2018-2019 Recap and 2020 Forecast for the Semiconductor Industry

Amid COVID-19 outbreak, global semiconductor market growth remained robust in the first quarter of 2020. Therefore, it is anticipated global semiconductor market value will reach USD 417.2 billion in 2020, up 1.2% year-on-year. In the same year, the shipment value of the Taiwanese semiconductor industry is forecast to grow 1.7% year-on-year and arrive at NTD2.45 trillion (USD 83.1 billion), higher than the global average. This is attributed mainly to Taiwan's advancements in advanced semiconductor manufacturing processes and the benefits of acquisitions and mergers. This report provides an overview of the development of the global semiconductor market and Taiwanese semiconductor industry - comprising of fabless IC, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test) - between 2018 and April 2020; examines the development of major players and explores key trends and opportunities.

List of Topics:

Recap the development of both global and Taiwanese semiconductor industry in 2018-2019, touching on shipment value and key development trends of three semiconductor sectors: fabless IC design, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test).
Development of major players in the fabless IC design such as MediaTek, Novatek, Realtek, etc; in the semiconductor manufacturing such as TSMC, Samsung, GlobalFoundries, UMC, and SMIC; in the OSAT such as Amkor, JECT, Tianshui Huatian, Tongfu Microelectronics, etc.
Outlook for the global and Taiwanese semiconductor industry in 2020 and includes their shipment value forecasts until 2021

1. Overview

1.1 Global Semiconductor Development
1.2 Taiwanese Semiconductor Development

2. Global IC Design Industry Development

2.1 Global Industry Value Witness Growth in 2018
2.2. The Fabless IC Design Industry by Region
2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly
2.3 Development of Major IC Design Companies
2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow

3. Taiwanese IC Design Industry Development

3.1 Shipment Value of the Taiwanese Fabless IC Design Industry
3.2 Product Mix Analysis
3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications
3.2.2 Communication ICs Remain Mainstream
3.3 Major Taiwan IC Design Companies
3.4 Industry Development Trends
3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones
3.4.2 New Products and Applications to Drive Future Opportunity

4. Opportunities and Challenges

4.1 Impact of the US-China Trade Fight
4.1.1 Fabless IC Design is China’s Key Investment Focus
4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China
4.1.3 Uncertainties Lead to New Industry Reorganization
4.2 AI Edge Computing Changing the IC Design Industry’s Business Model
4.3 Outlook for the Taiwanese IC Design Industry
4.3.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020

5. Author's Perspective

5.1 Seeking New Export Opportunities from Trade Fight
5.2 Emerging Technologies Make More Applications Possible

6. Development of the Global Semiconductor Manufacturing Industry

6.1 Global Foundry Growth Stays Stable
6.2 TSMC Continues to be The World’s Largest Foundry

7. Industry Development Trends

7.1 EUV Lithography Ready to Extend the Life of Moore’s Law
7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications

8. Development of Major Players

8.1 TSMC
8.2 Samsung
8.3 GlobalFoundries
8.4 UMC
8.5 SMIC

9. Outlook for the Taiwanese Semiconductor Manufacturing Industry

9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply
9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020
9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling

10. Author's Perspective

10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance
10.2 Influence of US-China Trade War on Global Economy Continues

11. Development of the Worldwide OSAT Industry

11.1 Steady Growth in 2018
11.1.1 OSAT Companies’ Market Share Struck by Trade War
11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing
11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018

12. Development of Leading International OSAT Companies

12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
12.2 JECT's M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018
12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers

13. Development of Leading Taiwanese OSAT Companies

13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology
13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs
13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business
13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues

14. Outlook for the Taiwanese OSAT industry

14.1 Ongoing COVID-19 Affect OSAT Industry
14.2 Demand for True Wireless Stereo as Key Growth Factor

15. Author's Perspective

15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019
15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth
15.3 Trade Restrictions Put Stability of Supply Chain to Test

AppendixList of Companies

List of Tables

Table 1 Global Top 10 IC Design Companies in 2018
Table 2 China’s Top 10 Fabless IC Design Companies in 2018
Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019
Table 4 Global Semiconductor Manufacturer Production Value Rankings
Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019
Table 6 M&A of Leading OSAT Companies, 2014-2019
Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019
Table 8 Milestones of ASE-SPIL Merger

List of Figures

Figure 1 Global Semiconductor Market Value, 2011-2021
Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020
Figure 3 Global IC Design Industry Shipment Value, 2013-2019
Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018
Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019
Figure 6 Taiwan IC Design Industry Shipment Share by Application
Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix
Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019
Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019
Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19
Figure 11 Global Major IC Manufacturers’ Development Roadmap
Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology
Figure 13 GlobalFoundries Process Development Roadmap
Figure 14 SMIC Revenue and Net Profit, 2015-2018
Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019
Figure 16 World's Top Ten OSAT Companies by Revenue in 2019
Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019

Samples

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Companies Mentioned

A selection of companies mentioned in this report includes:

AMD
Amkor
Apple
ASE
ASML
Asus
Beijing Horizon Robotics Technology
Beijing International Space Science Institute
Beijing Smartchip Microelectronics
Bitfily
Bitmain
Broadcom
Cambrian
Canaan Creative
China Electronics Corporation
Chipbond
ChipMOS
DeePhi Technology
Elite
FCI
Fujitsu Semiconductor
GalaxyCore
Giga Solution
Global Unichip
GlobalFoundries
Huahong Semiconductor
Hijian Technology Corporation
Hikvision
Himax
HiSilicon
Huahong Semiconductor
Huawei
Huiding Technology
Hynix
Intel
J-Device
JECT
JHICC
JSCK
KYEC
Marvell
MediaTek
Mie Fujitsu Semiconductor
Nanium
Nokia
Novatek
Microelectronics
NVidia
OmniVision
On Semiconductor
OnePlus
Oppo
Panasonic
Panasonic Semiconductor
Phison
Powerchip
PTI
Qorvo
Qualcomm
Raydium
Realtek
Rockchip
Samsung
Sigurd
Silicon Motion
Sitronix
SJSemi
Skyworks
SMIC
SPIL
STATS ChipPAC
Tainshui Huatian Technology
Tera Probe
Tongu Microelectronics
TowerJazz
TSI
Tsinghua Unigroup
TSMC
UMC
Unisem
Unisoc
UTAC
VIS
Vivo
Winstek
Xiaomi
Xilinx
Zhejiang Dahua
ZTE Microelectronics

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method