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Asia Pacific Semiconductor Memory Market By Type, By End User, By Country, Industry Analysis and Forecast, 2020 - 2026

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    Report

  • 114 Pages
  • June 2020
  • Region: Asia Pacific
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5129348
The Asia Pacific Semiconductor Memory Market is expected to witness market growth of 7.8% CAGR during the forecast period (2020-2026).

With time, the application scope of semiconductor memory has increased, and the size has increased since larger and larger storage spaces are needed. Increased demands for semiconductor-based memory have also contributed to the introduction of new types of memory and technologies, thereby also evolving existing technologies and models. The growing implementation of advanced safety systems in cars, such as airbags, ADAS, lighting and braking, utilizes a variety of sensors and ECUs that require highly efficient memory components to drive market growth. Process analytical devices and cameras used in ADAS systems need a huge amount of flash and DRAM memory, creating market opportunities. Due to its performance and low power consumption benefits, automotive manufacturers increasingly use these memory solutions for their safety systems. This will be added as an advantage to the players in the industry.

There are also several requirements for non-volatile memory, such as NAND flash, on the in-vehicle communication system. This helps to store a number of security certificates and develop efficient wireless connections. Companies that manufacture semiconductor memory focus on offering products on the basis of the requirements of auto manufacturers to receive a competitive edge in the market.

Over the forecast period, substantial growth is anticipated in the automotive segment. The rise is due to the decreasing use of advanced vehicle safety features including airbags, security, and ADAS systems and braking systems, which use many sensors and ECUs. Sensors and electrical devices need highly efficient memory components. Owing to their low energy usage and increased efficiency advantages, automotive manufacturers are gradually utilizing semiconductor memory chips for vehicle security systems.

The communications system in the vehicle also calls for non-volatile memory, for example flash ROM. This flash ROM helps to create efficient wireless connections and store various security certificates. In recent years, manufacturers of semiconductor memory have focused on manufacturing products, depending on the requirements of car manufacturers, in order to gain a competitive edge on the market.

Based on Type, the market is segmented into DRAM, Flash ROM, SRAM, MRAM and Others. Based on End User, the market is segmented into Consumer Electronics, Automotive, Telecom & IT, Aerospace & Defense, Medical, Industrial and Others. Based on countries, the market is segmented into China, Japan, India, South Korea, Malaysia, Taiwan, and Rest of Asia Pacific.

The market research report covers theanalysis of key stake holders of the market. Key companies profiled in the report include IBM Corporation, Infineon Technologies AG (Cypress Semiconductor Corporation), NXP Semiconductors N.V., Samsung Electronics Co., Ltd. (Samsung Group), Intel Corporation, Fujitsu Limited, Texas Instruments, Inc., Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation), Macronix International Co., Ltd., and Crocus Technology, Inc.

Scope of the Study

Market Segmentation:

By Type
  • DRAM
  • Flash ROM
  • SRAM
  • MRAM
  • Others

By End User
  • Consumer Electronics
  • Automotive
  • Telecom & IT
  • Aerospace & Defense
  • Medical
  • Industrial
  • Others

By Country
  • China
  • Japan
  • India
  • South Korea
  • Malaysia
  • Taiwan
  • Rest of Asia Pacific

Companies Profiled
  • IBM Corporation
  • Infineon Technologies AG (Cypress Semiconductor Corporation)
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Intel Corporation
  • Fujitsu Limited
  • Texas Instruments, Inc.
  • Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
  • Macronix International Co., Ltd.
  • Crocus Technology, Inc.

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  • Highest number of market tables and figures
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  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Asia Pacific Semiconductor Memory Market, by Type
1.4.2 Asia Pacific Semiconductor Memory Market, by End User
1.4.3 Asia Pacific Semiconductor Memory Market, by Country
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2016, Nov - 2020, Jun) Leading Players
Chapter 4. Asia Pacific Semiconductor Memory Market by Type
4.1 Asia Pacific DRAM Semiconductor Memory Market by Country
4.2 Asia Pacific Flash ROM Semiconductor Memory Market by Country
4.3 Asia Pacific SRAM Semiconductor Memory Market by Country
4.4 Asia Pacific MRAM Semiconductor Memory Market by Country
4.5 Asia Pacific Other Type Semiconductor Memory Market by Country
Chapter 5. Asia Pacific Semiconductor Memory Market by End User
5.1 Asia Pacific Consumer Electronics Semiconductor Memory Market by Country
5.2 Asia Pacific Automotive Semiconductor Memory Market by Country
5.3 Asia Pacific Telecom & IT Semiconductor Memory Market by Country
5.4 Asia Pacific Aerospace & Defense Semiconductor Memory Market by Country
5.5 Asia Pacific Medical Semiconductor Memory Market by Country
5.6 Asia Pacific Industrial Semiconductor Memory Market by Country
5.7 Asia Pacific Others Semiconductor Memory Market by Country
Chapter 6. Asia Pacific Semiconductor Memory Market by Country
6.1 China Semiconductor Memory Market
6.1.1 China Semiconductor Memory Market by Type
6.1.2 China Semiconductor Memory Market by End User
6.2 Japan Semiconductor Memory Market
6.2.1 Japan Semiconductor Memory Market by Type
6.2.2 Japan Semiconductor Memory Market by End User
6.3 Taiwan Semiconductor Memory Market
6.3.1 Taiwan Semiconductor Memory Market by Type
6.3.2 Taiwan Semiconductor Memory Market by End User
6.4 India Semiconductor Memory Market
6.4.1 India Semiconductor Memory Market by Type
6.4.2 India Semiconductor Memory Market by End User
6.5 South Korea Semiconductor Memory Market
6.5.1 South Korea Semiconductor Memory Market by Type
6.5.2 South Korea Semiconductor Memory Market by End User
6.6 Malaysia Semiconductor Memory Market
6.6.1 Malaysia Semiconductor Memory Market by Type
6.6.2 Malaysia Semiconductor Memory Market by End User
6.7 Rest of Asia Pacific Semiconductor Memory Market
6.7.1 Rest of Asia Pacific Semiconductor Memory Market by Type
6.7.2 Rest of Asia Pacific Semiconductor Memory Market by End User
Chapter 7. Company Profiles
7.1 IBM Corporation
7.1.1 Company Overview
7.1.1 Financial Analysis
7.1.2 Regional & Segmental Analysis
7.1.3 Research & Development Expenses
7.1.4 Recent strategies and developments:
7.1.4.1 Partnerships, Collaborations, and Agreements:
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG (Cypress Semiconductor Corporation)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Product Launches and Product Expansions:
7.2.6 SWOT Analysis
7.3 NXP Semiconductors N.V.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.6 SWOT Analysis
7.4 Samsung Electronics Co., Ltd. (Samsung Group)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Product Launches and Product Expansions:
7.4.6 SWOT Analysis
7.5 Intel Corporation
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 Recent strategies and developments:
7.5.5.1 Partnerships, Collaborations, and Agreements:
7.5.5.2 Product Launches and Product Expansions:
7.5.6 SWOT Analysis
7.6 Fujitsu Limited
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Recent strategies and developments:
7.6.3.1 Partnerships, Collaborations, and Agreements:
7.6.3.2 Product Launches and Product Expansions:
7.6.4 SWOT Analysis
7.7 Texas Instruments, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.7.6 SWOT Analysis
7.8 Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research and Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Macronix International Co., Ltd.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expense
7.9.5 Recent strategies and developments:
7.9.5.1 Partnerships, Collaborations, and Agreements:
7.9.5.2 Product Launches and Product Expansions:
7.10 Crocus Technology, Inc.
7.10.1 Company overview
7.10.2 Recent strategies and developments:
7.10.2.1 Partnerships, Collaborations, and Agreements:

Companies Mentioned

  • IBM Corporation
  • Infineon Technologies AG (Cypress Semiconductor Corporation)
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Intel Corporation
  • Fujitsu Limited
  • Texas Instruments, Inc.
  • Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
  • Macronix International Co., Ltd.
  • Crocus Technology, Inc.

Methodology

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