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Application-specific Integrated Circuit Market - Global Forecast 2025-2032

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    Report

  • 195 Pages
  • October 2025
  • Region: Global
  • 360iResearch™
  • ID: 4904655
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The application-specific integrated circuit (ASIC) market is experiencing accelerated change, driven by the need for specialized silicon solutions tailored to specific end-use sectors. Senior executives prioritizing innovation, operational efficiency, and robust supply chains are closely monitoring transformations in technology, regulation, and partner ecosystems shaping this sector.

Market Snapshot: ASIC Market Size and Growth Momentum

In 2024, the global ASIC market achieved a value of USD 19.25 billion. It is forecast to reach USD 20.43 billion by 2025, reflecting a compound annual growth rate (CAGR) of 6.57%. Projections extend growth to USD 32.04 billion by 2032, propelled by increasing adoption in emerging applications and ongoing advancements in chip architecture. Sustained investment in research and robust regional demand contribute to the sector’s positive outlook.

Scope & Segmentation of the Application-Specific Integrated Circuit Market

  • Technology: Market offerings include full custom ASIC, programmable ASIC, and semi-custom ASIC types, each supporting diverse project requirements.
  • Technology Node: Segmentations cover multiple process nodes including 29-90nm, 7nm & below, 8-28nm, and above 90nm, allowing for varied performance, integration, and power efficiencies.
  • Design Type: Choices encompass both analog ASICs and digital ASICs, tailoring solutions to the operational context of end-users.
  • Application: Key end-use segments encompass automotive; consumer electronics—such as audio/video systems, digital cameras, gaming consoles, smartphones, tablets, and wearable devices; healthcare, with diagnostic tools, implantable and imaging devices, and wearable health monitoring; industrial sectors including control systems, machine vision, IIoT, robotics, automation, and smart grids; military and defense operations; and telecommunications infrastructure.
  • Region: Market coverage spans the Americas—United States, Canada, Mexico, Brazil, Argentina, Chile, Colombia, Peru; Europe—United Kingdom, Germany, France, Russia, Italy, Spain, Netherlands, Sweden, Poland, Switzerland; Middle East—United Arab Emirates, Saudi Arabia, Qatar, Turkey, Israel; Africa—South Africa, Nigeria, Egypt, Kenya; and Asia-Pacific—China, India, Japan, Australia, South Korea, Indonesia, Thailand, Malaysia, Singapore, Taiwan. Each region reflects a unique blend of regulatory priorities and growth drivers.
  • Key Companies: Leading market participants include Advanced Linear Devices Inc., Synaptics Incorporated, Okika Devices, Renesas Electronics Corporation, ams-OSRAM AG, Dai Nippon Printing Co. Ltd., Infineon Technologies AG, Seiko Epson Corporation, ASIX Electronics Corporation, Hilscher Gesellschaft für Systemautomation mbH, Socionext Inc., Japan Semiconductor Corporation, STMicroelectronics International N.V., Softing AG, Procentec, Faraday Technology Corporation, ShengyuIC, Broadcom Inc., Intel Corporation, OMNIVISION Technologies Inc., Beijing Dwin Technology Co. Ltd., and Tekmos Inc.

Key Takeaways for Senior Decision-Makers

  • Increasing design complexity in electronics has heightened the value of customized ASIC solutions that enable more efficient computing and reduced power consumption.
  • Strategic collaboration between vendors, design firms, and end-users is accelerating chip innovations, especially within automotive applications, industrial automation, and connectivity solutions.
  • Process node evolution—from mature to advanced nodes—empowers stakeholders to balance cost, performance, and integration, optimizing products for distinct industry requirements.
  • Segmentation embracing both analog and digital design enables targeting of industry-specific needs, addressing demands from scalable telecommunications hardware to healthcare device miniaturization.
  • Growing access to sophisticated process nodes and new foundry partnerships is leveling the playing field for smaller design entities, encouraging competition and sectoral specialization.

Tariff Impact: Navigating United States Trade Measures

The implementation of new United States tariffs in 2025 has led ASIC stakeholders to adapt supply chain strategies. Organizations are revising procurement methods and channel relationships, often shifting production volumes across regions to mitigate tariff effects. Enhanced risk management and compliance are now crucial for sustaining resilience and meeting contractual obligations amid evolving regulatory frameworks.

Methodology & Data Sources

This analysis synthesizes structured interviews with senior executives, semiconductor fabricators, and major end-users, complemented by reviews of regulatory documentation, industry filings, and trade association data. Expert consultations and scenario modeling are integrated to ensure reliable and triangulated market insights.

Why This Report Matters: Application-Specific Integrated Circuit Market Insights

  • Enables senior leaders to navigate evolving ASIC market trends and regional dynamics, supporting strategic investment and operational decisions.
  • Offers procurement, compliance, and R&D teams targeted analysis on how technology advancement and regulatory shifts influence priorities and risks.
  • Delivers clear visibility into partner and vendor ecosystems, equipping organizations to pursue collaboration opportunities or strengthen risk mitigation strategies.

Conclusion

The ASIC market is set for continued advancement as sector-driven needs, regulatory factors, and technology integration inform growth trajectories. Forward-looking organizations adapting proactively and building strategic partnerships position themselves to capture new market opportunities and strengthen enterprise resilience.

 

Additional Product Information:

  • Purchase of this report includes 1 year online access with quarterly updates.
  • This report can be updated on request. Please contact our Customer Experience team using the Ask a Question widget on our website.

Table of Contents

1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders
2. Research Methodology
3. Executive Summary
4. Market Overview
5. Market Insights
5.1. Rapid growth in AI and machine learning workloads driving demand for custom ASIC accelerators
5.2. Rise of 5G infrastructure rollout accelerating development of specialized ASICs for network equipment
5.3. Adoption of chiplet-based designs enabling modular ASIC architectures for scalable performance
5.4. Surge in demand for low-power edge computing ASICs in IoT and wearable device applications
5.5. Integration of hardware-based security features in ASICs to counter emerging cybersecurity threats
5.6. Localization of semiconductor manufacturing fueling regional ASIC supply chain resilience strategies
5.7. Advancements in 3D IC stacking techniques enhancing ASIC performance and power efficiency
5.8. Increasing adoption of AI accelerators driving specialized ASIC demand
5.9. Integrating advanced packaging technologies for next-generation ASIC performance
5.10. Emphasis on low-power design methodologies for battery-constrained ASIC applications
6. Cumulative Impact of United States Tariffs 2025
7. Cumulative Impact of Artificial Intelligence 2025
8. Application-specific Integrated Circuit Market, by Technology
8.1. Full Custom ASIC
8.2. Programmable ASIC
8.3. Semi-Custom ASIC
9. Application-specific Integrated Circuit Market, by Technology Node
9.1. 29-90nm
9.2. 7nm & Below
9.3. 8-28nm
9.4. Above 90nm
10. Application-specific Integrated Circuit Market, by Design Type
10.1. Analog ASICs
10.2. Digital ASICs
11. Application-specific Integrated Circuit Market, by Application
11.1. Automotive
11.2. Consumer Electronics
11.2.1. Audio/Video Systems
11.2.2. Digital Cameras
11.2.3. Gaming Consoles
11.2.4. Smartphones & Tablets
11.2.5. Wearable Devices
11.3. Healthcare
11.3.1. Diagnostic Tools
11.3.2. Implantable Devices
11.3.3. Medical Imaging Devices
11.3.4. Wearable Health Devices
11.4. Industrial
11.4.1. Control Systems
11.4.2. Industrial Internet of Things (IIoT)
11.4.3. Machine Vision
11.4.4. Robotics & Automation
11.4.5. Smart Grids
11.5. Military & Defense
11.6. Telecommunications
12. Application-specific Integrated Circuit Market, by Region
12.1. Americas
12.1.1. North America
12.1.2. Latin America
12.2. Europe, Middle East & Africa
12.2.1. Europe
12.2.2. Middle East
12.2.3. Africa
12.3. Asia-Pacific
13. Application-specific Integrated Circuit Market, by Group
13.1. ASEAN
13.2. GCC
13.3. European Union
13.4. BRICS
13.5. G7
13.6. NATO
14. Application-specific Integrated Circuit Market, by Country
14.1. United States
14.2. Canada
14.3. Mexico
14.4. Brazil
14.5. United Kingdom
14.6. Germany
14.7. France
14.8. Russia
14.9. Italy
14.10. Spain
14.11. China
14.12. India
14.13. Japan
14.14. Australia
14.15. South Korea
15. Competitive Landscape
15.1. Market Share Analysis, 2024
15.2. FPNV Positioning Matrix, 2024
15.3. Competitive Analysis
15.3.1. Advanced Linear Devices, Inc.
15.3.2. Synaptics Incorporated
15.3.3. Okika Devices
15.3.4. Renesas Electronics Corporation.
15.3.5. ams-OSRAM AG
15.3.6. Dai Nippon Printing Co., Ltd.
15.3.7. Infineon Technologies AG
15.3.8. Seiko Epson Corporation
15.3.9. ASIX Electronics Corporation.
15.3.10. Hilscher Gesellschaft für Systemautomation mbH
15.3.11. Socionext Inc.
15.3.12. Japan Semiconductor Corporation
15.3.13. STMicroelectronics International N.V.
15.3.14. Softing AG
15.3.15. Procentec
15.3.16. Faraday Technology Corporation
15.3.17. ShengyuIC
15.3.18. Broadcom, Inc.
15.3.19. Intel Corporation
15.3.20. OMNIVISION Technologies, Inc.
15.3.21. Beijing Dwin Technology Co., Ltd.
15.3.22. Tekmos Inc.
List of Tables
List of Figures

Samples

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Companies Mentioned

The key companies profiled in this Application-specific Integrated Circuit market report include:
  • Advanced Linear Devices, Inc.
  • Synaptics Incorporated
  • Okika Devices
  • Renesas Electronics Corporation.
  • ams-OSRAM AG
  • Dai Nippon Printing Co., Ltd.
  • Infineon Technologies AG
  • Seiko Epson Corporation
  • ASIX Electronics Corporation.
  • Hilscher Gesellschaft für Systemautomation mbH
  • Socionext Inc.
  • Japan Semiconductor Corporation
  • STMicroelectronics International N.V.
  • Softing AG
  • Procentec
  • Faraday Technology Corporation
  • ShengyuIC
  • Broadcom, Inc.
  • Intel Corporation
  • OMNIVISION Technologies, Inc.
  • Beijing Dwin Technology Co., Ltd.
  • Tekmos Inc.

Table Information