Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units and memory, during the final stage of semiconductor manufacturing process. Advanced packaging allows the chip to be connected to a circuit board. In addition, advanced packaging involves grouping of a variety of distinct techniques which includes 2.5D, 3D-IC, fan-out-wafer-level packaging and system-in-package.
Different integrated circuits (ICs) have different packaging requirements, which provides growth opportunities for advanced packaging over traditional packaging process. In addition, advanced packaging is expected to offer higher abilities than conventional packaging solutions, which is expected to offer lucrative opportunities for advanced packaging market trends in the coming years.
With rapid growth in advanced packaging market, specifically fan out wafer level packaging, along with increase in demand for smartphone and devices and Internet of Things (IoT), advanced packaging suppliers are developing process and ways to reduce the overall cost of advanced packaging and provide maximum operational efficiency. During the recent times, advanced packaging is mainly used for high-end products and for applications related to niche-market such as wafer and die production due to its high cost in its operation.
Advanced packaging technology is expected to increase the value of a semiconductor product by adding functionality in its operation, increasing and maintaining the performance, while lowering the overall cost of packaging. The adoption of advanced packaging is also creating demand for high performance chips for various consumer electronic products. This augments the demand for 3D and 2.5D packaging chips, used in smartphones and other mobile devices.
Increase in demand for miniaturization of devices among various industry verticals and to improved system performances and optimization of advanced packaging are significant factors that assist in the market growth globally. However, high cost associated with advanced packaging hampers its adoption to a certain level and majorly restrains the market growth. Furthermore, emerging trends toward fan-out wafer level packaging is expected to offer lucrative opportunities for the growth of the advanced packaging market globally.
The global advanced packaging market is analyzed by type, end use, and region. By type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. On the basis of end use, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. By Region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key players profiled in the report include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration.
ADVANCED PACKAGING MARKET SEGMENTATION
BY Type
BY End Use
By Region
Key Companies
Different integrated circuits (ICs) have different packaging requirements, which provides growth opportunities for advanced packaging over traditional packaging process. In addition, advanced packaging is expected to offer higher abilities than conventional packaging solutions, which is expected to offer lucrative opportunities for advanced packaging market trends in the coming years.
With rapid growth in advanced packaging market, specifically fan out wafer level packaging, along with increase in demand for smartphone and devices and Internet of Things (IoT), advanced packaging suppliers are developing process and ways to reduce the overall cost of advanced packaging and provide maximum operational efficiency. During the recent times, advanced packaging is mainly used for high-end products and for applications related to niche-market such as wafer and die production due to its high cost in its operation.
Advanced packaging technology is expected to increase the value of a semiconductor product by adding functionality in its operation, increasing and maintaining the performance, while lowering the overall cost of packaging. The adoption of advanced packaging is also creating demand for high performance chips for various consumer electronic products. This augments the demand for 3D and 2.5D packaging chips, used in smartphones and other mobile devices.
Increase in demand for miniaturization of devices among various industry verticals and to improved system performances and optimization of advanced packaging are significant factors that assist in the market growth globally. However, high cost associated with advanced packaging hampers its adoption to a certain level and majorly restrains the market growth. Furthermore, emerging trends toward fan-out wafer level packaging is expected to offer lucrative opportunities for the growth of the advanced packaging market globally.
The global advanced packaging market is analyzed by type, end use, and region. By type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. On the basis of end use, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. By Region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key players profiled in the report include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration.
ADVANCED PACKAGING MARKET SEGMENTATION
BY Type
- Flip Chip CSP
- Flip-Chip Ball Grid Array
- Wafer Level CSP
- 2.5D/3D
- Fan Out WLP
- Others
- Thin Quad Flat Packages
- Flip-Chip Package-in-Package
- Embedded Die
- Others
BY End Use
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
- Oil & Gas
- Paper & Pulp
- Others
By Region
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Key Companies
- Amkor Technology
- Intel Corporation
- Qualcomm Technologies Inc.
- Taiwan Semiconductor Manufacturing Company
- IBM
- Microchip Technology
- Renesas Electronics Corporation
- Texas Instruments
- Analog Devices
Table of Contents
Chapter 1: Introduction
Chapter 2: Executive Summary
Chapter 3: Market Overview
Chapter 4: Advanced Packaging Market, by Type
Chapter 5: Advanced Packaging Market, by End Use
Chapter 6: Advanced Packaging Market, by Region
Chapter 7: Company Profiles
Executive Summary
According to the report titled, 'Advanced Packaging by Type and End Use: Opportunity Analysis and Industry Forecast, 2020-2027' the global advanced packaging market size was valued at $29.42 billion in 2019 and is projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027.In 2019, Asia-Pacific dominated the advanced packaging market share among all countries analyzed, contributing more than 75% share of the overall revenue, followed by North America. Growth in number of digital electronic devices, adoption of advanced electronic vehicles, and advanced virtual systems foster several growth opportunities for advanced packaging vendors in Europe. The region is anticipated to witness a high growth rate for the advanced packaging market during the forecast period due to the development in the consumer electronics industry, adoption of advanced technologies such as advanced driver assistance in automotive, and the need for low power consumption devices in the region, which in turn propels market growth.
Consumer electronics include smart phones, television, DVD players, and other equipment, which are used by end users on daily basis for commercial and personal purposes. The consumer electronic industry is growing at very fast pace owing to high adoption of smart devices across various industry verticals and rise in emergence of IoT. As embedded processor is a microchip used in many electronic devices such as digital watches, digital cameras, MP3 players, and other home appliances for processing the data at high speed, it helps in performing the system operations efficiently for continuous and repetitive operations.
Increase in demand for miniaturization of devices among various industry verticals and improved system performances and optimization of advanced packaging are significant factors that assist in market growth globally. However, high cost associated with advanced packaging hampers its adoption to a certain level and majorly restrains the advanced packaging market growth. Furthermore, emerging market trends toward fan-out wafer level packaging is expected to offer lucrative opportunities for the growth of the market globally.
Region wise, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA. Asia-Pacific was the highest revenue generator in 2019, accounting for $23.12 Billion, and is estimated to garner $64.19 Billion by 2027, growing at a CAGR of 10.2%. This is attributed to the fact that the segment is inclusive of all the regions other than the U.S.
The advanced packaging market is analyzed by type, end use, and region. By type, the market is classified into flip chip CSP, flip-chip ball grid array, wafer level CSP, 2.5D/3D, fan-out WLP, and others. On the basis of end use, the market is divided into consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
Key Findings of the Study:
By type, the flip-chip ball grid array segment held the highest revenue of $9.63 billion in 2019 and contributed a major part in advanced packaging market share.
By end use, the consumer electronics segment held the highest revenue share of the market in 2019, generating $18.51 billion as per the advanced packaging market analysis.
By region, Asia-Pacific is expected to dominate the market, garnering a major market share during the forecast period.
Key players operating in the advanced packaging market trends include Amkor Technology, Intel Corporation, Qualcomm Technologies Inc., Taiwan Semiconductor Manufacturing Company, IBM, Microchip Technology, Renesas Electronics Corporation, Texas Instruments, and Analog Devices, which are profiled in this report. The Advanced packaging industry key market players adopt various strategies such as product launch, product development, collaboration, partnership, agreements, among others to influence market growth.
Companies Mentioned
- Intel Corporation
- Qualcomm Technologies Inc.
- Taiwan Semiconductor Manufacturing Company
- IBM
- Microchip Technology
- Renesas Electronics Corporation
- Texas Instrument
Methodology
The analyst offers exhaustive research and analysis based on a wide variety of factual inputs, which largely include interviews with industry participants, reliable statistics, and regional intelligence. The in-house industry experts play an instrumental role in designing analytic tools and models, tailored to the requirements of a particular industry segment. The primary research efforts include reaching out participants through mail, tele-conversations, referrals, professional networks, and face-to-face interactions.
They are also in professional corporate relations with various companies that allow them greater flexibility for reaching out to industry participants and commentators for interviews and discussions.
They also refer to a broad array of industry sources for their secondary research, which typically include; however, not limited to:
- Company SEC filings, annual reports, company websites, broker & financial reports, and investor presentations for competitive scenario and shape of the industry
- Scientific and technical writings for product information and related preemptions
- Regional government and statistical databases for macro analysis
- Authentic news articles and other related releases for market evaluation
- Internal and external proprietary databases, key market indicators, and relevant press releases for market estimates and forecast
Furthermore, the accuracy of the data will be analyzed and validated by conducting additional primaries with various industry experts and KOLs. They also provide robust post-sales support to clients.
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