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Global Semiconductor Memory Market By Type, By End User, By Region, Industry Analysis and Forecast, 2020 - 2026

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    Report

  • 231 Pages
  • June 2020
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 5129393
Description Jump to:
The Global Semiconductor Memory Market size is expected to reach $127.3 billion by 2026, rising at a market growth of 7.5% CAGR during the forecast period. Semiconductor memory is an electronic component used as the memory of a computer. Semiconductor memory is an essential part of today's electronic devices. This is a system in which digital information is retained by the use of IC (Integrated Circuit) technology. The rising demand for high-capacity and low-power memory is growing rapidly as modern advanced portable electronic devices boost overall performance with their reduced size. With the growing proliferation of electronic devices and the need for associated capacity, there is, as predicted, a huge demand for semiconductor memory.

The Semiconductor Memory devices consist of two major types, namely volatile and non-volatile memories. Non-volatile memory includes read-only memory (ROM), programmable read-only memory (PROM), Erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM) and Flash memory. Volatile memory includes Random Access Memory (RAM), Dynamic Random-Access Memory (DRAM), Static Random-Access Memory (SRAM) and Synchronous Dynamic Random-Access Memory (SDRAM).

Rapid growth in the electronics industry, together with the use of memory-based elements in advanced devices like smart phones, wearable devices and electronic gadgets, is pushing ahead with market growth worldwide. Growing use of automotive and electronic devices, such as Flash ROM and DRAM, fuels the market for embedded gadgets and chips. The lighting and ADAS systems DRAM, Flash ROM and offer higher speeds and better vehicle connectivity.

However, due to restrictions on the worldwide retail of electronics, the COVID19 pandemic is expected to negatively impact over the course of the next few years. In a short period of time, various countries such as Italy, Germany, France, the United States, South Korea and Japan are severely affected. Semiconductors and electronics are therefore expected to suffer major declines in the first half of 2020 due to a decline in trade constraints. Nevertheless, trade in electronics is expected to return to normal levels by the end of the second quarter of 2020.

Based on Type, the market is segmented into DRAM, Flash ROM, SRAM, MRAM and Others. Based on End User, the market is segmented into Consumer Electronics, Automotive, Telecom & IT, Aerospace & Defense, Medical, Industrial and Others. Based on Regions, the market is segmented into North America, Europe, Asia Pacific, and Latin America, Middle East & Africa.

The major strategies followed by the market participants are Product Launches. Based on the Analysis presented in the Cardinal matrix, Texas Instruments, Inc., Toshiba Corporation, IBM Corporation, Samsung Electronics Co., Ltd., and Intel Corporation are the forerunners in the Semiconductor Memory Market. Companies such as Fujitsu Limited, NXP Semiconductors N.V., Infineon Technologies AG, Macronix International Co., Ltd., and Crocus Technology, Inc. are some of the key innovators in the market.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include IBM Corporation, Infineon Technologies AG (Cypress Semiconductor Corporation), NXP Semiconductors N.V., Samsung Electronics Co., Ltd. (Samsung Group), Intel Corporation, Fujitsu Limited, Texas Instruments, Inc., Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation), Macronix International Co., Ltd., and Crocus Technology, Inc.

Recent strategies deployed in Semiconductor Memory Market

Partnerships, Collaborations, and Agreements:

Sep-2019: Intel Corporation came into an agreement with Oracle. Following the agreement, Oracle incorporated the high-performance capabilities of Intel Optane DC Persistent Memory into its next-generation Exadata platform, Oracle Exadata X8M. Intel Optane DC Persistent Memory, and 100-gigabit RoCE networking, Oracle Exadata X8M has designed to support today’s demanding Online Transaction Processing (OLTP), analytics, and mixed workload database requirements, as well as database consolidation and in-database machine learning.

Aug-2019: Macronix International teamed up with NVIDIA following which its ArmorFlash memory is being utilized on the NVIDIA DRIVE AGX Xavier and DRIVE AGX Pegasus autonomous vehicle computing platforms. Together, the companies aimed to enhance data security in AD automotive-electronics applications.

Product Launches and Product Expansions:

Jun-2020: Infineon extended its Semper NOR Flash memory platform by adding Semper Secure to it. Based on Semper NOR Flash’s field-proven and robust smart memory architecture, Semper Secure NOR Flash is the first memory solution to combine security and functional safety in a single NOR flash device for delivering the security, safety, and reliability required for the most advanced connected automotive, industrial, and communications systems.

Oct-2019: Infineon Technologies is launching TC3A, a new addition to its automotive microcontroller family AURIX. TC3A is expected to cater to the new automotive 77 GHz radar applications such as high-end corner radar systems for advanced driver assistance systems and automated driving. Its features include a new signal processing unit, a large SRAM memory dedicated to radar, and four TriCore processors running at 300 MHz with two additional lockstep cores.

Sep-2019: Intel unveiled Barlow Pass Optane DC persistent memory and Alder Stream Optane DC SSDs. The company also launched Arbordale 3D NAND SSDs, now with 144-layer quad-level cell (QLC), up from the 96-layer current-gen “Cliffdale-R” range. Intel’s Optane DC persistent memory is a high-density, high-performance, non-volatile memory module compatible with DDR4 RAM slots, which enables servers to accommodate terabytes of non-volatile storage coupled with the CPU. The vendor’s 3D NAND range are high-density PCIe SSDs with its QLC technology, targeted to both consumer and enterprise customers.

Aug-2019: Toshiba Memory Europe unveiled XL-FLASH, a new Storage Class Memory (SCM) solution. The solution provides low latency and high performance to the data center and enterprise storage.

Jul-2019: Samsung Electronics introduced the 12-gigabit (Gb) LPDDR5 mobile DRAM. The DRAM has been optimized for enabling 5G and AI features in future smartphones.

Jul-2019: Fujitsu Semiconductor released the 8Mbit ReRAM *1 MB85AS8MT. This ReRAM product has been developed with Panasonic Semiconductor Solutions Co., Ltd. The MB85AS8MT is an EEPROM-compatible non-volatile memory with SPI-interface that operates with a wide range of power supply voltages from 1.6V to 3.6V.

Feb-2019: NXP Semiconductors released the K32 microcontroller (MCU) series. The series aimed to advance the energy efficiency of real-time embedded applications and enabled advanced security with physical tamper protection in a wide range of Industrial and Internet-of-Things (IoT) applications.

Feb-2019: NXP Semiconductors unveiled the world’s first microcontroller (MCU) based voice control solution qualified with Amazon’s Alexa Voice Service (AVS). This enabled original equipment manufacturers (OEMs) to quickly, easily, and inexpensively add voice control to their products, giving their customers access to rich voice experiences with AlexaBased on NXP’s i.MX RT crossover microcontroller (MCU) platform.

Feb-2019: Toshiba Electronic Devices and Storage Corporation launched image recognition SoC (System on Chip) for automotive applications. In this device, SRAM is implemented close to the DNN execution unit, and DNN processing is divided into sub-processing blocks to keep temporal data in the SRAM, reducing DRAM access. Additionally, Toshiba has added a decompression unit to the accelerator.

Scope of the Study

Market Segmentation:

By Type
  • DRAM
  • Flash ROM
  • SRAM
  • MRAM
  • Others

By End User
  • Consumer Electronics
  • Automotive
  • Telecom & IT
  • Aerospace & Defense
  • Medical
  • Industrial
  • Others

By Geography

North America
  • US
  • Canada
  • Mexico
  • Rest of North America

Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe

Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Malaysia
  • Taiwan
  • Rest of Asia Pacific

LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Companies Profiled
  • IBM Corporation
  • Infineon Technologies AG (Cypress Semiconductor Corporation)
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Intel Corporation
  • Fujitsu Limited
  • Texas Instruments, Inc.
  • Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
  • Macronix International Co., Ltd.
  • Crocus Technology, Inc.

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  • Highest number of market tables and figures
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  • Assured post sales research support with 10% customization free

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Semiconductor Memory Market, by Type
1.4.2 Global Semiconductor Memory Market, by End User
1.4.3 Global Semiconductor Memory Market, by Geography
1.5 Methodology for the research
Chapter 2. Market Overview
2.1 Introduction
2.1.1 Overview
2.1.2 Executive Summary
2.1.3 Market Composition and Scenario
2.2 Key Factors Impacting the Market
2.2.1 Market Drivers
2.2.2 Market Restraints
Chapter 3. Competition Analysis - Global
3.1 Cardinal Matrix
3.2 Recent Industry Wide Strategic Developments
3.2.1 Partnerships, Collaborations and Agreements
3.2.2 Product Launches and Product Expansions
3.3 Top Winning Strategies
3.3.1 Key Leading Strategies: Percentage Distribution (2016-2020)
3.3.2 Key Strategic Move: (Product Launches and Product Expansions : 2016, Nov - 2020, Jun) Leading Players
Chapter 4. Global Semiconductor Memory Market by Type
4.1 Global DRAM Semiconductor Memory Market by Region
4.2 Global Flash ROM Semiconductor Memory Market by Region
4.3 Global SRAM Semiconductor Memory Market by Region
4.4 Global MRAM Semiconductor Memory Market by Region
4.5 Global Other Type Semiconductor Memory Market by Region
Chapter 5. Global Semiconductor Memory Market by End User
5.1 Global Consumer Electronics Semiconductor Memory Market by Region
5.2 Global Automotive Semiconductor Memory Market by Region
5.3 Global Telecom & IT Semiconductor Memory Market by Region
5.4 Global Aerospace & Defense Semiconductor Memory Market by Region
5.5 Global Medical Semiconductor Memory Market by Region
5.6 Global Industrial Semiconductor Memory Market by Region
5.7 Global Others Semiconductor Memory Market by Region
Chapter 6. Global Semiconductor Memory Market by Region
6.1 North America Semiconductor Memory Market
6.1.1 North America Semiconductor Memory Market by Type
6.1.1.1 North America DRAM Semiconductor Memory Market by Country
6.1.1.2 North America Flash ROM Semiconductor Memory Market by Country
6.1.1.3 North America SRAM Semiconductor Memory Market by Country
6.1.1.4 North America MRAM Semiconductor Memory Market by Country
6.1.1.5 North America Other Type Semiconductor Memory Market by Country
6.1.2 North America Semiconductor Memory Market by End User
6.1.2.1 North America Consumer Electronics Semiconductor Memory Market by Country
6.1.2.2 North America Automotive Semiconductor Memory Market by Country
6.1.2.3 North America Telecom & IT Semiconductor Memory Market by Country
6.1.2.4 North America Aerospace & Defense Semiconductor Memory Market by Country
6.1.2.5 North America Medical Semiconductor Memory Market by Country
6.1.2.6 North America Industrial Semiconductor Memory Market by Country
6.1.2.7 North America Others Semiconductor Memory Market by Country
6.1.3 North America Semiconductor Memory Market by Country
6.1.3.1 US Semiconductor Memory Market
6.1.3.1.1 US Semiconductor Memory Market by Type
6.1.3.1.2 US Semiconductor Memory Market by End User
6.1.3.2 Canada Semiconductor Memory Market
6.1.3.2.1 Canada Semiconductor Memory Market by Type
6.1.3.2.2 Canada Semiconductor Memory Market by End User
6.1.3.3 Mexico Semiconductor Memory Market
6.1.3.3.1 Mexico Semiconductor Memory Market by Type
6.1.3.3.2 Mexico Semiconductor Memory Market by End User
6.1.3.4 Rest of North America Semiconductor Memory Market
6.1.3.4.1 Rest of North America Semiconductor Memory Market by Type
6.1.3.4.2 Rest of North America Semiconductor Memory Market by End User
6.2 Europe Semiconductor Memory Market
6.2.1 Europe Semiconductor Memory Market by Type
6.2.1.1 Europe DRAM Semiconductor Memory Market by Country
6.2.1.2 Europe Flash ROM Semiconductor Memory Market by Country
6.2.1.3 Europe SRAM Semiconductor Memory Market by Country
6.2.1.4 Europe MRAM Semiconductor Memory Market by Country
6.2.1.5 Europe Other Type Semiconductor Memory Market by Country
6.2.2 Europe Semiconductor Memory Market by End User
6.2.2.1 Europe Consumer Electronics Semiconductor Memory Market by Country
6.2.2.2 Europe Automotive Semiconductor Memory Market by Country
6.2.2.3 Europe Telecom & IT Semiconductor Memory Market by Country
6.2.2.4 Europe Aerospace & Defense Semiconductor Memory Market by Country
6.2.2.5 Europe Medical Semiconductor Memory Market by Country
6.2.2.6 Europe Industrial Semiconductor Memory Market by Country
6.2.2.7 Europe Others Semiconductor Memory Market by Country
6.2.3 Europe Semiconductor Memory Market by Country
6.2.3.1 Germany Semiconductor Memory Market
6.2.3.1.1 Germany Semiconductor Memory Market by Type
6.2.3.1.2 Germany Semiconductor Memory Market by End User
6.2.3.2 UK Semiconductor Memory Market
6.2.3.2.1 UK Semiconductor Memory Market by Type
6.2.3.2.2 UK Semiconductor Memory Market by End User
6.2.3.3 France Semiconductor Memory Market
6.2.3.3.1 France Semiconductor Memory Market by Type
6.2.3.3.2 France Semiconductor Memory Market by End User
6.2.3.4 Russia Semiconductor Memory Market
6.2.3.4.1 Russia Semiconductor Memory Market by Type
6.2.3.4.2 Russia Semiconductor Memory Market by End User
6.2.3.5 Spain Semiconductor Memory Market
6.2.3.5.1 Spain Semiconductor Memory Market by Type
6.2.3.5.2 Spain Semiconductor Memory Market by End User
6.2.3.6 Italy Semiconductor Memory Market
6.2.3.6.1 Italy Semiconductor Memory Market by Type
6.2.3.6.2 Italy Semiconductor Memory Market by End User
6.2.3.7 Rest of Europe Semiconductor Memory Market
6.2.3.7.1 Rest of Europe Semiconductor Memory Market by Type
6.2.3.7.2 Rest of Europe Semiconductor Memory Market by End User
6.3 Asia Pacific Semiconductor Memory Market
6.3.1 Asia Pacific Semiconductor Memory Market by Type
6.3.1.1 Asia Pacific DRAM Semiconductor Memory Market by Country
6.3.1.2 Asia Pacific Flash ROM Semiconductor Memory Market by Country
6.3.1.3 Asia Pacific SRAM Semiconductor Memory Market by Country
6.3.1.4 Asia Pacific MRAM Semiconductor Memory Market by Country
6.3.1.5 Asia Pacific Other Type Semiconductor Memory Market by Country
6.3.2 Asia Pacific Semiconductor Memory Market by End User
6.3.2.1 Asia Pacific Consumer Electronics Semiconductor Memory Market by Country
6.3.2.2 Asia Pacific Automotive Semiconductor Memory Market by Country
6.3.2.3 Asia Pacific Telecom & IT Semiconductor Memory Market by Country
6.3.2.4 Asia Pacific Aerospace & Defense Semiconductor Memory Market by Country
6.3.2.5 Asia Pacific Medical Semiconductor Memory Market by Country
6.3.2.6 Asia Pacific Industrial Semiconductor Memory Market by Country
6.3.2.7 Asia Pacific Others Semiconductor Memory Market by Country
6.3.3 Asia Pacific Semiconductor Memory Market by Country
6.3.3.1 China Semiconductor Memory Market
6.3.3.1.1 China Semiconductor Memory Market by Type
6.3.3.1.2 China Semiconductor Memory Market by End User
6.3.3.2 Japan Semiconductor Memory Market
6.3.3.2.1 Japan Semiconductor Memory Market by Type
6.3.3.2.2 Japan Semiconductor Memory Market by End User
6.3.3.3 Taiwan Semiconductor Memory Market
6.3.3.3.1 Taiwan Semiconductor Memory Market by Type
6.3.3.3.2 Taiwan Semiconductor Memory Market by End User
6.3.3.4 India Semiconductor Memory Market
6.3.3.4.1 India Semiconductor Memory Market by Type
6.3.3.4.2 India Semiconductor Memory Market by End User
6.3.3.5 South Korea Semiconductor Memory Market
6.3.3.5.1 South Korea Semiconductor Memory Market by Type
6.3.3.5.2 South Korea Semiconductor Memory Market by End User
6.3.3.6 Malaysia Semiconductor Memory Market
6.3.3.6.1 Malaysia Semiconductor Memory Market by Type
6.3.3.6.2 Malaysia Semiconductor Memory Market by End User
6.3.3.7 Rest of Asia Pacific Semiconductor Memory Market
6.3.3.7.1 Rest of Asia Pacific Semiconductor Memory Market by Type
6.3.3.7.2 Rest of Asia Pacific Semiconductor Memory Market by End User
6.4 LAMEA Semiconductor Memory Market
6.4.1 LAMEA Semiconductor Memory Market by Type
6.4.1.1 LAMEA DRAM Semiconductor Memory Market by Country
6.4.1.2 LAMEA Flash ROM Semiconductor Memory Market by Country
6.4.1.3 LAMEA SRAM Semiconductor Memory Market by Country
6.4.1.4 LAMEA MRAM Semiconductor Memory Market by Country
6.4.1.5 LAMEA Other Type Semiconductor Memory Market by Country
6.4.2 LAMEA Semiconductor Memory Market by End User
6.4.2.1 LAMEA Consumer Electronics Semiconductor Memory Market by Country
6.4.2.2 LAMEA Automotive Semiconductor Memory Market by Country
6.4.2.3 LAMEA Telecom & IT Semiconductor Memory Market by Country
6.4.2.4 LAMEA Aerospace & Defense Semiconductor Memory Market by Country
6.4.2.5 LAMEA Medical Semiconductor Memory Market by Country
6.4.2.6 LAMEA Industrial Semiconductor Memory Market by Country
6.4.2.7 LAMEA Others Semiconductor Memory Market by Country
6.4.3 LAMEA Semiconductor Memory Market by Country
6.4.3.1 Brazil Semiconductor Memory Market
6.4.3.1.1 Brazil Semiconductor Memory Market by Type
6.4.3.1.2 Brazil Semiconductor Memory Market by End User
6.4.3.2 Argentina Semiconductor Memory Market
6.4.3.2.1 Argentina Semiconductor Memory Market by Type
6.4.3.2.2 Argentina Semiconductor Memory Market by End User
6.4.3.3 UAE Semiconductor Memory Market
6.4.3.3.1 UAE Semiconductor Memory Market by Type
6.4.3.3.2 UAE Semiconductor Memory Market by End User
6.4.3.4 Saudi Arabia Semiconductor Memory Market
6.4.3.4.1 Saudi Arabia Semiconductor Memory Market by Type
6.4.3.4.2 Saudi Arabia Semiconductor Memory Market by End User
6.4.3.5 South Africa Semiconductor Memory Market
6.4.3.5.1 South Africa Semiconductor Memory Market by Type
6.4.3.5.2 South Africa Semiconductor Memory Market by End User
6.4.3.6 Nigeria Semiconductor Memory Market
6.4.3.6.1 Nigeria Semiconductor Memory Market by Type
6.4.3.6.2 Nigeria Semiconductor Memory Market by End User
6.4.3.7 Rest of LAMEA Semiconductor Memory Market
6.4.3.7.1 Rest of LAMEA Semiconductor Memory Market by Type
6.4.3.7.2 Rest of LAMEA Semiconductor Memory Market by End User
Chapter 7. Company Profiles
7.1 IBM Corporation
7.1.1 Company Overview
7.1.1 Financial Analysis
7.1.2 Regional & Segmental Analysis
7.1.3 Research & Development Expenses
7.1.4 Recent strategies and developments:
7.1.4.1 Partnerships, Collaborations, and Agreements:
7.1.5 SWOT Analysis
7.2 Infineon Technologies AG (Cypress Semiconductor Corporation)
7.2.1 Company Overview
7.2.2 Financial Analysis
7.2.3 Segmental and Regional Analysis
7.2.4 Research & Development Expense
7.2.5 Recent strategies and developments:
7.2.5.1 Product Launches and Product Expansions:
7.2.6 SWOT Analysis
7.3 NXP Semiconductors N.V.
7.3.1 Company Overview
7.3.2 Financial Analysis
7.3.3 Regional Analysis
7.3.4 Research & Development Expense
7.3.5 Recent strategies and developments:
7.3.5.1 Product Launches and Product Expansions:
7.3.6 SWOT Analysis
7.4 Samsung Electronics Co., Ltd. (Samsung Group)
7.4.1 Company Overview
7.4.2 Financial Analysis
7.4.3 Segmental and Regional Analysis
7.4.4 Research & Development Expense
7.4.5 Recent strategies and developments:
7.4.5.1 Product Launches and Product Expansions:
7.4.6 SWOT Analysis
7.5 Intel Corporation
7.5.1 Company Overview
7.5.2 Financial Analysis
7.5.3 Segmental and Regional Analysis
7.5.4 Research & Development Expenses
7.5.5 Recent strategies and developments:
7.5.5.1 Partnerships, Collaborations, and Agreements:
7.5.5.2 Product Launches and Product Expansions:
7.5.6 SWOT Analysis
7.6 Fujitsu Limited
7.6.1 Company Overview
7.6.2 Financial Analysis
7.6.3 Recent strategies and developments:
7.6.3.1 Partnerships, Collaborations, and Agreements:
7.6.3.2 Product Launches and Product Expansions:
7.6.4 SWOT Analysis
7.7 Texas Instruments, Inc.
7.7.1 Company Overview
7.7.2 Financial Analysis
7.7.3 Segmental and Regional Analysis
7.7.4 Research & Development Expense
7.7.5 Recent strategies and developments:
7.7.5.1 Product Launches and Product Expansions:
7.7.6 SWOT Analysis
7.8 Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
7.8.1 Company Overview
7.8.2 Financial Analysis
7.8.3 Segmental and Regional Analysis
7.8.4 Research and Development Expense
7.8.5 Recent strategies and developments:
7.8.5.1 Product Launches and Product Expansions:
7.8.6 SWOT Analysis
7.9 Macronix International Co., Ltd.
7.9.1 Company Overview
7.9.2 Financial Analysis
7.9.3 Regional Analysis
7.9.4 Research & Development Expense
7.9.5 Recent strategies and developments:
7.9.5.1 Partnerships, Collaborations, and Agreements:
7.9.5.2 Product Launches and Product Expansions:
7.10 Crocus Technology, Inc.
7.10.1 Company overview
7.10.2 Recent strategies and developments:
7.10.2.1 Partnerships, Collaborations, and Agreements:

Companies Mentioned

  • IBM Corporation
  • Infineon Technologies AG (Cypress Semiconductor Corporation)
  • NXP Semiconductors N.V.
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Intel Corporation
  • Fujitsu Limited
  • Texas Instruments, Inc.
  • Toshiba Corporation (Toshiba Electronic Devices & Storage Corporation)
  • Macronix International Co., Ltd.
  • Crocus Technology, Inc.

Methodology

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