The Europe Advanced Packaging Market is expected to witness market growth of 12.3% CAGR during the forecast period (2020-2026).
With rapid growth in the advanced packaging market, particularly in wafer level packaging, together with increased demand for smartphones and devices and the Internet of Things (IoT), advanced packaging suppliers are developing processes and ways to reduce the overall cost of advanced packaging and ensure maximum operational efficiency.
In recent times, innovative packaging is primarily used for high-end products and for niche-related applications such as wafer and die processing due to high operating costs. Different integrated circuits (ICs) have various packaging requirements that provide growth opportunities for advanced packaging over traditional packaging processes. Furthermore, advanced packaging is expected to offer higher capabilities than conventional packaging solutions, which are expected to provide lucrative opportunities for advanced packaging market trends in the coming years.
The demand for compact electronic devices has increased in almost every sector, be it communication equipment, automotive, industrial or healthcare equipment. This trend has prompted semiconductor IC manufacturers to increase R&D investment in order to reduce the size and improve the output of ICs. This led to the advent of MEMS and 3D IC chips. In addition, over the decades, ICs have often been more dense due to the growing number of interconnects and transistors requiring better deposition and patterning.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D and Others. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.
Scope of the Study
Market Segmentation:
By Type
By End User
By Country
Companies Profiled
Unique Offerings from the Publisher
With rapid growth in the advanced packaging market, particularly in wafer level packaging, together with increased demand for smartphones and devices and the Internet of Things (IoT), advanced packaging suppliers are developing processes and ways to reduce the overall cost of advanced packaging and ensure maximum operational efficiency.
In recent times, innovative packaging is primarily used for high-end products and for niche-related applications such as wafer and die processing due to high operating costs. Different integrated circuits (ICs) have various packaging requirements that provide growth opportunities for advanced packaging over traditional packaging processes. Furthermore, advanced packaging is expected to offer higher capabilities than conventional packaging solutions, which are expected to provide lucrative opportunities for advanced packaging market trends in the coming years.
The demand for compact electronic devices has increased in almost every sector, be it communication equipment, automotive, industrial or healthcare equipment. This trend has prompted semiconductor IC manufacturers to increase R&D investment in order to reduce the size and improve the output of ICs. This led to the advent of MEMS and 3D IC chips. In addition, over the decades, ICs have often been more dense due to the growing number of interconnects and transistors requiring better deposition and patterning.
Based on Type, the market is segmented into Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D and Others. Based on End User, the market is segmented into Consumer Electronics, Automotive, Industrial, Aerospace & Defense, Healthcare & Life Sciences and Others. Based on countries, the market is segmented into Germany, UK, France, Russia, Spain, Italy, and Rest of Europe.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Qualcomm, Inc., Intel Corporation, IBM Corporation, Texas Instruments, Inc., Analog Devices, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd. (Samsung Group), Amkor Technology, Inc., Brewer Science, Inc., and MICROCHIP Technology, Inc.
Scope of the Study
Market Segmentation:
By Type
- Flip-Chip Ball Grid Array
- Flip Chip CSP
- Wafer Level CSP
- 2.5D/3D
- Others
By End User
- Consumer Electronics
- Automotive
- Industrial
- Aerospace & Defense
- Healthcare & Life Sciences
- Others
By Country
- Germany
- UK
- France
- Russia
- Spain
- Italy
- Rest of Europe
Companies Profiled
- Qualcomm, Inc.
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd. (Samsung Group)
- Amkor Technology, Inc.
- Brewer Science, Inc.
- Microchip Technology, Inc.
Unique Offerings from the Publisher
- Exhaustive coverage
- Highest number of market tables and figures
- Subscription based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. Competition Analysis - Global
Chapter 4. Europe Advanced Packaging Market by Type
Chapter 5. Europe Advanced Packaging Market by End User
Chapter 6. Europe Advanced Packaging Market by Country
Chapter 7. Company Profiles
Companies Mentioned
- Qualcomm, Inc.
- Intel Corporation
- IBM Corporation
- Texas Instruments, Inc.
- Analog Devices, Inc.
- Renesas Electronics Corporation
- Samsung Electronics Co., Ltd. (Samsung Group)
- Amkor Technology, Inc.
- Brewer Science, Inc.
- Microchip Technology, Inc.
Methodology
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