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Asia Pacific eSIM Market By Application, By Solution, By Country, Industry Analysis and Forecast, 2020 - 2026

  • ID: 5129332
  • Report
  • June 2020
  • Region: Asia Pacific
  • 112 pages
  • Marqual IT Solutions Pvt. Ltd (KBV Research)

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FEATURED COMPANIES

  • Deutsche Telekom AG
  • Giesecke & Devrient GmbH
  • Infineon Technologies AG
  • NTT Data Corporation
  • NXP Semiconductors N.V.
  • Sierra Wireless, Inc.
  • MORE
The Asia Pacific eSIM Market is expected to witness market growth of 19% CAGR during the forecast period (2020-2026).

The technological development of hard-wired subscriber identity module and/or universal integrated circuit card (UICC) into a device instead of leaving it on a removable chip - is widely perceived as a critical step forward in accomplishing seamless cellular connectivity for all devices wherever they may be.

As with most disruptive innovations in the mobile market, MVNOs are well positioned to capitalize on the opportunities eSIM is opening up. Network service provisioning digitisation fits well with the growing number of virtual operators adopting online, digital-only business models. MVNOs is also at the forefront of the short-term phenomenon, SIM-only offers, and are more likely to benefit from the more loosening of contract lock-ins than major carriers.

Additionally, e-SIM is widely regarded opening up more opportunities in the kind of niche markets in which MVNOs tend to thrive, like travel and the many different IoT-adopting industry verticals. Nevertheless, in embracing the e-SIM opportunity, virtual operators face some challenges, one of which is higher costs compared to removable SIM cards.

Organizations are increasingly seeking a seamless, reliable loT connectivity solution to avoid challenges associated with obtaining global reach, managing the continually evolving cellular technologies, and navigating dynamic manufacturing and logistics systems, among others. The eSIM technologies can deliver this solution with remote SIM card management capabilities, such as secure OTA provisioning.

Based on Application, the market is segmented into M2M and Consumer Electronics. M2M type is further classified into Automotive, Energy & Utilities and Others. Based on Solution, the market is segmented into Connectivity Services and Hardware. Based on countries, the market is segmented into China, Japan, India, South Korea, Singapore, Malaysia, and Rest of Asia Pacific.

The market research report covers theanalysis of key stake holders of the market. Key companies profiled in the report include Thales Group S.A. (Gemalto NV), Infineon Technologies AG, NXP Semiconductors N.V., STMicroelectronics N.V., Telefonica S.A., NTT Data Corporation, Giesecke & Devrient GmbH, Deutsche Telekom AG, Singapore Telecommunications Limited, Sierra Wireless, Inc.

Scope of the Study

Market Segmentation:

By Application
  • M2M
  • Automotive
  • Energy & Utilities
  • Others
  • Consumer Electronics
By Solution
  • Connectivity Services
  • Hardware
By Country
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Malaysia
  • Rest of Asia Pacific
Companies Profiled
  • Thales Group S.A. (Gemalto NV)
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • Telefonica S.A.
  • NTT Data Corporation
  • Giesecke & Devrient GmbH
  • Deutsche Telekom AG
  • Singapore Telecommunications Limited
  • Sierra Wireless, Inc.
Unique Offerings from the Publisher
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  • Highest number of market tables and figures
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  • Assured post sales research support with 10% customization free
Note: Product cover images may vary from those shown

FEATURED COMPANIES

  • Deutsche Telekom AG
  • Giesecke & Devrient GmbH
  • Infineon Technologies AG
  • NTT Data Corporation
  • NXP Semiconductors N.V.
  • Sierra Wireless, Inc.
  • MORE
Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific eSIM Market, by Application
1.4.2 Asia Pacific eSIM Market, by Solution
1.4.3 Asia Pacific eSIM Market, by Country
1.5 Methodology for the research

Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints

Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.2.3 Mergers & Acquisitions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Partnerships, Collaborations, and Agreements: 2016, Feb - 2020, May) Leading Players

Chapter 4. Asia Pacific eSIM Market by Application
4.1 Asia Pacific eSIM M2M Market by Country
4.2 Asia Pacific eSIM Market by M2M Type
4.2.1 Asia Pacific eSIM Automotive Market by Country
4.2.2 Asia Pacific eSIM Energy & Utilities Market by Country
4.2.3 Asia Pacific eSIM Others Market by Country
4.3 Asia Pacific eSIM Consumer Electronics Market by Country

Chapter 5. Asia Pacific eSIM Market by Solution
5.1 Asia Pacific Connectivity Services eSIM Market by Country
5.2 Asia Pacific Hardware eSIM Market by Country

Chapter 6. Asia Pacific eSIM Market by Country
6.1 China eSIM Market
6.1.1 China eSIM Market by Application
6.1.1.1 China eSIM Market by M2M Type
6.1.2 China eSIM Market by Solution
6.2 Japan eSIM Market
6.2.1 Japan eSIM Market by Application
6.2.1.1 Japan eSIM Market by M2M Type
6.2.2 Japan eSIM Market by Solution
6.3 India eSIM Market
6.3.1 India eSIM Market by Application
6.3.1.1 India eSIM Market by M2M Type
6.3.2 India eSIM Market by Solution
6.4 South Korea eSIM Market
6.4.1 South Korea eSIM Market by Application
6.4.1.1 South Korea eSIM Market by M2M Type
6.4.2 South Korea eSIM Market by Solution
6.5 Singapore eSIM Market
6.5.1 Singapore eSIM Market by Application
6.5.1.1 Singapore eSIM Market by M2M Type
6.5.2 Singapore eSIM Market by Solution
6.6 Malaysia eSIM Market
6.6.1 Malaysia eSIM Market by Application
6.6.1.1 Malaysia eSIM Market by M2M Type
6.6.2 Malaysia eSIM Market by Solution
6.7 Rest of Asia Pacific eSIM Market
6.7.1 Rest of Asia Pacific eSIM Market by Application
6.7.1.1 Rest of Asia Pacific eSIM Market by M2M Type
6.7.2 Rest of Asia Pacific eSIM Market by Solution

Chapter 7. Company Profiles
7.1 Thales Group S.A. (Gemalto NV)
7.1.1 Company Overview
7.1.2 Financial Analysis
7.1.3 Segmental and Regional Analysis
7.1.1 Research and Development Expense
7.1.2 Recent strategies and developments:
7.1.2.1 Partnerships, Collaborations, and Agreements:
7.1.3 SWOT Analysis
7.2 Infineon Technologies AG
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Partnerships, Collaborations, and Agreements:
7.2.5.2 Acquisition and Mergers:
7.2.5.3 Product Launches and Product Expansions:
7.2.6 SWOT Analysis
7.3 NXP Semiconductors N.V.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Acquisition and Mergers:
7.3.6 SWOT Analysis
7.4 STMicroelectronics N.V.
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Partnerships, Collaborations, and Agreements:
7.4.5.2 Product Launches and Product Expansions:
7.4.6 SWOT Analysis
7.5 Telefonica S.A.
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental Analysis
7.5.4 Research & Development Expense
7.5.5 Recent strategies and developments:
7.5.5.1 Partnerships, Collaborations, and Agreements:
7.6 NTT Data Corporation
7.6.1 Company overview
7.6.2 Financial Analysis
7.6.3 Segmental Analysis
7.6.4 Research & Development Expense
7.6.5 Recent strategies and developments:
7.6.5.1 Partnerships, Collaborations, and Agreements:
7.6.5.2 Acquisition and Mergers:
7.6.5.3 Product Launches and Product Expansions:
7.6.6 SWOT Analysis
7.7 Giesecke & Devrient GmbH
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Research & Development Expense
7.7.4 Recent strategies and developments:
7.7.4.1 Partnerships, Collaborations, and Agreements:
7.7.4.2 Product Launches and Product Expansions:
7.7.5 SWOT Analysis
7.8 Deutsche Telekom AG
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental Analysis
7.8.4 Research & Development Expenses
7.8.5 Recent strategies and developments:
7.8.5.1 Partnerships, Collaborations, and Agreements:
7.8.5.2 Product Launches and Product Expansions:
7.9 Singapore Telecommunications Limited
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Segmental Analysis
7.9.4 Recent strategies and developments:
7.9.4.1 Product Launches and Product Expansions:
7.10 Sierra Wireless, Inc.
7.10.1 Company overview
7.10.2 Financial Analysis
7.10.3 Segmental and Regional Analysis
7.10.4 Research & Development Expenses
7.10.5 Recent strategies and developments:
7.10.5.1 Acquisition and Mergers:
Note: Product cover images may vary from those shown
  • Thales Group S.A. (Gemalto NV)
  • Infineon Technologies AG
  • NXP Semiconductors N.V.
  • STMicroelectronics N.V.
  • Telefonica S.A.
  • NTT Data Corporation
  • Giesecke & Devrient GmbH
  • Deutsche Telekom AG
  • Singapore Telecommunications Limited
  • Sierra Wireless, Inc.
Note: Product cover images may vary from those shown

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