The Latin America, Middle East and Africa Thermal Interface Materials Market is expected to witness market growth of 12.9% CAGR during the forecast period (2020-2026).
The newly discovered class of thermal interface materials delivers ultralow thermal resistance for all the compact power electronics. The heat dissipated per unit area from the electronic devices increases as electronics get more compact and robust, and additional heat is generated by moving components of machinery that operate at higher speeds. Thermal interface materials allow the removal of heat that is produced from the operation of electronic, mechanical devices and electro-chemical devices. This new class of TIMs sinks the heat and increase thermal transfer efficiency by filling the gaps between thermal transfer surfaces like microprocessors and power electronics devices.
This new polymer-based TIMs have been introduced in the chemical industry, which uses boron nitride nanosheet (BNNS) fillers in order to enhance thermal conductivity. BNNS is also known as white graphene which is a two-dimensional crystalline form of hexagonal boron nitride (h-BN). Its shape and geometry is similar to all of its carbon analog graphene but have different properties.
For the improvement of overall performance and lifespan of a system, thermal interfaces are generally used to provide effective heat management solutions. Greases, elastomeric pads, thermal tapes, and solders are the products of thermal interfaces that are available in the market. Criteria for material selection are mostly based on mechanical factors, electrical insulation, quality, thermal resistance, performance, electrical insulation and material compatibility.
Based on Products, the market is segmented into Greases and Adhesives, Elastomeric Pads, Tapes and films, Metal Based, Phase change materials and Others. Based on Applications, the market is segmented into Computers, Medical Devices, Automotive Electronics, Industrial Machinery, Telecom Equipment, Consumer Durables, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Honeywell International, Inc., Parker-Hannifin Corporation, Henkel AG & Company, KGaA, Shin-Etsu Chemical Co., Ltd., Indium Corporation, Fuji Polymer Industries Co., Ltd., Momentive Performance, Materials, Inc., Semikron International GmbH, and AIM Specialty Materials
Scope of the Study
Market Segmentation:
By Products
By Applications
By Country
Companies Profiled
Unique Offerings from the Publisher
The newly discovered class of thermal interface materials delivers ultralow thermal resistance for all the compact power electronics. The heat dissipated per unit area from the electronic devices increases as electronics get more compact and robust, and additional heat is generated by moving components of machinery that operate at higher speeds. Thermal interface materials allow the removal of heat that is produced from the operation of electronic, mechanical devices and electro-chemical devices. This new class of TIMs sinks the heat and increase thermal transfer efficiency by filling the gaps between thermal transfer surfaces like microprocessors and power electronics devices.
This new polymer-based TIMs have been introduced in the chemical industry, which uses boron nitride nanosheet (BNNS) fillers in order to enhance thermal conductivity. BNNS is also known as white graphene which is a two-dimensional crystalline form of hexagonal boron nitride (h-BN). Its shape and geometry is similar to all of its carbon analog graphene but have different properties.
For the improvement of overall performance and lifespan of a system, thermal interfaces are generally used to provide effective heat management solutions. Greases, elastomeric pads, thermal tapes, and solders are the products of thermal interfaces that are available in the market. Criteria for material selection are mostly based on mechanical factors, electrical insulation, quality, thermal resistance, performance, electrical insulation and material compatibility.
Based on Products, the market is segmented into Greases and Adhesives, Elastomeric Pads, Tapes and films, Metal Based, Phase change materials and Others. Based on Applications, the market is segmented into Computers, Medical Devices, Automotive Electronics, Industrial Machinery, Telecom Equipment, Consumer Durables, and Others. Based on countries, the market is segmented into Brazil, Argentina, UAE, Saudi Arabia, South Africa, Nigeria, and Rest of LAMEA.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include 3M Company, Honeywell International, Inc., Parker-Hannifin Corporation, Henkel AG & Company, KGaA, Shin-Etsu Chemical Co., Ltd., Indium Corporation, Fuji Polymer Industries Co., Ltd., Momentive Performance, Materials, Inc., Semikron International GmbH, and AIM Specialty Materials
Scope of the Study
Market Segmentation:
By Products
- Greases and Adhesives
- Elastomeric Pads
- Tapes and films
- Metal Based
- Phase change materials and
- Others
By Applications
- Computers
- Medical Devices
- Automotive Electronics
- Industrial Machinery
- Telecom Equipment
- Consumer Durables
- Others
By Country
- Brazil
- Argentina
- UAE
- Saudi Arabia
- South Africa
- Nigeria
- Rest of LAMEA
Companies Profiled
- 3M Company
- Honeywell International, Inc.
- Parker-Hannifin Corporation
- Henkel AG & Company, KGaA
- Shin-Etsu Chemical Co., Ltd.
- Indium Corporation
- Fuji Polymer Industries Co., Ltd.
- Momentive Performance Materials, Inc.
- Semikron International GmbH
- AIM Specialty Materials
Unique Offerings from the Publisher
- Exhaustive coverage
- Highest number of market tables and figures
- Subscription based model available
- Guaranteed best price
- Assured post sales research support with 10% customization free
Table of Contents
Chapter 1. Market Scope & Methodology
Chapter 2. Market Overview
Chapter 3. LAMEA Thermal Interface Materials Market by Products
Chapter 4. LAMEA Thermal Interface Materials Market by Applications
Chapter 5. LAMEA Thermal Interface Materials Market by Country
Chapter 6. Company Profiles
Companies Mentioned
- 3M Company
- Honeywell International, Inc.
- Parker-Hannifin Corporation
- Henkel AG & Company, KGaA
- Shin-Etsu Chemical Co., Ltd.
- Indium Corporation
- Fuji Polymer Industries Co., Ltd.
- Momentive Performance Materials, Inc.
- Semikron International GmbH
- AIM Specialty Materials
Methodology
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