+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

Semiconductor Advanced Packaging - Global Market Trajectory & Analytics

  • PDF Icon

    Report

  • 488 Pages
  • October 2022
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 5030312

Global Semiconductor Advanced Packaging Market to Reach $53.2 Billion by 2027

Amid the COVID-19 crisis, the global market for Semiconductor Advanced Packaging estimated at US$31.8 Billion in the year 2020, is projected to reach a revised size of US$53.2 Billion by 2027, growing at a CAGR of 7.6% over the period 2020-2027. Flip Chip Packaging, one of the segments analyzed in the report, is projected to record a 7.2% CAGR and reach US$39.1 Billion by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the 2.5d/3d Packaging segment is readjusted to a revised 10.1% CAGR for the next 7-year period.

The U.S. Market is Estimated at $3 Billion, While China is Forecast to Grow at 9.3% CAGR

The Semiconductor Advanced Packaging market in the U.S. is estimated at US$3 Billion in the year 2020. China, the world's second largest economy, is forecast to reach a projected market size of US$15 Billion by the year 2027 trailing a CAGR of 9.3% over the period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 5.3% and 6.2% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.

FI WLP Segment to Record 6.8% CAGR

In the global FI WLP segment, USA, Canada, Japan, China and Europe will drive the 6.8% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.6 Billion in the year 2020 will reach a projected size of US$2.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets.

Select Competitors (Total 109 Featured)

  • Advanced Semiconductor Engineering, Inc.
  • Amkor Technology, Inc.
  • ChipMOS Technologies Inc.
  • FlipChip International LLC
  • HANA Micron Inc.
  • ISI - Interconnect Systems
  • JCET Group
  • King Yuan Electronics Co., Ltd.
  • NEPES
  • Powertech Technology Inc.
  • Samsung
  • Signetics
  • Taiwan Semiconductor Manufacturing Company Limited
  • Veeco Instruments Inc.

What's New for 2022?

  • Global competitiveness and key competitor percentage market shares
  • Market presence across multiple geographies - Strong/Active/Niche/Trivial
  • Online interactive peer-to-peer collaborative bespoke updates
  • Access to a digital archives and Research Platform
  • Complimentary updates for one year
Frequently Asked Questions about the Global Market for Semiconductor Advanced Packaging

What is the estimated value of the Global Market for Semiconductor Advanced Packaging?

The Global Market for Semiconductor Advanced Packaging was estimated to be valued at $31.8 Billion in 2020.

What is the growth rate of the Global Market for Semiconductor Advanced Packaging?

The growth rate of the Global Market for Semiconductor Advanced Packaging is 7.6%, with an estimated value of $53.2 Billion by 2027.

What is the forecasted size of the Global Market for Semiconductor Advanced Packaging?

The Global Market for Semiconductor Advanced Packaging is estimated to be worth $53.2 Billion by 2027.

Who are the key companies in the Global Market for Semiconductor Advanced Packaging?

Key companies in the Global Market for Semiconductor Advanced Packaging include Advanced Semiconductor Engineering, Inc., Amkor Technology, Inc., ChipMOS TECHNOLOGIES INC., FlipChip International LLC, HANA Micron Inc., ISI, Interconnect Systems, JCET Group and NEPES.

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed?
  • Progress on Vaccinations: Why Should Businesses Care?
  • With IMF's Upward Revision of Global GDP Forecasts, Most Companies are Bullish about an Economic Comeback Despite a Continuing Pandemic
  • Exhibit 1: A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
  • Exhibit 2: Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2019, 2020, 2021, and 2022
  • Impact of COVID-19 on the Semiconductor Industry Exposes the Risk of Value Chain Modularity
  • Among the Hammered Companies in the Supply Chain is the “Semiconductor Industry”
  • Exhibit 3: Measuring the Impact of COVID-19 on the Semiconductor Industry in Terms of Disruption & Time to Recovery (In Months) as of May 2020
  • Exhibit 4: Supply Chain Disruptions Impact a Large Number of Electronic Manufacturers: % Share of Companies Impacted by Supply Chain Delays Due to COVID-19 Worldwide as of May 2020
  • Semiconductor Trends for Specific End-Use Categories
  • COVID-19 Pandemic Storm Warrants New Strategies to Help Semiconductor Leaders Secure New Lease of Life
  • Falling Consumer Confidence Impacts Sales of Automotive and Consumer Electronics
  • Industrial Activity Remain Subdued in 2020
  • Exhibit 5: Global PMI Index Points for the Years 2018, 2019 & 2020
  • Competitive Scenario
  • Semiconductor Supply Chain Transitions at Various Levels
  • Financial Performances of Packaging Suppliers Reveals New Growth Players
  • Unconventional Players Joining Semiconductor Advanced Packaging Bandwagon
  • Exhibit 6: Semiconductor Advanced Packaging - Global Key Competitors Percentage Market Share in 2022 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for 110 Players Worldwide in 2022 (E)
  • Rising Semiconductor Demand Presents Bundle of Joy for Advanced Packaging Market
  • Prominent Factors Stirring Semiconductor Advanced Packaging Market
  • Global Market Prospects & Outlook
  • Flip-Chip: Key Contributing Segment
  • Rising Investments to Benefit Market
  • Key Trends to Drive Semiconductor Advanced Packaging Market
  • Regional Analysis
  • An Introduction to Semiconductor Advanced Packaging
  • Recent Market Activity
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
  • Semiconductor Industry Trends Indicating Brighter Days Ahead for Advanced Packaging
  • Digital Transformation Drive to Steer Future Growth of Advanced Packaging Market
  • Exhibit 7: Global Digital Transformation Spending (In US$ Trillion) for the Years 2019 through 2023
  • IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging
  • Exhibit 8: Global Number of IoT Connected Devices (In Billion Units) for the Years 2016, 2018, 2020, 2022 & 2025
  • Exhibit 9: Global Investments in Industrial IoT (IIoT) Platforms (In US$ Million) for the Years 2018, 2022 and 2025
  • Exhibit 10: Global IoT Market (In US$ Billion) by Industry for the Years 2018 and 2022
  • Exhibit 11: World IoT Semiconductors Market by Function (2018 & 2022): Percentage Breakdown of Value Sales for Communications, Processing, and Sensing
  • Increasing Functionality & Application Scope
  • New Packaging Technologies Crucial to Semiconductor Innovation
  • 3D Chip Stacking Technology to Drive Future Advanced Packaging Technology
  • 3D InCites - Advanced Packaging for 5G
  • 2.5D Packaging Emerges as Powerful Option for Next-Generation AI Products
  • Advanced Packaging Influences Design Chain
  • Led by Innovation, Semiconductor Advanced Packaging Enters into Exciting Era
  • Innovative Advanced Packaging Techniques to Flood the Market
  • Amkor Technology Leading Packaging Technology Innovation
  • Prominent Technology Trends
  • Reducing the Cost of Advanced Packaging
  • Investments in Advanced Packaging: A Critical Component for Resilient Semiconductor Supply Chain
  • Trends in Consumer Electronics Sector Influence the Semiconductor Advanced Packaging Market
  • Post Pandemic Recovery in CE Sector to Augment Prospects
  • Exhibit 12: Worldwide Shipments of Smartphones, Tablets, and Laptops (in Million Units) for the Years 2019, 2021 and 2023
  • Exhibit 13: Global Smart Homes Market by Category in US$ Billion for the Years 2020 and 2022
  • Review of Key CE Products Driving Adoption of Semiconductor Advanced Packaging Technology
  • Smartphones
  • Exhibit 14: Smartphone Penetration Rate as Share of Total Population: 2016-2021
  • Tablet PCs
  • FOWLP and Challenges to Packaging Materials Suppliers
  • Automobile Electronification Trends Widen the Addressable Market
  • Exhibit 15: Breakdown of the Total Cost of Electronics in an Automobile (in %) for the Years 1970, 1980, 2000, 2017, 2020 and 2030
  • Exhibit 16: World Automobile Production in Million Units: 2008-2022
  • Anticipated Post COVID Recovery to Revive Opportunities in Aerospace Sector
  • Exhibit 17: Commercial Airline Revenue Growth (in %) for 2010-2020
  • Exhibit 18: Global Airlines Performance by Region: 2020 Vs 2019
  • Sustained High Growth in ICT Sector Augurs Well
  • Exhibit 19: World Internet Penetration Rate (in %) by Geographic Region: June 2021
  • Exhibit 20: Breakdown of Global IP Traffic by Application Type (in %): 2019 & 2022
  • Exhibit 21: Global Wireless Communication Market (2018 & 2020): Percentage Breakdown of Traffic Volume by Mobile Device Type
  • Factors Precipitating Semiconductor Advanced Packaging Demand & Challenges
  • Factors Putting Additional Demands on Packaging
  • Fan-Out Packaging: Promises & Key Challenges
  • Implications of Chiplets & Related Designs for Advanced Packaging
  • Solving Lithography Challenges
  • Warped Wafer Processing
  • UBM/RDL and PR Strip Challenges
  • UBM/RDL Etch
  • Semiconductor Supply Chain: The Complex Nature & Vulnerabilities
  • Vulnerabilities for WBG Power Semiconductors
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Recent Past, Current & Future Analysis for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 2: World Historic Review for Semiconductor Advanced Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 3: World 15-Year Perspective for Semiconductor Advanced Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2021 & 2027
  • Table 4: World Recent Past, Current & Future Analysis for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 5: World Historic Review for Flip Chip Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 6: World 15-Year Perspective for Flip Chip Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 7: World Recent Past, Current & Future Analysis for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 8: World Historic Review for 2.5D/3D Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 9: World 15-Year Perspective for 2.5D/3D Packaging by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 10: World Recent Past, Current & Future Analysis for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 11: World Historic Review for FI WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 12: World 15-Year Perspective for FI WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 13: World Recent Past, Current & Future Analysis for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 14: World Historic Review for FO WLP by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 15: World 15-Year Perspective for FO WLP by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 16: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 17: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 18: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 19: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 20: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 21: World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 22: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 23: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 24: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 25: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 26: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 27: World 15-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
  • Table 28: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
  • Table 29: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2012 through 2019 and % CAGR
  • Table 30: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2021 & 2027
III. MARKET ANALYSIS
UNITED STATES
  • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)
  • Market Analytics
CANADA
JAPAN
  • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)
  • Market Analytics
CHINA
  • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)
  • Market Analytics
EUROPE
  • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)
  • Market Analytics
FRANCEGERMANYITALYUNITED KINGDOMREST OF EUROPE
ASIA-PACIFIC
  • Semiconductor Advanced Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)
  • Market Analytics
SOUTH KOREATAIWANREST OF ASIA-PACIFICREST OF WORLD
IV. COMPETITION
  • Total Companies Profiled: 109

Companies Mentioned

A selection of companies mentioned in this report includes:

  • Advanced Semiconductor Engineering, Inc.
  • Amkor Technology, Inc.
  • ChipMOS TECHNOLOGIES INC.
  • FlipChip International LLC
  • HANA Micron Inc.
  • ISI - Interconnect Systems
  • JCET Group
  • King Yuan ELECTRONICS CO., LTD.
  • NEPES
  • Powertech Technology Inc.
  • SAMSUNG
  • SIGNETICS
  • Taiwan Semiconductor Manufacturing Company Limited
  • Veeco Instruments Inc.