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Global eSIM Market By Application, By Solution, By Region, Industry Analysis and Forecast, 2020 - 2026

  • ID: 5129324
  • Report
  • June 2020
  • Region: Global
  • 206 pages
  • Marqual IT Solutions Pvt. Ltd (KBV Research)

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FEATURED COMPANIES

  • Deutsche Telekom AG
  • Giesecke & Devrient GmbH
  • Infineon Technologies AG
  • NTT Data Corporation
  • NXP Semiconductors N.V.
  • Sierra Wireless, Inc.
  • MORE
The Global eSIM Market size is expected to reach $19.2 billion by 2026, rising at a market growth of 17% CAGR during the forecast period. Embedded Subscriber Identity Module (eSIM), also known as the Embedded Universal Integrated Circuit Card (eUICC), is a reprogrammable chip that is made available across the market either in soldered or in a removable form. It is a small chip which is used to authenticate the identity of the user with his carrier. ESIM is smart in terms of functions as it supports multiple accounts, enables switching to different mobile network operators (MNOs), and manages accounts simply by updating the user's mobile phone software settings.

With the gradual growth of smart connected devices in every vertical market, the need for unified, scalable network-based devices is increasingly growing. The need for remote connectivity to manage devices is increasing. The number of smart system vendors is growing increasingly to support this need. ESIMs are becoming increasingly popular, as they enable users to manage all connected devices from remote locations, including cars, mobile phones, wearables, medical devices and others. ESIMs are becoming increasingly common with manufacturers of smart devices, as these SIMs have both 'Machine to Machine' capabilities and remote provisioning.

It is also expected that the global eSIM market will be fueled by the growing adoption of these SIMs by leading mobile manufacturers including Google and Apple. Manufacturers of smartphones are likely to allow eSIMs to boost their product offerings. On the other hand, users can only pick one profile from every profile at a time. This is a major disadvantage for eSIMs, which restrains market growth. Also, being a sophisticated technological evolution, the compatibility, connectivity and other issues with different manufacturers' smart devices is also one of the major challenges for eSIM market growth.

Based on Application, the market is segmented into M2M and Consumer Electronics. M2M type is further classified into Automotive, Energy & Utilities and Others. Based on Solution, the market is segmented into Connectivity Services and Hardware. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa.

The major strategies followed by the market participants are Partnerships and Product Launches. Based on the Analysis presented in the Cardinal matrix, Deutsche Telekom AG, Telefonica S.A., and Singapore Telecommunications Limited are the forerunners in the eSIM Market. Companies such as STMicroelectronics N.V., Thales Group S.A., Infineon Technologies AG, Giesecke & Devrient GmbH, Sierra Wireless, Inc., NXP Semiconductors N.V., and NTT Data Corporation are some of the key innovators in the market.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Thales Group S.A. (Gemalto NV), Infineon Technologies AG, NXP Semiconductors N.V., STMicroelectronics N.V., Telefonica S.A., NTT Data Corporation, Giesecke & Devrient GmbH, Deutsche Telekom AG, Singapore Telecommunications Limited, Sierra Wireless, Inc.

Recent strategies deployed in eSIM Market

Partnerships, Collaborations, and Agreements:

May-2020: Thales announced its collaboration with Google Cloud for expanding its eSIM Management Solution. Under this collaboration, Thales is expected to use Google Cloud technology for providing highly secure and scalable activation of eSIM (embedded SIM) capable devices. Thales deployed the world’s first GSMA-certified eSIM activation solution on Google Cloud. This solution offers telecom operators secure and highly scalable support to manage increases in mobile subscriptions for eSIM-capable devices.

Mar-2020: STMicroelectronics collaborated with Truphone, a GSMA accredited global mobile network that operates its service internationally. The collaboration was aimed to launch a full-stack embedded SIM (eSIM) infrastructure solution. This solution was compliant with GSMA Machine-to-Machine (M2M) standards for Industrial IoT and automotive customers.

Oct-2019: Deutsche Telekom came into partnership with COMPRION, a leader in smart card compliance. The partnership was focused on developing a test system for the nuSIM initiative. COMPRION was aimed to provide test system expertise for developing qualification and functional certification program for single entities in the nuSIM ecosystem. nuSIM is a strictly optimized integrated SIM solution that is expected to bring several new attributes to the IoT value chain, e.g. significant cost reduction, space savings, and increased overall simplicity.

Jul-2019: Deutsche Telekom collaborated with IDEMIA, a provider of security and identity solutions. Deutsche Telekom selected IDEMIA’s solution to ramp up its efforts to accelerate the launch of eSIM-enabled devices in its European affiliates. IDEMIA’s Smart Connect Entitlement ensured Deutsche Telekom will always have the very latest OEM specifications to support smartphones, wearables, and tablets on a cost-effective and easy to deploy platform.

May-2019: Infineon signed an agreement with Arrow Electronics and Arkessa. This agreement extended Arrow’s ability for supporting customers with cellular communications for the Internet of Things (IoT). In this agreement, Infineon aimed to provide the secured hardware controllers based on GSMA’s Embedded Subscriber Identity Module (eSIM) specification that underpin the new service whereas Arkessa was focused on providing secured mobile data services with the ability to provide and manage IoT devices from the factory into the field easily and effectively.

Feb-2019: STMicroelectronics teamed up with Sequans Communications, a company that markets integrated circuits for 4G mobile phone technology. The collaboration was aimed to bring LTE for IoT connectivity to the MCU ecosystem and accelerate its adoption. Following this collaboration, the companies have developed a dedicated cellular extension board for STM32 Discovery kits based on Sequans’ Monarch LTE-M/NB-IoT technology. ST also enlarged its STM32CUBE cellular software library to support Sequans’ existing Monarch-based module, GM01Q. The kit includes a switchable SIM interface, eSIM, and MicroSIM, a high-performance antenna for frequencies between 700 MHz – 2100 MHz, and free drivers and code examples.

Acquisition and Mergers:

Apr-2020: Infineon Technologies acquired Cypress Semiconductor Corporation. The acquisition strengthened Infineon's broader range of applications. Cypress added a differentiated portfolio of microcontrollers, connectivity components, software ecosystems, and high-performance memories.

Jan-2020: Sierra Wireless took over the M2M group of companies, a company focused on IoT connectivity services and cellular devices in Australia. The acquisition broadened Sierra Wireless’ IoT solutions business in the Asia-Pacific region.

Dec-2019: NXP Semiconductors completed the acquisition of Marvell's Wireless Connectivity portfolio. The acquisition enabled NXP to provide complete, scalable processing, and connectivity solutions to the customers across the end markets.

Mar-2019: NTT Communications took over Transatel, a global Internet of Things (IoT) cellular connectivity management provider and Mobile Virtual Network Enabler (MVNE). The acquisition enabled NTT to drastically extend its Global IoT solution offering.

Sep-2018: NXP took over OmniPHY, a provider of automotive Ethernet subsystem technology. Following the acquisition, the latter company’s interface IP and communication technology have been combined with NXP’s automotive portfolio. The acquisition enabled NXP to provide secure connections and infrastructure for embedded applications.

Product Launches and Product Expansions:

Mar-2020: Infineon Technologies extended its embedded SIM (eSIM) portfolio with the launch of OPTIGA Connect eSIM solution for mobile consumer devices. This solution supports all GSMA standards from 3G to 5G and securely authenticates the device to the subscribed carrier network of choice. It is the perfect match for smartphones, tablets, and wearables like smartwatches or fitness trackers.

Feb-2020: STMicroelectronics unveiled ST4SIM, a complete ecosystem for securely connecting Industrial IoT (IIoT) and automotive systems to cellular networks. ST4SIM offering includes automotive and industrial-grade embedded SIM (eSIM) SoCs in addition to standard machine-to-machine SIM.

Feb-2019: Deutsche Telekom launched nuSIM, a new system. This system provides embedded SIM (eSIM) functions at a price-point suited for low-cost IoT devices.

Scope of the Study

Market Segmentation:

By Application
  • M2M
  • Automotive
  • Energy & Utilities
  • Others
  • Consumer Electronics
By Solution
  • Connectivity Services
  • Hardware
By Geography

North America
  • US
  • Canada
  • Mexico
  • Rest of North America
Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA
Companies Profiled
  • Thales Group S.A. (Gemalto NV)
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • Telefonica S.A.
  • NTT Data Corporation
  • Giesecke & Devrient GmbH
  • Deutsche Telekom AG
  • Singapore Telecommunications Limited
  • Sierra Wireless, Inc.
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Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Deutsche Telekom AG
  • Giesecke & Devrient GmbH
  • Infineon Technologies AG
  • NTT Data Corporation
  • NXP Semiconductors N.V.
  • Sierra Wireless, Inc.
  • MORE
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global eSIM Market, by Application
1.4.2 Global eSIM Market, by Solution
1.4.3 Global eSIM Market, by Geography
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Mergers & Acquisitions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements: 2016, Feb - 2020, May) Leading Players

Chapter 4. Global eSIM Market by Application
4.1 Global eSIM M2M Market by Region
4.2 Global eSIM Market by M2M Type
4.2.1 Global eSIM Automotive Market by Region
4.2.2 Global eSIM Energy & Utilities Market by Region
4.2.3 Global eSIM Others Market by Region
4.3 Global eSIM Consumer Electronics Market by Region

Chapter 5. Global eSIM Market by Solution
5.1 Global Connectivity Services eSIM Market by Region
5.2 Global Hardware eSIM Market by Region

Chapter 6. Global eSIM Market by Region
6.1 North America eSIM Market
6.1.1 North America eSIM Market by Application
6.1.1.1 North America eSIM M2M Market by Country
6.1.1.2 North America eSIM Market by M2M Type
6.1.1.2.1 North America eSIM Automotive Market by Country
6.1.1.2.2 North America eSIM Energy & Utilities Market by Country
6.1.1.2.3 North America eSIM Others Market by Country
6.1.1.3 North America eSIM Consumer Electronics Market by Country
6.1.2 North America eSIM Market by Solution
6.1.2.1 North America Connectivity Services eSIM Market by Country
6.1.2.2 North America Hardware eSIM Market by Country
6.1.3 North America eSIM Market by Country
6.1.3.1 US eSIM Market
6.1.3.1.1 US eSIM Market by Application
6.1.3.1.2 US eSIM Market by Solution
6.1.3.2 Canada eSIM Market
6.1.3.2.1 Canada eSIM Market by Application
6.1.3.2.2 Canada eSIM Market by Solution
6.1.3.3 Mexico eSIM Market
6.1.3.3.1 Mexico eSIM Market by Application
6.1.3.3.2 Mexico eSIM Market by Solution
6.1.3.4 Rest of North America eSIM Market
6.1.3.4.1 Rest of North America eSIM Market by Application
6.1.3.4.2 Rest of North America eSIM Market by Solution
6.2 Europe eSIM Market
6.2.1 Europe eSIM Market by Application
6.2.1.1 Europe eSIM M2M Market by Country
6.2.1.2 Europe eSIM Market by M2M Type
6.2.1.2.1 Europe eSIM Automotive Market by Country
6.2.1.2.2 Europe eSIM Energy & Utilities Market by Country
6.2.1.2.3 Europe eSIM Others Market by Country
6.2.1.3 Europe eSIM Consumer Electronics Market by Country
6.2.2 Europe eSIM Market by Solution
6.2.2.1 Europe Connectivity Services eSIM Market by Country
6.2.2.2 Europe Hardware eSIM Market by Country
6.2.3 Europe eSIM Market by Country
6.2.3.1 Germany eSIM Market
6.2.3.1.1 Germany eSIM Market by Application
6.2.3.1.2 Germany eSIM Market by Solution
6.2.3.2 UK eSIM Market
6.2.3.2.1 UK eSIM Market by Application
6.2.3.2.2 UK eSIM Market by Solution
6.2.3.3 France eSIM Market
6.2.3.3.1 France eSIM Market by Application
6.2.3.3.2 France eSIM Market by Solution
6.2.3.4 Russia eSIM Market
6.2.3.4.1 Russia eSIM Market by Application
6.2.3.4.2 Russia eSIM Market by Solution
6.2.3.5 Spain eSIM Market
6.2.3.5.1 Spain eSIM Market by Application
6.2.3.5.2 Spain eSIM Market by Solution
6.2.3.6 Italy eSIM Market
6.2.3.6.1 Italy eSIM Market by Application
6.2.3.6.2 Italy eSIM Market by Solution
6.2.3.7 Rest of Europe eSIM Market
6.2.3.7.1 Rest of Europe eSIM Market by Application
6.2.3.7.2 Rest of Europe eSIM Market by Solution
6.3 Asia Pacific eSIM Market
6.3.1 Asia Pacific eSIM Market by Application
6.3.1.1 Asia Pacific eSIM M2M Market by Country
6.3.1.2 Asia Pacific eSIM Market by M2M Type
6.3.1.2.1 Asia Pacific eSIM Automotive Market by Country
6.3.1.2.2 Asia Pacific eSIM Energy & Utilities Market by Country
6.3.1.2.3 Asia Pacific eSIM Others Market by Country
6.3.1.3 Asia Pacific eSIM Consumer Electronics Market by Country
6.3.2 Asia Pacific eSIM Market by Solution
6.3.2.1 Asia Pacific Connectivity Services eSIM Market by Country
6.3.2.2 Asia Pacific Hardware eSIM Market by Country
6.3.3 Asia Pacific eSIM Market by Country
6.3.3.1 China eSIM Market
6.3.3.1.1 China eSIM Market by Application
6.3.3.1.2 China eSIM Market by Solution
6.3.3.2 Japan eSIM Market
6.3.3.2.1 Japan eSIM Market by Application
6.3.3.2.2 Japan eSIM Market by Solution
6.3.3.3 India eSIM Market
6.3.3.3.1 India eSIM Market by Application
6.3.3.3.2 India eSIM Market by Solution
6.3.3.4 South Korea eSIM Market
6.3.3.4.1 South Korea eSIM Market by Application
6.3.3.4.2 South Korea eSIM Market by Solution
6.3.3.5 Singapore eSIM Market
6.3.3.5.1 Singapore eSIM Market by Application
6.3.3.5.2 Singapore eSIM Market by Solution
6.3.3.6 Malaysia eSIM Market
6.3.3.6.1 Malaysia eSIM Market by Application
6.3.3.6.2 Malaysia eSIM Market by Solution
6.3.3.7 Rest of Asia Pacific eSIM Market
6.3.3.7.1 Rest of Asia Pacific eSIM Market by Application
6.3.3.7.2 Rest of Asia Pacific eSIM Market by Solution
6.4 LAMEA eSIM Market
6.4.1 LAMEA eSIM Market by Application
6.4.1.1 LAMEA eSIM M2M Market by Country
6.4.1.2 LAMEA eSIM Market by M2M Type
6.4.1.2.1 LAMEA eSIM Automotive Market by Country
6.4.1.2.2 LAMEA eSIM Energy & Utilities Market by Country
6.4.1.2.3 LAMEA eSIM Others Market by Country
6.4.1.2.4 LAMEA eSIM Consumer Electronics Market by Country
6.4.2 LAMEA eSIM Market by Solution
6.4.2.1 LAMEA Connectivity Services eSIM Market by Country
6.4.2.2 LAMEA Hardware eSIM Market by Country
6.4.3 LAMEA eSIM Market by Country
6.4.3.1 Brazil eSIM Market
6.4.3.1.1 Brazil eSIM Market by Application
6.4.3.1.2 Brazil eSIM Market by Solution
6.4.3.2 Argentina eSIM Market
6.4.3.2.1 Argentina eSIM Market by Application
6.4.3.2.2 Argentina eSIM Market by Solution
6.4.3.3 UAE eSIM Market
6.4.3.3.1 UAE eSIM Market by Application
6.4.3.3.2 UAE eSIM Market by Solution
6.4.3.4 Saudi Arabia eSIM Market
6.4.3.4.1 Saudi Arabia eSIM Market by Application
6.4.3.4.2 Saudi Arabia eSIM Market by Solution
6.4.3.5 South Africa eSIM Market
6.4.3.5.1 South Africa eSIM Market by Application
6.4.3.5.2 South Africa eSIM Market by Solution
6.4.3.6 Nigeria eSIM Market
6.4.3.6.1 Nigeria eSIM Market by Application
6.4.3.6.2 Nigeria eSIM Market by Solution
6.4.3.7 Rest of LAMEA eSIM Market
6.4.3.7.1 Rest of LAMEA eSIM Market by Application
6.4.3.7.2 Rest of LAMEA eSIM Market by Solution

Chapter 7. Company Profiles
7.1 Thales Group S.A. (Gemalto NV)
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.1 Research and Development Expense
7.1.2 Recent strategies and developments:
7.1.2.1 Partnerships, Collaborations, and Agreements:
7.1.3 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Partnerships, Collaborations, and Agreements:
7.2.5.2 Acquisition and Mergers:
7.2.5.3 Product Launches and Product Expansions:
7.2.6 SWOT Analysis
7.3 NXP Semiconductors N.V.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Acquisition and Mergers:
7.3.6 SWOT Analysis
7.4 STMicroelectronics N.V.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Partnerships, Collaborations, and Agreements:
7.4.5.2 Product Launches and Product Expansions:
7.4.6 SWOT Analysis
7.5 Telefonica S.A.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Partnerships, Collaborations, and Agreements:
7.6 NTT Data Corporation
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Segmental Analysis
7.6.4 Research & Development Expense
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.6.5.2 Acquisition and Mergers:
7.6.5.3 Product Launches and Product Expansions:
7.6.6 SWOT Analysis
7.7 Giesecke & Devrient GmbH
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Research & Development Expense
7.7.4 Recent strategies and developments:
7.7.4.1 Partnerships, Collaborations, and Agreements:
7.7.4.2 Product Launches and Product Expansions:
7.7.5 SWOT Analysis
7.8 Deutsche Telekom AG
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental Analysis
7.8.4 Research & Development Expenses
7.8.5 Recent strategies and developments:
7.8.5.1 Partnerships, Collaborations, and Agreements:
7.8.5.2 Product Launches and Product Expansions:
7.9 Singapore Telecommunications Limited
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental Analysis
7.9.4 Recent strategies and developments:
7.9.4.1 Product Launches and Product Expansions:
7.10 Sierra Wireless, Inc.
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 Recent strategies and developments:
7.10.5.1 Acquisition and Mergers:
Note: Product cover images may vary from those shown
  • Thales Group S.A. (Gemalto NV)
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • Telefonica S.A.
  • NTT Data Corporation
  • Giesecke & Devrient GmbH
  • Deutsche Telekom AG
  • Singapore Telecommunications Limited
  • Sierra Wireless, Inc.
Note: Product cover images may vary from those shown

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