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ESD Foam Packaging Market Research Report by Material & Additive - Global Forecast to 2025 - Cumulative Impact of COVID-19

  • ID: 4989687
  • Report
  • June 2020
  • Region: Global
  • 217 pages
  • 360iResearch™
until Dec 31st 2020
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The Global ESD Foam Packaging Market to Grow USD 315.78 Million by 2025, at a CAGR of 6.23%


  • Botron Company, Inc.
  • Elcom U.k. Ltd.
  • Gwp Group Limited
  • Helios Packaging
  • Nefab Ab
  • Tekins Limited
  • MORE
The Global ESD Foam Packaging Market is expected to grow from USD 219.69 Million in 2019 to USD 315.78 Million by the end of 2025 at a Compound Annual Growth Rate (CAGR) of 6.23%.

Market Segmentation & Coverage:

This research report categorizes the ESD Foam Packaging to forecast the revenues and analyze the trends in each of the following sub-markets:

On the basis of Material & Additive, the ESD Foam Packaging Market is examined across Conductive Polymer and Dissipative Polymer.

On the basis of End-User, the ESD Foam Packaging Market is examined across Aerospace, Automobile, Defense and Military, Electrical and Electronics, and Manufacturing.

On the basis of Geography, the ESD Foam Packaging Market is examined across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas region is examined across Argentina, Brazil, Canada, Mexico, and United States. The Asia-Pacific region is examined across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, South Korea, and Thailand. The Europe, Middle East & Africa region is examined across France, Germany, Italy, Netherlands, Qatar, Russia, Saudi Arabia, South Africa, Spain, United Arab Emirates, and United Kingdom.

Company Usability Profiles:

The report deeply explores the recent significant developments by the leading vendors and innovation profiles in the Global ESD Foam Packaging Market including Botron Company, Inc., Conductive Containers, Inc., Elcom U.k. Ltd., Electrotek Static Controls Pvt. Ltd., Gwp Group Limited, Helios Packaging, Nefab Ab, Statclean Technology (s) Pte Ltd., and Tekins Limited.

FPNV Positioning Matrix:

The FPNV Positioning Matrix evaluates and categorizes the vendors in the ESD Foam Packaging Market on the basis of Business Strategy (Business Growth, Industry Coverage, Financial Viability, and Channel Support) and Product Satisfaction (Value for Money, Ease of Use, Product Features, and Customer Support) that aids businesses in better decision making and understanding the competitive landscape.

Competitive Strategic Window:

The Competitive Strategic Window analyses the competitive landscape in terms of markets, applications, and geographies. The Competitive Strategic Window helps the vendor define an alignment or fit between their capabilities and opportunities for future growth prospects. During a forecast period, it defines the optimal or favorable fit for the vendors to adopt successive merger and acquisition strategies, geography expansion, research & development, and new product introduction strategies to execute further business expansion and growth.

Cumulative Impact of COVID-19:

COVID-19 is an incomparable global public health emergency that has affected almost every industry, so for and, the long-term effects projected to impact the industry growth during the forecast period. Our ongoing research amplifies our research framework to ensure the inclusion of underlaying COVID-19 issues and potential paths forward. The report is delivering insights on COVID-19 considering the changes in consumer behavior and demand, purchasing patterns, re-routing of the supply chain, dynamics of current market forces, and the significant interventions of governments. The updated study provides insights, analysis, estimations, and forecast, considering the COVID-19 impact on the market.

The report provides insights on the following pointers:

1. Market Penetration: Provides comprehensive information on sulfuric acid offered by the key players
2. Market Development: Provides in-depth information about lucrative emerging markets and analyzes the markets
3. Market Diversification: Provides detailed information about new product launches, untapped geographies, recent developments, and investments
4. Competitive Assessment & Intelligence: Provides an exhaustive assessment of market shares, strategies, products, and manufacturing capabilities of the leading players
5. Product Development & Innovation: Provides intelligent insights on future technologies, R&D activities, and new product developments

The report answers questions such as:

1. What is the market size and forecast of the Global ESD Foam Packaging Market?
2. What are the inhibiting factors and impact of COVID-19 shaping the Global ESD Foam Packaging Market during the forecast period?
3. Which are the products/segments/applications/areas to invest in over the forecast period in the Global ESD Foam Packaging Market?
4. What is the competitive strategic window for opportunities in the Global ESD Foam Packaging Market?
5. What are the technology trends and regulatory frameworks in the Global ESD Foam Packaging Market?
6. What are the modes and strategic moves considered suitable for entering the Global ESD Foam Packaging Market?
Note: Product cover images may vary from those shown
2 of 3


  • Botron Company, Inc.
  • Elcom U.k. Ltd.
  • Gwp Group Limited
  • Helios Packaging
  • Nefab Ab
  • Tekins Limited
  • MORE
1. Preface
1.1. Objectives of the Study
1.2. Market Segmentation & Coverage
1.3. Years Considered for the Study
1.4. Currency & Pricing
1.5. Language
1.6. Stakeholders

2. Research Methodology
2.1. Research Process
2.1.1. Define: Research Objective
2.1.2. Determine: Research Design
2.1.3. Prepare: Research Instrument
2.1.4. Collect: Data Source
2.1.5. Analyze: Data Interpretation
2.1.6. Formulate: Data Verification
2.1.7. Publish: Research Report
2.1.8. Repeat: Report Update
2.2. Research Execution
2.2.1. Initiation: Research Process
2.2.2. Planning: Develop Research Plan
2.2.3. Execution: Conduct Research
2.2.4. Verification: Finding & Analysis
2.2.5. Publication: Research Report
2.3. Research Outcome
2.3.1. Competitive Strategic Window

3. Executive Summary
3.1. Market Outlook
3.2. Material & Additive Outlook
3.3. End-User Outlook
3.4. Geography Outlook
3.5. Competitor Outlook

4. Market Overview
4.1. Introduction
4.2. ESD Foam Packaging Market, By Geography

5. Market Dynamics
5.1. Introduction
5.1.1. Drivers
5.1.2. Restraints
5.1.3. Opportunities
5.1.4. Challenges

6. Market Insights
6.1. Porters Five Forces Analysis
6.1.1. Threat of New Entrants
6.1.2. Threat of Substitutes
6.1.3. Bargaining Power of Customers
6.1.4. Bargaining Power of Suppliers
6.1.5. Industry Rivalry
6.2. Cumulative Impact of COVID-19
6.3. Client Customizations

7. Global ESD Foam Packaging Market, By Material & Additive
7.1. Introduction
7.2. Conductive Polymer
7.3. Dissipative Polymer

8. Global ESD Foam Packaging Market, By End-User
8.1. Introduction
8.2. Aerospace
8.3. Automobile
8.4. Defense and Military
8.5. Electrical and Electronics
8.6. Manufacturing

9. Americas ESD Foam Packaging Market
9.1. Introduction
9.2. Argentina
9.3. Brazil
9.4. Canada
9.5. Mexico
9.6. United States

10. Asia-Pacific ESD Foam Packaging Market
10.1. Introduction
10.2. Australia
10.3. China
10.4. India
10.5. Indonesia
10.6. Japan
10.7. Malaysia
10.8. Philippines
10.9. South Korea
10.10. Thailand

11. Europe, Middle East & Africa ESD Foam Packaging Market
11.1. Introduction
11.2. France
11.3. Germany
11.4. Italy
11.5. Netherlands
11.6. Qatar
11.7. Russia
11.8. Saudi Arabia
11.9. South Africa
11.10. Spain
11.11. United Arab Emirates
11.12. United Kingdom

12. Competitive Landscape
12.1. FPNV Positioning Matrix
12.1.1. Quadrants
12.1.2. Business Strategy
12.1.3. Product Satisfaction
12.2. Market Ranking Analysis
12.3. Market Share Analysis
12.4. Competitive Scenario
12.4.1. Merger & Acquisition
12.4.2. Agreement, Collaboration & Partnership
12.4.3. New Product Launch & Enhancement
12.4.4. Investment & Funding

13. Company Usability Profiles
13.1. Botron Company, Inc.
13.2. Conductive Containers, Inc.
13.3. Elcom U.k. Ltd.
13.4. Electrotek Static Controls Pvt. Ltd.
13.5. Gwp Group Limited
13.6. Helios Packaging
13.7. Nefab Ab
13.8. Statclean Technology (s) Pte Ltd.
13.9. Tekins Limited

14. Appendix
14.1. Discussion Guide
14.2. Edition Details
14.3. License Details
14.4. Pricing Details
Note: Product cover images may vary from those shown
3 of 3
  • Botron Company, Inc.
  • Conductive Containers, Inc.
  • Elcom U.k. Ltd.
  • Electrotek Static Controls Pvt. Ltd.
  • Gwp Group Limited
  • Helios Packaging
  • Nefab Ab
  • Statclean Technology (s) Pte Ltd.
  • Tekins Limited
Note: Product cover images may vary from those shown