+353-1-416-8900REST OF WORLD
+44-20-3973-8888REST OF WORLD
1-917-300-0470EAST COAST U.S
1-800-526-8630U.S. (TOLL FREE)

Underfill Materials: Global Strategic Business Report

  • PDF Icon

    Report

  • 273 Pages
  • March 2024
  • Region: Global
  • Global Industry Analysts, Inc
  • ID: 5140746

Global Underfill Materials Market to Reach $581.5 Million by 2030

The global market for Underfill Materials estimated at US$339.7 Million in the year 2022, is projected to reach a revised size of US$581.5 Million by 2030, growing at a CAGR of 7% over the analysis period 2022-2030. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is projected to record 7.5% CAGR and reach US$346.5 Million by the end of the analysis period. Taking into account the ongoing post pandemic recovery, growth in the No Flow Underfill Material (NUF) segment is readjusted to a revised 6.4% CAGR for the next 8-year period.

The U.S. Market is Estimated at $102.6 Million, While China is Forecast to Grow at 6.4% CAGR

The Underfill Materials market in the U.S. is estimated at US$102.6 Million in the year 2022. China, the world's second largest economy, is forecast to reach a projected market size of US$100 Million by the year 2030 trailing a CAGR of 6.4% over the analysis period 2022 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 6.5% and 5.6% respectively over the 2022-2030 period. Within Europe, Germany is forecast to grow at approximately 5.6% CAGR.

Select Competitors (Total 42 Featured) -

  • Epoxy Technology, Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • NAMICS Corporation
  • Nordson Corporation

What's New?

  • Special coverage on Russia-Ukraine war; global inflation; easing of zero-Covid policy in China and its `bumpy` reopening; supply chain disruptions, global trade tensions; and risk of recession.
  • Global competitiveness and key competitor percentage market shares
  • Market presence across multiple geographies - Strong/Active/Niche/Trivial
  • Online interactive peer-to-peer collaborative bespoke updates
  • Access to digital archives and the publisher's Research Platform
  • Complimentary updates for one year

Table of Contents

I. METHODOLOGYII. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Underfill Materials - Global Key Competitors Percentage Market Share in 2022 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2022 (E)
  • Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS3. MARKET TRENDS & DRIVERS
4. GLOBAL MARKET PERSPECTIVE
  • Table 1: World Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 2: World Historic Review for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 3: World 16-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2023 & 2030
  • Table 4: World Recent Past, Current & Future Analysis for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 5: World Historic Review for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 6: World 16-Year Perspective for Capillary Underfill Material (CUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 7: World Recent Past, Current & Future Analysis for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 8: World Historic Review for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 9: World 16-Year Perspective for No Flow Underfill Material (NUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 10: World Recent Past, Current & Future Analysis for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 11: World Historic Review for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 12: World 16-Year Perspective for Molded Underfill Material (MUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 13: World Recent Past, Current & Future Analysis for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 14: World Historic Review for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 15: World 16-Year Perspective for Flip Chips by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 16: World Recent Past, Current & Future Analysis for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 17: World Historic Review for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 18: World 16-Year Perspective for Ball Grid Array (BGA) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 19: World Recent Past, Current & Future Analysis for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 20: World Historic Review for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 21: World 16-Year Perspective for Chip Scale Packaging (CSP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2023 & 2030
  • Table 22: World Underfill Materials Market Analysis of Annual Sales in US$ Thousand for Years 2014 through 2030
III. MARKET ANALYSIS
  • UNITED STATES
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2023 (E)
  • Table 23: USA Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 24: USA Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 25: USA 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 26: USA Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 27: USA Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 28: USA 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • CANADA
  • Table 29: Canada Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 30: Canada Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 31: Canada 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 32: Canada Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 33: Canada Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 34: Canada 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • JAPAN
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2023 (E)
  • Table 35: Japan Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 36: Japan Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 37: Japan 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 38: Japan Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 39: Japan Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 40: Japan 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • CHINA
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2023 (E)
  • Table 41: China Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 42: China Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 43: China 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 44: China Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 45: China Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 46: China 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • EUROPE
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2023 (E)
  • Table 47: Europe Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2022 through 2030 and % CAGR
  • Table 48: Europe Historic Review for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 49: Europe 16-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2023 & 2030
  • Table 50: Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 51: Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 52: Europe 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 53: Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 54: Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 55: Europe 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • FRANCE
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2023 (E)
  • Table 56: France Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 57: France Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 58: France 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 59: France Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 60: France Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 61: France 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • GERMANY
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2023 (E)
  • Table 62: Germany Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 63: Germany Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 64: Germany 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 65: Germany Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 66: Germany Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 67: Germany 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • ITALY
  • Table 68: Italy Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 69: Italy Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 70: Italy 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 71: Italy Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 72: Italy Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 73: Italy 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • UNITED KINGDOM
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2023 (E)
  • Table 74: UK Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 75: UK Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 76: UK 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 77: UK Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 78: UK Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 79: UK 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • REST OF EUROPE
  • Table 80: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 81: Rest of Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 82: Rest of Europe 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 83: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 84: Rest of Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 85: Rest of Europe 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • ASIA-PACIFIC
  • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2023 (E)
  • Table 86: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 87: Asia-Pacific Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 88: Asia-Pacific 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 89: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 90: Asia-Pacific Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 91: Asia-Pacific 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
  • REST OF WORLD
  • Table 92: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 93: Rest of World Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 94: Rest of World 16-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2014, 2023 & 2030
  • Table 95: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2022 through 2030 and % CAGR
  • Table 96: Rest of World Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2014 through 2021 and % CAGR
  • Table 97: Rest of World 16-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2014, 2023 & 2030
IV. COMPETITION

Companies Mentioned (Partial List)

A selection of companies mentioned in this report includes, but is not limited to:

  • Epoxy Technology, Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • NAMICS Corporation
  • Nordson Corporation

Table Information