An RF (Radio Frequency) module is a key component used to receive and transmit radio signals. The unique design and manufacturing processes of RF modules have resulted in an oligopolistic market. However, an increasing number of leading baseband processor vendors has made inroads into the RF market. This report analyzes the market strategies of the top three vendors: Qualcomm, Huawei, and Samsung and explores their recent developments and their patent portfolios.
Table of Contents
1. Development of the Global RF Market
1.2 Potential Threats to Traditional RF Vendors
2. Current RF Market Status and Leading Baseband IC Vendors Development
2.1 Market Development and Entry Motivation
2.1.1 Increase Sales with a Comprehensive Communications System Solutions
2.1.2 High Levels of RF Modularity to Enlarge Market Size
2.1.3 International Politics Forces Vendors to Expand Reach to the RF Market
2.2 Development of Leading Baseband IC Vendors
2.2.1 Qualcomm: Gains a Foothold with Early Entry
2.2.2 Huawei: US Ban Forces the Company to Focus on In-house Development
2.2.3 Samsung: Cuts into the Market from Base Stations
3. Leading Baseband IC Vendors’ Patent Portfolios
3.1 Distribution of Patents Published by Top Three Vendors
3.1.1 Samsung and Huawei Have Similar Deployment Strategies
3.1.2 Qualcomm Holds More PA Patents While Huawei Focuses on High-frequency Waveguide
3.1.3 Huawei has Highly Concentrated Patent Portfolios Compared to Qualcomm and Samsung
4. Author's Perspective
Appendix
List of Companies
List of Tables
Table 1. Milestones of Qualcomm, Huawei, and Samsung in RF Front-end Solutions
List of Figures
Figure 1. III-V Compound Semiconductor Industry Chain
Figure 2. Division of Work across Wireless Communications System Industry Chain
Figure 3. Integration of Front-end Modules
Figure 4. Number of Patens Published by Qualcomm, Huawei, and Samsung between 2017 and 2019
Figure 5. Distribution of Patents Published by Qualcomm, Huawei, and Samsung by Class
Samples
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Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amkor
- Apple
- ASE
- ASUS
- AWSC
- Broadcom
- Chengdu HiWafer Technology
- Cree Inc.
- Dynax Semiconductor
- Epcos
- GCS Holding
- Hisilicon
- Huawei
- II-VI Incorporated
- IntelliEPI
- IQE PLC
- LG
- LMOC
- MediaTek
- Mitsubishi
- Motorola
- Murata
- NXP
- Oppo
- Qorvo
- Qualcomm
- RF360
- RichWave
- Samsung
- Skyworks
- SPIL
- Sumitomo
- TDK
- Visual Photonics Epitaxy
- Wavetek
- Win Semiconductor
- Xiamen Sanan IC
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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