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2018-2019 Recap and 2020 Forecast for the Semiconductor Industry

  • Report

  • 74 Pages
  • May 2020
  • Region: Global
  • Market Intelligence & Consulting Institute (MIC)
  • ID: 5117015
Description Jump to:

Amid COVID-19 outbreak, global semiconductor market growth remained robust in the first quarter of 2020. Therefore, it is anticipated global semiconductor market value will reach USD 417.2 billion in 2020, up 1.2% year-on-year. In the same year, the shipment value of the Taiwanese semiconductor industry is forecast to grow 1.7% year-on-year and arrive at NTD2.45 trillion (USD 83.1 billion), higher than the global average. This is attributed mainly to Taiwan's advancements in advanced semiconductor manufacturing processes and the benefits of acquisitions and mergers. This report provides an overview of the development of the global semiconductor market and Taiwanese semiconductor industry - comprising of fabless IC, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test) - between 2018 and April 2020; examines the development of major players and explores key trends and opportunities.

List of Topics:


  • Recap the development of both global and Taiwanese semiconductor industry in 2018-2019, touching on shipment value and key development trends of three semiconductor sectors: fabless IC design, semiconductor manufacturing, and OSAT (Outsourced Semiconductor Assembly and Test).
  • Development of major players in the fabless IC design such as MediaTek, Novatek, Realtek, etc; in the semiconductor manufacturing such as TSMC, Samsung, GlobalFoundries, UMC, and SMIC; in the OSAT such as Amkor, JECT, Tianshui Huatian, Tongfu Microelectronics, etc.
  • Outlook for the global and Taiwanese semiconductor industry in 2020 and includes their shipment value forecasts until 2021

Table of Contents

1. Overview
1.1 Global Semiconductor Development
1.2 Taiwanese Semiconductor Development
2. Global IC Design Industry Development
2.1 Global Industry Value Witness Growth in 2018
2.2. The Fabless IC Design Industry by Region
2.2.1 Chinese IC Design Industry’s Global Share is Increasing Constantly
2.3 Development of Major IC Design Companies
2.3.1 Shipment Value of the Chinese Fabless IC Design Industry Continues to Grow
3. Taiwanese IC Design Industry Development
3.1 Shipment Value of the Taiwanese Fabless IC Design Industry
3.2 Product Mix Analysis
3.2.1 Fabless ICs for Computing, Communication, and Consumer Applications
3.2.2 Communication ICs Remain Mainstream
3.3 Major Taiwan IC Design Companies
3.4 Industry Development Trends
3.4.1 Panel Driver and TDDI ICs to Lead the Evolution on Smartphones
3.4.2 New Products and Applications to Drive Future Opportunity
4. Opportunities and Challenges
4.1 Impact of the US-China Trade Fight
4.1.1 Fabless IC Design is China’s Key Investment Focus
4.1.2 US-China Trade War Speeding Up Localization of the Semiconductor Industry in China
4.1.3 Uncertainties Lead to New Industry Reorganization
4.2 AI Edge Computing Changing the IC Design Industry’s Business Model
4.3 Outlook for the Taiwanese IC Design Industry
4.3.1 Taiwan's IC Design Industry Will Slow Down Significantly in 2020
5. Author's Perspective
5.1 Seeking New Export Opportunities from Trade Fight
5.2 Emerging Technologies Make More Applications Possible
6. Development of the Global Semiconductor Manufacturing Industry
6.1 Global Foundry Growth Stays Stable
6.2 TSMC Continues to be The World’s Largest Foundry
7. Industry Development Trends
7.1 EUV Lithography Ready to Extend the Life of Moore’s Law
7.2 Strategies Focus on Advanced Nanotechnology Processes and Mature Process Applications
8. Development of Major Players
8.1 TSMC
8.2 Samsung
8.3 GlobalFoundries
8.4 UMC
8.5 SMIC
9. Outlook for the Taiwanese Semiconductor Manufacturing Industry
9.1 Momentum from High-speed Computing Applications Continues but from Communications Applications Fall Sharply
9.2 COVID Has Short-term Impact While Excessive Inventory to Affect Shipments in 2H 2020
9.3 COVID-19 Affects End-consumer Market Demand and Memory Prices are Falling
10. Author's Perspective
10.1 Inventory Clearance and Economic Uncertainty Affect 2019 Performance
10.2 Influence of US-China Trade War on Global Economy Continues
11. Development of the Worldwide OSAT Industry
11.1 Steady Growth in 2018
11.1.1 OSAT Companies’ Market Share Struck by Trade War
11.1.2 Worldwide OSAT Market Slows Down in 2019 with Shipment Value Similar to 2018
11.2 Taiwan Ranked No.1 in 2018 IC Packaging and Testing Shipment Value, Followed by China
11.2.1 Top Six OSAT Companies’ Spots Remain Unchanged While Gap between Top Three Narrowing
11.2.2 Taiwanese IC Packaging and Testing Industry Posts Higher-than-Global-Average Growth at 8.4% in 2018
12. Development of Leading International OSAT Companies
12.1 Amkor Remain Steady Growth with Continued Focus on Automotive Electronics
12.2 JECT's M&A Continues to Deliver Synergy, Boosting High-end Packaging Share
12.3 Tianshui Huatian Technology Did Not Live Up to Expectations in 2018
12.4 Tongfu Microelectronics Maintains High Growth Fueled by International Customers
13. Development of Leading Taiwanese OSAT Companies
13.1 ASE Benefits from M&A Synergy with Focus on SiP Technology
13.1.1 ASE Aggressively Develops SiP to Help Customers Reduce Costs
13.2 PTI Strives for Product Diversification by Expanding Non-Memory Business
13.3 CoF Packaging Becomes Mainstream, Driving up Chipbond and ChipMOS Revenues
14. Outlook for the Taiwanese OSAT industry
14.1 Ongoing COVID-19 Affect OSAT Industry
14.2 Demand for True Wireless Stereo as Key Growth Factor
15. Author's Perspective
15.1 A Significant Slowdown in Worldwide IC Packaging and Testing Industry Growth in 2019
15.2 SiP and Heterogeneous Integration as Key Driving Force for Growth
15.3 Trade Restrictions Put Stability of Supply Chain to Test
AppendixList of Companies
List of Tables
Table 1 Global Top 10 IC Design Companies in 2018
Table 2 China’s Top 10 Fabless IC Design Companies in 2018
Table 3 Taiwan’s Top 10 IC Design Companies by Revenue in 2019
Table 4 Global Semiconductor Manufacturer Production Value Rankings
Table 5 Taiwan’s Top 10 Foundries by Revenue in 2019
Table 6 M&A of Leading OSAT Companies, 2014-2019
Table 7 Taiwan’s Top 10 OSAT Companies by Revenue in 2019
Table 8 Milestones of ASE-SPIL Merger
List of Figures
Figure 1 Global Semiconductor Market Value, 2011-2021
Figure 2 Taiwanese Semiconductor Industry Shipment Value, 2011-2020
Figure 3 Global IC Design Industry Shipment Value, 2013-2019
Figure 4 Global IC Design Industry Market Share by Production Base, 2015 - 2018
Figure 5 Shipment Value of the Taiwan Fabless IC Design Industry, 2013-2019
Figure 6 Taiwan IC Design Industry Shipment Share by Application
Figure 7 Taiwan IC Design Industry Shipment Share by Product Mix
Figure 8 Global Semiconductor Manufacturing Industry Shipment Value, 2015-2019
Figure 9 Shipment Value of the Taiwanese Semiconductor Manufacturing Industry, 2016-2019
Figure 10 Taiwanese Semiconductor Manufacturing Shipment Value Share by Process Technology, 3Q17 - 4Q19
Figure 11 Global Major IC Manufacturers’ Development Roadmap
Figure 12 Benchmarking of TSMC, UMC, and SMIC Production Value Share by Process Technology
Figure 13 GlobalFoundries Process Development Roadmap
Figure 14 SMIC Revenue and Net Profit, 2015-2018
Figure 15 Worldwide OSAT Industry Shipment Value and Growth Rates, 2016-2019
Figure 16 World's Top Ten OSAT Companies by Revenue in 2019
Figure 17 Taiwanese OSAT Industry Shipment Value and Growth Rates, 2016-2019

Samples

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Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • AMD
  • Amkor
  • Apple
  • ASE
  • ASML
  • Asus
  • Beijing Horizon Robotics Technology
  • Beijing International Space Science Institute
  • Beijing Smartchip Microelectronics
  • Bitfily
  • Bitmain
  • Broadcom
  • Cambrian
  • Canaan Creative
  • China Electronics Corporation
  • Chipbond
  • ChipMOS
  • DeePhi Technology
  • Elite
  • FCI
  • Fujitsu Semiconductor
  • GalaxyCore
  • Giga Solution
  • Global Unichip
  • GlobalFoundries
  • Huahong Semiconductor
  • Hijian Technology Corporation
  • Hikvision
  • Himax
  • HiSilicon
  • Huahong Semiconductor
  • Huawei
  • Huiding Technology
  • Hynix
  • Intel
  • J-Device
  • JECT
  • JHICC
  • JSCK
  • KYEC
  • Marvell
  • MediaTek
  • Mie Fujitsu Semiconductor
  • Nanium
  • Nokia
  • Novatek
  • Microelectronics
  • NVidia
  • OmniVision
  • On Semiconductor
  • OnePlus
  • Oppo
  • Panasonic
  • Panasonic Semiconductor
  • Phison
  • Powerchip
  • PTI
  • Qorvo
  • Qualcomm
  • Raydium
  • Realtek
  • Rockchip
  • Samsung
  • Sigurd
  • Silicon Motion
  • Sitronix
  • SJSemi
  • Skyworks
  • SMIC
  • SPIL
  • STATS ChipPAC
  • Tainshui Huatian Technology
  • Tera Probe
  • Tongu Microelectronics
  • TowerJazz
  • TSI
  • Tsinghua Unigroup
  • TSMC
  • UMC
  • Unisem
  • Unisoc
  • UTAC
  • VIS
  • Vivo
  • Winstek
  • Xiaomi
  • Xilinx
  • Zhejiang Dahua
  • ZTE Microelectronics

Methodology

Primary research with a holistic, cross-domain approach

The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.

Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:

Method

  • Component supplier interviews
  • System supplier interviews
  • User interviews
  • Channel interviews
  • IPO interviews
  • Focus groups
  • Consumer surveys
  • Production databases
  • Financial data
  • Custom databases

Methodology

  • Technology forecasting and assessment
  • Product assessment and selection
  • Product life cycles
  • Added value analysis
  • Market trends
  • Scenario analysis
  • Competitor analysis

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