Cloud EDA - Global Market Trajectory & Analytics

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Global Cloud EDA Market to Reach $9 Billion by 2027

Amid the COVID-19 crisis, the global market for Cloud EDA estimated at US$6.3 Billion in the year 2020, is projected to reach a revised size of US$9 Billion by 2027, growing at a CAGR of 5.3% over the analysis period 2020-2027. CAE, one of the segments analyzed in the report, is projected to record a 6% CAGR and reach US$2.8 Billion by the end of the analysis period. After an early analysis of the business implications of the pandemic and its induced economic crisis, growth in the SIP (Semiconductor Intellectual Property) segment is readjusted to a revised 5.6% CAGR for the next 7-year period.

The U.S. Market is Estimated at $1.9 Billion, While China is Forecast to Grow at 5% CAGR

The Cloud EDA market in the U.S. is estimated at US$1.9 Billion in the year 2020. China, the world`s second largest economy, is forecast to reach a projected market size of US$1.6 Billion by the year 2027 trailing a CAGR of 5% over the analysis period 2020 to 2027. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 4.9% and 4.4% respectively over the 2020-2027 period. Within Europe, Germany is forecast to grow at approximately 4.9% CAGR.

IC Physical Design & Verification Segment to Record 4.5% CAGR

In the global IC Physical Design & Verification segment, USA, Canada, Japan, China and Europe will drive the 4.7% CAGR estimated for this segment. These regional markets accounting for a combined market size of US$1.1 Billion in the year 2020 will reach a projected size of US$1.5 Billion by the close of the analysis period. China will remain among the fastest growing in this cluster of regional markets. Led by countries such as Australia, India, and South Korea, the market in Asia-Pacific is forecast to reach US$1 Billion by the year 2027.

Select Competitors (Total 42 Featured):

Agnisys Inc.
Aldec, Inc.
ANSYS, Inc.
Cadence Design Systems, Inc.
JEDA Technologies, Inc.
Mentor Graphics Corporation
MunEDA GmbH
Synopsys, Inc.
Zuken

Note: Product cover images may vary from those shown

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I. METHODOLOGY

II. EXECUTIVE SUMMARY

1. MARKET OVERVIEW

Influencer Market Insights
World Market Trajectories
Impact of Covid-19 and a Looming Global Recession

2. FOCUS ON SELECT PLAYERS

3. MARKET TRENDS & DRIVERS

4. GLOBAL MARKET PERSPECTIVE

Table 1: World Current & Future Analysis for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 2: World Historic Review for Cloud EDA by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 3: World 15-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2012, 2018 & 2027
Table 4: World Current & Future Analysis for CAE by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 5: World Historic Review for CAE by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 6: World 15-Year Perspective for CAE by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 7: World Current & Future Analysis for SIP (Semiconductor Intellectual Property) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 8: World Historic Review for SIP (Semiconductor Intellectual Property) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 9: World 15-Year Perspective for SIP (Semiconductor Intellectual Property) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 10: World Current & Future Analysis for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 11: World Historic Review for IC Physical Design & Verification by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 12: World 15-Year Perspective for IC Physical Design & Verification by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 13: World Current & Future Analysis for Printed Circuit Board (PCB) & Multi-chip Module (MCM)) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 14: World Historic Review for Printed Circuit Board (PCB) & Multi-chip Module (MCM)) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 15: World 15-Year Perspective for Printed Circuit Board (PCB) & Multi-chip Module (MCM)) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 16: World Current & Future Analysis for Military/Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 17: World Historic Review for Military/Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 18: World 15-Year Perspective for Military/Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 19: World Current & Future Analysis for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 20: World Historic Review for Aerospace by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 21: World 15-Year Perspective for Aerospace by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 22: World Current & Future Analysis for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 23: World Historic Review for Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 24: World 15-Year Perspective for Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 25: World Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 26: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 27: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027
Table 28: World Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 29: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 30: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2012, 2018 & 2027

III. MARKET ANALYSIS

UNITED STATES
Table 31: USA Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 32: USA Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 33: USA 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 34: USA Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 35: USA Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 36: USA 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
CANADA
Table 37: Canada Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 38: Canada Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 39: Canada 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 40: Canada Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 41: Canada Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 42: Canada 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
JAPAN
Table 43: Japan Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 44: Japan Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 45: Japan 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 46: Japan Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 47: Japan Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 48: Japan 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
CHINA
Table 49: China Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 50: China Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 51: China 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 52: China Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 53: China Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 54: China 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
EUROPE
Table 55: Europe Current & Future Analysis for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2018 through 2027 and % CAGR
Table 56: Europe Historic Review for Cloud EDA by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 57: Europe 15-Year Perspective for Cloud EDA by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2012, 2018 & 2027
Table 58: Europe Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 59: Europe Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 60: Europe 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 61: Europe Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 62: Europe Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 63: Europe 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
FRANCE
Table 64: France Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 65: France Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 66: France 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 67: France Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 68: France Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 69: France 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
GERMANY
Table 70: Germany Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 71: Germany Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 72: Germany 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 73: Germany Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 74: Germany Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 75: Germany 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
ITALY
Table 76: Italy Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 77: Italy Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 78: Italy 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 79: Italy Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 80: Italy Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 81: Italy 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
UNITED KINGDOM
Table 82: UK Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 83: UK Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 84: UK 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 85: UK Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 86: UK Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 87: UK 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
REST OF EUROPE
Table 88: Rest of Europe Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 89: Rest of Europe Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 90: Rest of Europe 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 91: Rest of Europe Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 92: Rest of Europe Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 93: Rest of Europe 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
ASIA-PACIFIC
Table 94: Asia-Pacific Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 95: Asia-Pacific Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 96: Asia-Pacific 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 97: Asia-Pacific Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 98: Asia-Pacific Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 99: Asia-Pacific 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027
REST OF WORLD
Table 100: Rest of World Current & Future Analysis for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 101: Rest of World Historic Review for Cloud EDA by Product Segment - CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 102: Rest of World 15-Year Perspective for Cloud EDA by Product Segment - Percentage Breakdown of Value Sales for CAE, SIP (Semiconductor Intellectual Property), IC Physical Design & Verification and Printed Circuit Board (PCB) & Multi-chip Module (MCM)) for the Years 2012, 2018 & 2027
Table 103: Rest of World Current & Future Analysis for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications - Independent Analysis of Annual Sales in US$ Million for the Years 2018 through 2027 and % CAGR
Table 104: Rest of World Historic Review for Cloud EDA by Application - Military/Defense, Aerospace, Telecom, Automotive and Other Applications Markets - Independent Analysis of Annual Sales in US$ Million for Years 2012 through 2017 and % CAGR
Table 105: Rest of World 15-Year Perspective for Cloud EDA by Application - Percentage Breakdown of Value Sales for Military/Defense, Aerospace, Telecom, Automotive and Other Applications for the Years 2012, 2018 & 2027

IV. COMPETITION

Total Companies Profiled: 42

Note: Product cover images may vary from those shown

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