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Global Radiation-Hardened Electronics Market - Premium Insight, Competitive News Feed Analysis, Company Usability Profiles, Market Sizing & Forecasts to 2025

  • ID: 4968883
  • Report
  • February 2020
  • Region: Global
  • 102 pages
  • 360iResearch
UP TO OFF
until May 31st 2020
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FEATURED COMPANIES

  • BAE Systems PLC
  • Honeywell Aerospace
  • Intersil Corporation
  • Microchip Technology Inc.
  • Microelectronics NV
  • Microsemi Corp.
  • MORE
The Global Radiation-Hardened Electronics Market is expected to grow from USD 1,923.13 Million in 2018 to USD 2,671.13 Million by the end of 2025 at a Compound Annual Growth Rate (CAGR) of 4.80%.

The positioning of the Global Radiation-Hardened Electronics Market vendors in the FPNV Positioning Matrix are determined by Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) and placed into four quadrants (F: Forefront, P: Pathfinders, N: Niche, and V: Vital).

The report exploresthe recent significant developments by the leading vendors and innovation profiles in the Global Radiation-Hardened Electronics Market including are Intersil Corporation, Linear Technology Corporation, Maxwell Technologies, Inc., Microchip Technology Inc., Xilinx, Inc., BAE Systems PLC, Honeywell Aerospace, Microelectronics NV, Microsemi Corp., and Texas Instruments, Inc.

On the basis of Manufacturing Technique, the Global Radiation-Hardened Electronics Market is examined across Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP).

On the basis of Component , the Global Radiation-Hardened Electronics Market is examined across ASIC, FPGA, Logic, Memory, and Power Management.

On the basis of Application, the Global Radiation-Hardened Electronics Market is examined across Aerospace & Defense, Nuclear Power Plant, and Space (Satellite).

For the detailed coverage of the study, the market has been geographically divided into the Americas, Asia-Pacific, and Europe, Middle East & Africa. The report provides details of qualitative and quantitative insights about the major countries in the region and taps the major regional developments in detail.

In the report, we have covered two proprietary models, the FPNV Positioning Matrix and Competitive Strategic Window. The FPNV Positioning Matrix analyses the competitive market place for the players in terms of product satisfaction and business strategy they adopt to sustain in the market. The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies. The Competitive Strategic Window helps the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. During a forecast period, it defines the optimal or favorable fit for the vendors to adopt successive merger and acquisitions strategies, geography expansion, research & development, new product introduction strategies to execute further business expansion and growth.

Research Methodology:

The market forecasting is based on a market model derived from market connectivity, dynamics, and identified influential factors around which assumptions about the market are made. These assumptions are enlightened by fact-bases, put by primary and secondary research instruments, regressive analysis and an extensive connect with industry people. Market forecasting derived from in-depth understanding attained from future market spending patterns provides quantified insight to support your decision-making process. The interview is recorded, and the information gathered in put on the drawing board with the information collected through secondary research.

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on sulfuric acid offered by the key players in the Global Radiation-Hardened Electronics Market
2. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and new product developments in the Global Radiation-Hardened Electronics Market
3. Market Development: Provides in-depth information about lucrative emerging markets and analyzes the markets for the Global Radiation-Hardened Electronics Market
4. Market Diversification: Provides detailed information about new products launches, untapped geographies, recent developments, and investments in the Global Radiation-Hardened Electronics Market
5. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, and manufacturing capabilities of the leading players in the Global Radiation-Hardened Electronics Market

The report answers questions such as:

1. What is the market size of the global Radiation-Hardened Electronics market?
2. What are the factors that affect the growth in the Global Radiation-Hardened Electronics Market over the forecast period?
3. What is the competitive position in the Global Radiation-Hardened Electronics Market?
4. Which are the best product areas to be invested in over the forecast period in the Global Radiation-Hardened Electronics Market?
5. What are the opportunities in the Global Radiation-Hardened Electronics Market?
6. What are the modes of entering the Global Radiation-Hardened Electronics Market?
Note: Product cover images may vary from those shown
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FEATURED COMPANIES

  • BAE Systems PLC
  • Honeywell Aerospace
  • Intersil Corporation
  • Microchip Technology Inc.
  • Microelectronics NV
  • Microsemi Corp.
  • MORE
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders

2. Research & Forecasting
2.1. Research Methodology
2.1.1. Research Process
2.1.2. Research Framework
2.1.3. Research Reliability & Validity
2.1.4. Research Assumptions
2.2. Forecasting Methodology
2.3. Research Outcome
2.3.1. Competitive Strategic Window
2.3.1.1. Leverage Zone
2.3.1.2. Vantage Zone
2.3.1.3. Speculative Zone
2.3.1.4. Bottleneck Zone
2.3.2. FPNV Positioning Matrix
2.3.2.1. Quadrants
2.3.2.1.1. Forefront
2.3.2.1.2. Pathfinders
2.3.2.1.3. Niche
2.3.2.1.4. Vital
2.3.2.2. Business Strategy
2.3.2.2.1. Business Growth
2.3.2.2.2. Industry Coverage
2.3.2.2.3. Financial Viability
2.3.2.2.4. Channel Support
2.3.2.3. Product Satisfaction
2.3.2.3.1. Value for Money
2.3.2.3.2. Ease of Use
2.3.2.3.3. Product Features
2.3.2.3.4. Customer Support

3. Executive Summary
3.1. Outlook in the Radiation-Hardened Electronics Market
3.2. Opportunities in the Radiation-Hardened Electronics Market

4. Premium Insight
4.1. Market Connectivity
4.2. Market Dynamics
4.2.1. Drivers
4.2.2. Restraints
4.2.3. Opportunities
4.2.4. Challenges
4.3. Porter’s Five Forces Analysis
4.3.1. Threat of New Entrants
4.3.2. Threat of Substitutes
4.3.3. Bargaining Power of Customers
4.3.4. Bargaining Power of Suppliers
4.3.5. Industry Rivalry
4.4. Industry Trends

5. Global Radiation-Hardened Electronics Market, by Manufacturing Technique
5.1. Overview
5.2. Market Sizing & Forecasting
5.3. Radiation Hardening by Design (RHBD)
5.4. Radiation Hardening by Process (RHBP)

6. Global Radiation-Hardened Electronics Market, by Component
6.1. Overview
6.2. Market Sizing & Forecasting
6.3. ASIC
6.4. FPGA
6.5. Logic
6.6. Memory
6.7. Power Management

7. Global Radiation-Hardened Electronics Market, by Application
7.1. Overview
7.2. Market Sizing & Forecasting
7.3. Aerospace & Defense
7.4. Nuclear Power Plant
7.5. Space (Satellite)

8. Global Radiation-Hardened Electronics Market, by Geography
8.1. Overview
8.2. Market Sizing & Forecasting
8.3. Americas
8.3.1. Overview
8.3.2. Market Sizing & Forecasting
8.3.3. Argentina
8.3.4. Brazil
8.3.5. Canada
8.3.6. Mexico
8.3.7. United States
8.4. Asia-Pacific
8.4.1. Overview
8.4.2. Market Sizing & Forecasting
8.4.3. Australia
8.4.4. China
8.4.5. India
8.4.6. Japan
8.5. Europe, Middle East & Africa
8.5.1. Overview
8.5.2. Market Sizing & Forecasting
8.5.3. France
8.5.4. Germany
8.5.5. Italy
8.5.6. Spain
8.5.7. United Kingdom

9. Competitive Landscape
9.1. FPNV Positioning Matrix for Global Radiation-Hardened Electronics Market
9.2. Market Vendor Ranking Analysis for Global Radiation-Hardened Electronics Market
9.3. Competitive News Feed Analysis for Global Radiation-Hardened Electronics Market

10. Company Usability Profiles
10.1. Intersil Corporation
10.1.1. Overview
10.1.2. Strategy
10.1.3. SWOT
10.2. Linear Technology Corporation
10.2.1. Overview
10.2.2. Strategy
10.2.3. SWOT
10.3. Maxwell Technologies, Inc.
10.3.1. Overview
10.3.2. Strategy
10.3.3. SWOT
10.4. Microchip Technology Inc.
10.4.1. Overview
10.4.2. Strategy
10.4.3. SWOT
10.5. Xilinx, Inc.
10.5.1. Overview
10.5.2. Strategy
10.5.3. SWOT
10.6. BAE Systems PLC
10.7. Honeywell Aerospace
10.8. Microelectronics NV
10.9. Microsemi Corp.
10.10. Texas Instruments, Inc

11. Appendix
11.1. Discussion Guide
11.2. Top Reports
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11.2.3. Global Payment Gateway Market - Premium Insight, Competitive News Feed Analysis, Company Usability Profiles, Market Sizing & Forecasts to 2025
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11.3. Author Details
Note: Product cover images may vary from those shown
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  • Intersil Corporation
  • Linear Technology Corporation
  • Maxwell Technologies, Inc.
  • Microchip Technology Inc.
  • Xilinx, Inc.
  • BAE Systems PLC
  • Honeywell Aerospace
  • Microelectronics NV
  • Microsemi Corp.
  • Texas Instruments, Inc
Note: Product cover images may vary from those shown
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