIC Chip Market by Country
6.3.3.1 China ASIC Chip Market
6.3.3.1.1 China ASIC Chip Market by Application
6.3.3.1.2 China ASIC Chip Market by Type
6.3.3.2 Japan ASIC Chip Market
6.3.3.2.1 Japan ASIC Chip Market by Application
6.3.3.2.2 Japan ASIC Chip Market by Type
6.3.3.3 India ASIC Chip Market
6.3.3.3.1 India ASIC Chip Market by Application
6.3.3.3.2 India ASIC Chip Market by Type
6.3.3.4 South Korea ASIC Chip Market
6.3.3.4.1 South Korea ASIC Chip Market by Application
6.3.3.4.2 South Korea ASIC Chip Market by Type
6.3.3.5 Singapore ASIC Chip Market
6.3.3.5.1 Singapore ASIC Chip Market by Application
6.3.3.5.2 Singapore ASIC Chip Market by Type
6.3.3.6 Malaysia ASIC Chip Market
6.3.3.6.1 Malaysia ASIC Chip Market by Application
6.3.3.6.2 Malaysia ASIC Chip Market by Type
6.3.3.7 Rest of Asia Pacific ASIC Chip Market
6.3.3.7.1 Rest of Asia Pacific ASIC Chip Market by Application
6.3.3.7.2 Rest of Asia Pacific ASIC Chip Market by Type
6.4 LAMEA ASIC Chip Market
6.4.1 LAMEA ASIC Chip Market by Application
6.4.1.1 LAMEA ASIC Chip Data Processing Systems Market by Country
6.4.1.2 LAMEA ASIC Chip Consumer Electronics Market by Country
6.4.1.3 LAMEA ASIC Chip Telecommunication Systems Market by Country
6.4.1.4 LAMEA ASIC Chip Aerospace Subsystem & Sensors Market by Country
6.4.1.5 LAMEA ASIC Chip Medical Instrumentation Market by Country
6.4.1.6 LAMEA Other Application ASIC Chip Market by Country
6.4.2 LAMEA ASIC Chip Market by Type
6.4.2.1 LAMEA Semi- Based Custom Market by Country
6.4.2.2 LAMEA Programmable Logic Devices Market by Country
6.4.2.3 LAMEA ASIC Chip Others Market by Country
6.4.3 LAMEA ASIC Chip Market by Country
6.4.3.1 Brazil ASIC Chip Market
6.4.3.1.1 Brazil ASIC Chip Market by Application
6.4.3.1.2 Brazil ASIC Chip Market by Type
6.4.3.2 Argentina ASIC Chip Market
6.4.3.2.1 Argentina ASIC Chip Market by Application
6.4.3.2.2 Argentina ASIC Chip Market by Type
6.4.3.3 UAE ASIC Chip Market
6.4.3.3.1 UAE ASIC Chip Market by Application
6.4.3.3.2 UAE ASIC Chip Market by Type
6.4.3.4 Saudi Arabia ASIC Chip Market
6.4.3.4.1 Saudi Arabia ASIC Chip Market by Application
6.4.3.4.2 Saudi Arabia ASIC Chip Market by Type
6.4.3.5 South Africa ASIC Chip Market
6.4.3.5.1 South Africa ASIC Chip Market by Application
6.4.3.5.2 South Africa ASIC Chip Market by Type
6.4.3.6 Nigeria ASIC Chip Market
6.4.3.6.1 Nigeria ASIC Chip Market by Application
6.4.3.6.2 Nigeria ASIC Chip Market by Type
6.4.3.7 Rest of LAMEA ASIC Chip Market
6.4.3.7.1 Rest of LAMEA ASIC Chip Market by Application
6.4.3.7.2 Rest of LAMEA ASIC Chip Market by Type

Chapter 7. Company Profiles
7.1 Advanced Micro Devices, Inc.
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.4 Research & Development Expenses
7.2 Samsung Electronics Co., Ltd. (Samsung Group)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Partnerships, Collaborations, and Agreements:
7.2.6 SWOT Analysis
7.3 ON Semiconductor Corporation
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Segmental and Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Partnerships, Collaborations, and Agreements:
7.3.6 SWOT Analysis
7.4 Xilinx, Inc.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Product Launches and Product Expansions:
7.4.5.2 Acquisition and Mergers:
7.5 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Regional Analysis
7.5.4 Research & Development Expenses
7.6 Intel Corporation
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Segmental and Regional Analysis
7.6.4 Research & Development Expenses
7.6.5 Recent strategies and developments:
7.6.5.1 Product Launches and Product Expansions:
7.6.5.2 Acquisition and Mergers:
7.6.6 SWOT Analysis
7.7 Infineon Technologies AG
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Partnerships, Collaborations, and Agreements:
7.7.5.2 Product Launches and Product Expansions:
7.7.6 SWOT Analysis
7.8 Bitmain Technologies Holding Company
7.8.1 Company Overview
7.8.2 Recent strategies and developments:
7.8.2.1 Partnerships, Collaborations, and Agreements:
7.8.2.2 Product Launches and Product Expansions:
7.9 Nvidia Corporation
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental and Regional Analysis
7.9.4 Research & Development Expense
7.9.5 Recent strategies and developments:
7.9.5.1 Acquisition and Mergers:
7.9.6 SWOT Analysis
7.1 Texas Instruments, Inc.
7.10.1 Company Overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expense
7.10.5 Recent strategies and developments:
7.10.5.1 Partnerships, Collaborations, and Agreements:
7.10.6 SWOT Analysis
Note: Product cover images may vary from those shown
  • Advanced Micro Devices, Inc.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ON Semiconductor Corporation
  • Xilinx, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • Intel Corporation
  • Infineon Technologies AG
  • Bitmain Tech
Note: Product cover images may vary from those shown

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