Cloud EDA - Global Market Trajectory & Analytics

Description Table of
Contents Companies Mentioned

Global Cloud EDA Market to Reach US$9.1 Billion by the Year 2026

Electronic design automation (EDA) encompasses hardware, software and specific services to streamline the planning, implementation, design, validation and production of semiconductor chips or devices. EDA has been witnessing increasing acceptance among semiconductor chip or device makers owing to rising sophistication of these components, with some of the next-generation devices containing substantially large number of circuit elements. Cloud EDA paves the way for companies in reducing the time to market and in speeding up any innovation at maintained or lower operating costs. The advent of robust security measures for physical and technology resources, moreover, has created an environment for the semiconductor segment in which EDA cloud computing is as indispensable as a foundry is to the manufacturing of IC wafers today. As IC enterprises look more at leveraging more cloud capacities for ensuring more rapid turnaround times, particularly on cutting edge designs of process nodes, a clear comprehension of all cloud EDA options, costs and benefits can aid them in making decisions that best support their respective resources and needs.

Amid the COVID-19 crisis, the global market for Cloud EDA estimated at US$6.6 Billion in the year 2020, is projected to reach a revised size of US$9.1 Billion by 2026, growing at a CAGR of 5.6% over the analysis period. Semiconductor Intellectual Property (SIP), one of the segments analyzed in the report, is projected to grow at a 6.3% CAGR to reach US$3.5 Billion by the end of the analysis period. After a thorough analysis of the business implications of the pandemic and its induced economic crisis, growth in the Computer Aided Engineering (CAE) segment is readjusted to a revised 6.9% CAGR for the next 7-year period. This segment currently accounts for a 25.7% share of the global Cloud EDA market. Semiconductor IP (SIP) refers to reusable design aspects including chip layout, and cell among other components used in manufacturing advanced Integrated Circuits (IC). The demand for computer-aided engineering (CAE) software is being driven by increasing focus of companies to outsource manufacturing tasks to various emerging economies like China, India and Russia. The integrated software helps companies in dealing with various issues associated with product prototyping along with recall.

The U.S. Market is Estimated at $2 Billion in 2021, While China is Forecast to Reach $1.4 Billion by 2026

The Cloud EDA market in the U.S. is estimated at US$2 Billion in the year 2021. The country currently accounts for a 29.08% share in the global market. China, the world`s second largest economy, is forecast to reach an estimated market size of US$1.4 Billion in the year 2026 trailing a CAGR of 6.9% through the analysis period. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.6% and 5.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5% CAGR while Rest of European market (as defined in the study) will reach US$531.2 Million by the end of the analysis period.

IC Physical Design & Verification Segment to Reach $1.8 Billion by 2026

In the global IC Physical Design & Verification segment, USA, Canada, Japan, China and Europe will drive the 4.4% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.1 Billion in the year 2020 will reach a projected size of US$1.4 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$318.8 Million by the year 2026.

Select Competitors (Total 36 Featured) -

Agnisys, Inc. Aldec, Inc ANSYS, Inc Cadence Design Systems, Inc. MunEDA GmbH Synopsys, Inc. Zuken Inc.

Frequently Asked Questions about the Global Market for Cloud EDA

What is the estimated value of the Global Market for Cloud EDA?

The Global Market for Cloud EDA was estimated to be valued at $6.6 Billion in 2020.

What is the growth rate of the Global Market for Cloud EDA?

The growth rate of the Global Market for Cloud EDA is 5.5%, with an estimated value of $9.1 Billion by 2026.

What is the forecasted size of the Global Market for Cloud EDA?

The Global Market for Cloud EDA is estimated to be worth $9.1 Billion by 2026.

Who are the key companies in the Global Market for Cloud EDA?

Key companies in the Global Market for Cloud EDA include Agnisys, Inc. Aldec, Inc ANSYS, Inc Cadence Design Systems, Inc. MunEDA GmbH Synopsys, Inc. Zuken Inc..

Note: Product cover images may vary from those shown

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Cloud EDA - Global Key Competitors Percentage Market Share in 2022 (E)
Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
Moving to the Cloud is a Matter of Survival for Companies in the 21st Century
Cloud is a Matter of Survival, A Urgent Business Need for Businesses to Stay Afloat & Excel in Competitive Markets: Global Market for Cloud Computing Services (In US$ Billion) for Years 2021, 2023, 2025 and 2027
The Race Between the Virus & Vaccines Intensifies. Amidst this Chaotic Battle, Where is the World Economy Headed in 2021?
These are Times When Questions Abound & Answers Are Few
So How Fast Or Slow Are We Moving?
How & When Will the World Be Vaccinated? Global Number of Annual COVID-19 Vaccine Doses (In Million) for Years 2020 through 2025 by Geographic Region/Country
Split Scenarios Unfold: The Great Vaccine Divide Emerges
Vaccine Imbalances to Stretch the Pandemic Further into 2022: Global Percentage (%) of Population Administered With Vaccines by Region as of October 2021
Time is of Essence! What We Know So Far - “Vaccine Efficiency Against New Strains is Decreasing”
Progress on Vaccinations, Why Should Businesses Care?
With IMF’s Upward Revision of Global GDP Forecasts for 2021, Most Companies Are Bullish About an Economic Comeback Despite a Continuing Pandemic
A Strong Yet Exceedingly Patchy & Uncertain Recovery Shaped by New Variants Comes Into Play: World Economic Growth Projections (Real GDP, Annual % Change) for 2020 through 2022
Easing Unemployment Levels in 2021 Although Moderate Will Infuse Hope for Industries Reliant on Consumer Discretionary Incomes: Global Number of Unemployed People (In Million) for Years 2017, 2019, 2020, and 2022
Electronic Design Automation (EDA) & Cloud EDA: Definition, Importance & Benefits
Companies Move EDA Into the Cloud. Here’s Why
Recent Market Activity

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

The Storm Wrought by the Pandemic Changes Competitive Dynamics, Forcing Semiconductor Leaders to Weave New Strategies to Survive Post Pandemic Times
EDA & IP Are Two Sides of the Same Coin. Competitive Pressure to Secure IPs Push Up Willingness to Invest in Cloud EDA
IP Cores per SoC
The Race to Secure IP Increases Reliance on Innovative EDA Tools to Rapidly Design Chips, Especially Cloud EDA: Global Semiconductor (Silicon) Intellectual Property (SIP) (In US$ Million) for Years 2021, 2023, 2025 and 2027
Semiconductor Industry Comes Under Extreme Pressure to Outperform as Time-to-Market Challenges Worsens
Pushed to Innovate Semiconductor Companies Adopt Cloud Based EDA Tools
Cloud EPA to Tackle Challenges Arising from Growing Complexities in Chip Design
EDA in the Cloud Holds Key in Rapidly Innovating SoC Design
Accelerating Advanced Networking SoC Design with Cloud-Based Emulation
Robust Outlook for CAD, CAM and CAE to Bring Cheer to the Cloud EDA Market
With Adoption of Engineering Software Reaching Mainstream, Focus Now Shifts to Migration to the Cloud: Global Market for Engineering Software (CAD, CAM, CAE, AEC, & EDA) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
Advent of Autonomous Vehicles and Rising Demand for Connected Cars to Boost Need for Innovative Chip Design
Autonomous Cars & Vehicle Electronification Push Up the Need for Rapid Designing of Innovative Chips: Global Market for Autonomous Vehicles (In Units) for Years 2021, 2023, 2025 and 2027
Healthy Demand for PCBs Bodes Well for Market Growth
Faster Time-to-Market Need Pushes EDA for PCB Design into the Cloud: Global Opportunity for Printed Circuit Boards (PCBs) (In US$ Billion) for Years 2021, 2023, 2025 and 2027
Challenges to Cloud EDA & How They Can be Overcome

4. GLOBAL MARKET PERSPECTIVE

TABLE 1: World Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 2: World 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2021 & 2027
TABLE 3: World Recent Past, Current & Future Analysis for Semiconductor Intellectual Property (SIP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 4: World 7-Year Perspective for Semiconductor Intellectual Property (SIP) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 5: World Recent Past, Current & Future Analysis for Computer Aided Engineering (CAE) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 6: World 7-Year Perspective for Computer Aided Engineering (CAE) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 7: World Recent Past, Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 8: World 7-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 9: World Recent Past, Current & Future Analysis for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 10: World 7-Year Perspective for Printed Circuit Board (PCB) & Multi-Chip Module (MCM) by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 11: World Recent Past, Current & Future Analysis for Military / Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 12: World 7-Year Perspective for Military / Defense by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 13: World Recent Past, Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 14: World 7-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 15: World Recent Past, Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 16: World 7-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 17: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 18: World 7-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027
TABLE 19: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 20: World 7-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Revenues for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2021 & 2027

III. MARKET ANALYSIS

UNITED STATES

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2022 (E)

TABLE 21: USA Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 22: USA 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 23: USA Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 24: USA 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

CANADA

TABLE 25: Canada Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 26: Canada 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 27: Canada Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 28: Canada 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

JAPAN

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2022 (E)

TABLE 29: Japan Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 30: Japan 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 31: Japan Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 32: Japan 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

CHINA

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2022 (E)

TABLE 33: China Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 34: China 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 35: China Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 36: China 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

EUROPE

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2022 (E)

TABLE 37: Europe Recent Past, Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Revenues in US$ Million for Years 2020 through 2027 and % CAGR
TABLE 38: Europe 7-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Revenues for France, Germany, Italy, UK and Rest of Europe Markets for Years 2021 & 2027
TABLE 39: Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 40: Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 41: Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 42: Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

FRANCE

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2022 (E)

TABLE 43: France Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 44: France 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 45: France Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 46: France 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

GERMANY

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2022 (E)

TABLE 47: Germany Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 48: Germany 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 49: Germany Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 50: Germany 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

ITALY

TABLE 51: Italy Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 52: Italy 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 53: Italy Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 54: Italy 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

UNITED KINGDOM

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2022 (E)

TABLE 55: UK Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 56: UK 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 57: UK Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 58: UK 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

REST OF EUROPE

TABLE 59: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 60: Rest of Europe 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 61: Rest of Europe Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 62: Rest of Europe 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

ASIA-PACIFIC

Cloud EDA Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2022 (E)

TABLE 63: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 64: Asia-Pacific 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 65: Asia-Pacific Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 66: Asia-Pacific 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

REST OF WORLD

TABLE 67: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Product Segment - Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 68: Rest of World 7-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Revenues for Semiconductor Intellectual Property (SIP), Computer Aided Engineering (CAE), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-Chip Module (MCM) for the Years 2021 & 2027
TABLE 69: Rest of World Recent Past, Current & Future Analysis for Cloud EDA by Application - Military / Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Revenues in US$ Million for the Years 2020 through 2027 and % CAGR
TABLE 70: Rest of World 7-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Revenues for Military / Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2021 & 2027

IV. COMPETITION

Total Companies Profiled: 36

Note: Product cover images may vary from those shown

A selection of companies mentioned in this report includes:

Agnisys, Inc. Aldec, Inc ANSYS, Inc Cadence Design Systems, Inc. MunEDA GmbH Synopsys, Inc. Zuken Inc.

Note: Product cover images may vary from those shown

Global Cloud EDA Market to Reach US$9.1 Billion by the Year 2026

The U.S. Market is Estimated at $2 Billion in 2021, While China is Forecast to Reach $1.4 Billion by 2026

IC Physical Design & Verification Segment to Reach $1.8 Billion by 2026

Select Competitors (Total 36 Featured) -

What is the estimated value of the Global Market for Cloud EDA?

What is the growth rate of the Global Market for Cloud EDA?

What is the forecasted size of the Global Market for Cloud EDA?

Who are the key companies in the Global Market for Cloud EDA?

I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

III. MARKET ANALYSIS

UNITED STATES

CANADA

JAPAN

CHINA

EUROPE

FRANCE

GERMANY

ITALY

UNITED KINGDOM

REST OF EUROPE

ASIA-PACIFIC

REST OF WORLD

IV. COMPETITION

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